US5851135A
Expired / Lapsed
US
⏱️ 0.0 years remaining
System for real-time control of semiconductor wafer polishing
Assignee: Round Rock Research LLC
•
Filing: 1997-08-07
•
Granted: 1998-12-22
•
Expires: 2017-08-07
Abstract
Abstract A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.
Inventors
- 👤 Gurtej S. Sandhu
- 👤 Trung Tri Doan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:47
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/04; B24B37/07; B24B37/10; B24B37/105; B24B37/107; B23; B23Q; B23Q15/00; B23Q15/007; B23Q15/013; B23Q15/12; B24B13/00; B24B13/015; B24B37/005; B24B37/013; B24B37/015; B24B37/11; B24B37/12; B24B37/20; B24B37/205; B24B49/00; B24B49/003; B24B49/02; B24B49/04; B24B49/10; B24B49/12; B24B57/00; B24B57/02; G; G05; G05B; G05B19/00; G05B19/02; G05B19/18; G05B19/404; G05B2219/00; G05B2219/30; G05B2219/34; G05B2219/34403; G05B2219/37; G05B2219/37398; G05B2219/37602; G05B2219/45; G05B2219/45026; G05B2219/45199; G05B2219/45232; G05B2219/49; G05B2219/49052; G05B2219/49057
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
164 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a polishing head shaft, and a polishing head supported by the polishing head shaft for rotation relative to the polishing head shaft, the polishing head being configured to support a semiconductor wafer, and to hold a face of the semiconductor wafer in contact with the platen subassembly, the wafer polishing assembly further including a polishing head displacement mechanism supporting the polishing head shaft relative to the platen subassembly and configured to translate the polishing head shaft relative to the platen subassembly along a polishing path which is variable between a linear polishing path and a non-linear polishing path, to cause the polishing head to polish the wafer face; and a controller configured to adjust the polishing path during polishing of the wafer.
Claim 2
Independent Claim
164 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a polishing head shaft, and a polishing head supported by the polishing head shaft for rotation relative to the polishing head shaft, the polishing head being configured to support a semiconductor wafer, and to hold a face of the semiconductor wafer in contact with the platen subassembly, the wafer polishing assembly further including a polishing head displacement mechanism supporting the polishing head shaft relative to the platen subassembly and configured to translate the polishing head shaft relative to the platen subassembly along a polishing path which is variable between a linear polishing path and a non-linear polishing path, to cause the polishing head to polish the wafer face; and a controller configured to adjust the polishing path during polishing of the wafer.
Claim 3
Dependent Claim
63 words
A system in accordance with claim 1 wherein the wafer polishing assembly has a plurality of controllable operational parameters, including polishing path and at least one more controllable operational parameter, that affect the polishing rate and polishing uniformity, wherein the controller is operably coupled to the wafer polishing assembly for monitoring and managing in situ the operational parameters of the wafer polishing assembly.
Claim 4
Dependent Claim
139 words
A system in accordance with claim 1 wherein the wafer polishing assembly has a plurality of controllable operational parameters including polishing path and at least one more controllable operational parameter, that affect the polishing rate and polishing uniformity, wherein the controller is operably coupled to the wafer polishing assembly for monitoring and managing in situ the operational parameters of the wafer polishing assembly, wherein the system further comprises a processor operably coupled to the controller for determining desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, and wherein the controller adjusts in situ the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity during polishing of the wafer.
Claim 5
Dependent Claim
43 words
A system in accordance with claim 1 wherein the platen subassembly is rotatable about an axis and configured to rotate at a variable platen velocity, and wherein the controller is configured to adjust the velocity of the platen during polishing of the wafer.
Claim 6
Dependent Claim
44 words
A system in accordance with claim 1 wherein the polishing head is rotatable about an axis and configured to rotate at a variable wafer velocity, and wherein the controller is configured to adjust the velocity of the polishing head during polishing of the wafer.
Claim 7
Dependent Claim
44 words
A system in accordance with claim 1 wherein the polishing head is movable across the platen subassembly at an adjustable wafer movement rate, and wherein the controller is configured to adjust the rate of movement of the polishing head during polishing of the wafer.
Claim 8
Dependent Claim
84 words
A system in accordance with claim 1 and further comprising a processor coupled to the controller, a motor drivingly connected to the platen to cause rotation of the platen about an axis, and an endpoint detector including a current meter electrically connected to the motor and in communication with the processor, the current meter indicating to the processor amperage through the motor, the processor providing a signal indicating completion of processing of the wafer in response to a change in amperage through the motor.
Claim 9
Dependent Claim
39 words
A system in accordance with claim 1 and further comprising an endpoint detector including an acoustic wave transducer configured to be directed at the wafer, and an acoustic wave receiver mounted to receive acoustic waves reflected from the wafer.
Claim 10
Dependent Claim
24 words
A system in accordance with claim 1 and further comprising an endpoint detector including an infrared camera configured to be directed at the wafer.
Claim 11
Dependent Claim
23 words
A system in accordance with claim 1 and further comprising end point detection means for determining if polishing of the wafer is complete.
Claim 12
Dependent Claim
28 words
A system in accordance with claim 10 wherein the end point detection means comprises means for sensing a change in friction between the wafer and the polishing platen.
Claim 13
Dependent Claim
34 words
A system in accordance with claim 10 wherein the end point detection means comprises means for directing acoustic waves at the wafer during polishing, and means for receiving reflected acoustic waves from the wafer.
Claim 14
Dependent Claim
24 words
A system in accordance with claim 10 wherein the end point detection means comprises means for detecting temperatures of different areas of the wafer.
Claim 15
Independent Claim
322 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen rotatable about a first axis, a polishing head configured to support the semiconductor wafer for rotation about a second axis, and a polishing head displacement mechanism configured to move the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that affect the polishing rate and polishing uniformity; a motor drivingly connected to the platen and operative to cause rotation of the platen about the first axis; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; a plurality of pressure applicators supported by the polishing head and configured to act on the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and a detector coupled to the processor and configured to determine whether polishing of the wafer is complete, the detector including a current meter electrically connected to the motor and in communication with the processor, the current meter indicating to the processor a change in friction between the wafer and the polishing head by detecting a change in amperage through the motor.
Claim 16
Independent Claim
322 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen rotatable about a first axis, a polishing head configured to support the semiconductor wafer for rotation about a second axis, and a polishing head displacement mechanism configured to move the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that affect the polishing rate and polishing uniformity; a motor drivingly connected to the platen and operative to cause rotation of the platen about the first axis; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; a plurality of pressure applicators supported by the polishing head and configured to act on the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and a detector coupled to the processor and configured to determine whether polishing of the wafer is complete, the detector including a current meter electrically connected to the motor and in communication with the processor, the current meter indicating to the processor a change in friction between the wafer and the polishing head by detecting a change in amperage through the motor.
Claim 17
Independent Claim
174 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head configured to support a semiconductor wafer relative to the platen subassembly under an adjustable polishing force to polish the wafer face; a motor drivingly connected to the platen subassembly and operative to cause rotation of the platen subassembly about an axis; a controller configured to adjust the polishing force during polishing of the wafer; and a plurality of pressure applicators supported by the polishing head and disposed to alter the contour of the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and a current meter electrically connected to the motor, the current meter indicating a change in friction between the wafer and the polishing head by detecting a change in amperage through the motor.
Claim 18
Independent Claim
174 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head configured to support a semiconductor wafer relative to the platen subassembly under an adjustable polishing force to polish the wafer face; a motor drivingly connected to the platen subassembly and operative to cause rotation of the platen subassembly about an axis; a controller configured to adjust the polishing force during polishing of the wafer; and a plurality of pressure applicators supported by the polishing head and disposed to alter the contour of the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and a current meter electrically connected to the motor, the current meter indicating a change in friction between the wafer and the polishing head by detecting a change in amperage through the motor.
Claim 19
Independent Claim
268 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen rotatable about a first axis, a polishing head configured to support the semiconductor wafer for rotation about a second axis, and a polishing head displacement mechanism configured to move the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that affect the polishing rate and polishing uniformity; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; a plurality of pressure applicators supported by the polishing head and configured to act on the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and an acoustic wave transducer configured to direct acoustic waves at the wafer, and an acoustic wave receiver mounted to receive acoustic waves reflected from the wafer.
Claim 20
Independent Claim
268 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen rotatable about a first axis, a polishing head configured to support the semiconductor wafer for rotation about a second axis, and a polishing head displacement mechanism configured to move the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that affect the polishing rate and polishing uniformity; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; a plurality of pressure applicators supported by the polishing head and configured to act on the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and an acoustic wave transducer configured to direct acoustic waves at the wafer, and an acoustic wave receiver mounted to receive acoustic waves reflected from the wafer.
Claim 21
Independent Claim
147 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head configured to support a semiconductor wafer relative to the platen subassembly under an adjustable polishing force to polish the wafer face; a controller configured to adjust the polishing force during polishing of the wafer; a plurality of pressure applicators supported by the polishing head and disposed to alter the contour of the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and an acoustic wave transducer configured to direct acoustic waves at the wafer, and an acoustic wave receiver mounted to receive acoustic waves reflected from the wafer.
Claim 22
Independent Claim
147 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head configured to support a semiconductor wafer relative to the platen subassembly under an adjustable polishing force to polish the wafer face; a controller configured to adjust the polishing force during polishing of the wafer; a plurality of pressure applicators supported by the polishing head and disposed to alter the contour of the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and an acoustic wave transducer configured to direct acoustic waves at the wafer, and an acoustic wave receiver mounted to receive acoustic waves reflected from the wafer.
Claim 23
Independent Claim
269 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen rotatable about a first axis, a polishing head configured to support the semiconductor wafer for rotation about a second axis, and a polishing head displacement mechanism configured to move the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that affect the polishing rate and polishing uniformity; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; a plurality of pressure applicators supported by the polishing head and configured to act on the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and a detector coupled to the processor and configured to determine whether polishing of the wafer is complete, the detector including an infrared camera directed at the wafer.
Claim 24
Independent Claim
269 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen rotatable about a first axis, a polishing head configured to support the semiconductor wafer for rotation about a second axis, and a polishing head displacement mechanism configured to move the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that affect the polishing rate and polishing uniformity; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; a plurality of pressure applicators supported by the polishing head and configured to act on the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and a detector coupled to the processor and configured to determine whether polishing of the wafer is complete, the detector including an infrared camera directed at the wafer.
Claim 25
Independent Claim
131 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head configured to support a semiconductor wafer relative to the platen subassembly under an adjustable polishing force to polish the wafer face; a controller configured to adjust the polishing force during polishing of the wafer; a plurality of pressure applicators supported by the polishing head and disposed to alter the contour of the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and an infrared camera configured to be directed at the wafer.
Claim 26
Independent Claim
131 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head configured to support a semiconductor wafer relative to the platen subassembly under an adjustable polishing force to polish the wafer face; a controller configured to adjust the polishing force during polishing of the wafer; a plurality of pressure applicators supported by the polishing head and disposed to alter the contour of the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer; and an infrared camera configured to be directed at the wafer.
References Cited (Backward Citations)
US3156073A
Cited
US3603042A
Cited
US3564776A
Cited
US3693301A
Cited
US3841031A
Cited
US3691694A
Cited
US4050954A
Cited
US4083272A
Cited
US4193226A
Cited
US4365301A
Cited
US4450652A
Cited
US4513538A
Cited
JPS61164773A
Cited
JPS61188071A
Cited
JPS61244460A
Cited
JPS61265262A
Cited
US5099614A
Cited
US4850152A
Cited
US4811522A
Cited
JPS63256342A
Cited
US4930262A
Cited
US4793895A
Cited
US4912883A
Cited
US5113622A
Cited
US4940507A
Cited
JPH03121773A
Cited
JPH03142929A
Cited
US5104828A
Cited
US5127196A
Cited
US5157876A
Cited
US5081421A
Cited
US5085015A
Cited
US5081796A
Cited
US5205077A
Cited
US5036015A
Cited
JPH04217456A
Cited
US5069002A
Cited
JPH0569311A
Cited
US5240552A
Cited
US5196353A
Cited
US5308438A
Cited
US5245794A
Cited
US5234867A
Cited
JPH0639704A
Cited
US5232875A
Cited
US5433650A
Cited
US5433651A
Cited
US5413941A
Cited
US5549511A
Cited
US5597442A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-21 | 2002-06-22 | 2002-12-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-21 | 2006-06-22 | 2006-12-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-21 | 2010-06-22 | 2010-12-22 | $7700.00 | Window Closed / Lapsed |