Patent US5869896A successfully refreshed from Google Patents.
US5869896A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged electronic module and integral sensor array
Assignee: International Business Machines Corp
•
Filing: 1998-02-26
•
Granted: 1999-02-09
•
Expires: 2018-02-26
Abstract
Abstract An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.
Inventors
- 👤 Robert Grover Baker
- 👤 Claude Louis Bertin
- 👤 Wayne John Howell
- 👤 Joseph Michael Mosley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:41
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/834; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
66 words
An electronic module comprising: a substrate having a cavity therein which defines a first supporting level of said substrate within said cavity; a processing module mechanically connected to said first supporting level, said processing module comprising a stack of bare chips; a sensor assembly disposed within said cavity and mechanically coupled to said substrate; and electrical connection means between said processing module and said sensor assembly.
Claim 2
Dependent Claim
66 words
An electronic module comprising: a substrate having a cavity therein which defines a first supporting level of said substrate within said cavity; a processing module mechanically connected to said first supporting level, said processing module comprising a stack of bare chips; a sensor assembly disposed within said cavity and mechanically coupled to said substrate; and electrical connection means between said processing module and said sensor assembly.
Claim 3
Dependent Claim
35 words
The electronic module of claim 1, wherein said substrate further includes a second support level defined by, and disposed within, said cavity, and wherein said sensor assembly is mechanically connected to said second support level.
Claim 4
Dependent Claim
49 words
The electronic module of claim 2, wherein said second support level comprises at least one ledge disposed within said cavity, said at least one ledge being above an uppermost level of said processing module, said sensor assembly being supported by, and mechanically connected to, said at least one ledge.
Claim 5
Dependent Claim
39 words
The electronic module of claim 2, wherein said sensor assembly comprises a sensor substrate, a sensor array and a logic IC chip, said sensor substrate being electrically and mechanically connected to said sensor array and said logic IC chip.
Claim 6
Dependent Claim
52 words
The electronic module of claim 4, wherein said sensor substrate has a first main surface and a second main surface, and wherein said logic IC chip is disposed on, and mechanically connected to, said first main surface, and said sensor array is disposed on, and mechanically coupled to, said second main surface.
Claim 7
Dependent Claim
41 words
The electronic module of claim 4, wherein said sensor substrate has two main surfaces, and wherein said logic IC chip and said sensor array are both disposed on, and mechanically connected to, a first main surface of said two main surfaces.
Claim 8
Dependent Claim
45 words
The electronic module of claim 2, wherein said substrate further includes a cover support level within said cavity and disposed above said sensor assembly, and wherein said electronic module further comprises a cover that is supported by, and mechanically connected to, said cover support level.
References Cited (Backward Citations)
US4403238A
Cited
US4660066A
Cited
US4761681A
Cited
US4654694A
Cited
US5051865A
Cited
US4706166A
Cited
US5016138A
Cited
US5021888A
Cited
US5055930A
Cited
JPH05110959A
Cited
WO1993011631A1
Cited
JPH05268535A
Cited
US5424920A
Cited
US5347428A
Cited
US5432729A
Cited
US5502667A
Cited
US5767564A
Cited
US5561593A
Cited
US5517057A
Cited
US5612570A
Cited
US5604377A
Cited
US5633530A
Cited
US5760478A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-08 | 2002-08-10 | 2003-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-08 | 2006-08-10 | 2007-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-08 | 2010-08-10 | 2011-02-09 | $7700.00 | Window Closed / Lapsed |