US5832598A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making microwave circuit package
Assignee: Microsubstrates Corp
•
Filing: 1996-11-01
•
Granted: 1998-11-10
•
Expires: 2016-11-01
Abstract
Abstract A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit board. Space savings is provided by small components and the leadless design of the package. Taking the place of leads is a ball grid array and RF ports. An unlimited number of layout designs are possible within an s! matrix close to ##EQU1## within the operating frequency band of the package, for any pair of signal transmission ports.
Inventors
- 👤 Norman L. Greenman
- 👤 Jorge M. Hernandez
- 👤 M. P. Ramachandra Panicker
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:48
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0243; H10W42/00; H10W42/20; H10W44/00; H10W44/20; H05K1/0216; H05K1/0218; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09618; H05K2201/09654; H05K2201/09809; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/10954; H05K2201/10969; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H10W44/203; H10W44/216; H10W44/219; H10W72/00; H10W72/01; H10W72/0198; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
90 words
A method for producing a microwave circuit package comprising the steps of: a) forming a discrete substrate unit by prefiring a substrate bulk material; b) preparing connective elements for the substrate to connect the substrate to a PC board; c) electrically attaching said connective elements to a first surface of the substrate; d) electrically attaching a microwave circuit to a second surface of the substrate; and e) attaching a cover to said substrate around and over said microwave circuit to encapsulate said microwave circuit between said cover and said substrate.
Claim 2
Independent Claim
90 words
A method for producing a microwave circuit package comprising the steps of: a) forming a discrete substrate unit by prefiring a substrate bulk material; b) preparing connective elements for the substrate to connect the substrate to a PC board; c) electrically attaching said connective elements to a first surface of the substrate; d) electrically attaching a microwave circuit to a second surface of the substrate; and e) attaching a cover to said substrate around and over said microwave circuit to encapsulate said microwave circuit between said cover and said substrate.
Claim 3
Dependent Claim
78 words
A method for producing a microwave circuit package as claimed in claim 1 wherein said forming further includes: a) drilling said material for via holes; b) filling said via holes with a conductive material; c) sintering said substrate material with filled vias; d) screening both sides of said material with a conductive material; e) sintering and removing excess conductive material; f) thin metalize and pattern said substrate; and g) dicing said bulk material into individual discrete substrate unit.
Claim 4
Dependent Claim
19 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said substrate material is ceramic.
Claim 5
Dependent Claim
29 words
A method for producing a microwave circuit package as claimed in claim 3 wherein said ceramic is selected from the group consisting of alumina, aluminum nitride and glass ceramic.
Claim 6
Dependent Claim
23 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said drilling step is carried out with a laser.
Claim 7
Dependent Claim
48 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said filling step comprises: a) preparing a via fill composition; and b) applying said composition into the via holes until a solid conductive structure is present within an entire length of the via holes.
Claim 8
Dependent Claim
18 words
A method for producing a microwave circuit package as claimed in claim 6 wherein said composition includes tungsten.
Claim 9
Dependent Claim
18 words
A method for producing a microwave circuit package as claimed in claim 6 wherein said composition includes copper.
Claim 10
Dependent Claim
23 words
A method for producing a microwave circuit package as claimed in claim 6 wherein said composition includes a mixture of tungsten and copper.
Claim 11
Dependent Claim
25 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said step of screening is carried out with a copper ink.
Claim 12
Dependent Claim
31 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said step of thin metalizing is carried out by coating each surface of said substrate with titanium.
Claim 13
Dependent Claim
31 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said step of thin metalizing is carried out by coating each surface of said substrate with nickel.
Claim 14
Dependent Claim
36 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said step of thin metalizing is carried out by coating each surface of said substrate with a bilayer of titanium and nickel.
Claim 15
Independent Claim
27 words
A method for producing a microwave circuit package as claimed in claim a 2 wherein said thin film metalizing is effected by low temperature arc vapor deposition.
Claim 16
Dependent Claim
23 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said thin film metalizing is effected by electroless plating.
Claim 17
Independent Claim
23 words
A method for producing a microwave circuit package as claimed in clam 2 wherein said thin film metalizing is effected by magnetron sputtering.
Claim 18
Dependent Claim
25 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said thin film metalizing is effected by straight physical vapor deposition.
Claim 19
Dependent Claim
24 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said thin film metalizing is effected by enhanced Ion plating.
Claim 20
Dependent Claim
24 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said thin film metalizing is effected by chemical vapor deposition.
Claim 21
Dependent Claim
20 words
A method for producing a microwave circuit package as claimed in claim 1 wherein said substrate is thick film metalized.
Claim 22
Dependent Claim
19 words
A method for producing a microwave circuit package as claimed in claim 1 wherein said substrate is screen printed.
Claim 23
Dependent Claim
31 words
A method for producing a microwave circuit package as claimed in claim 2 wherein said step of dicing employs a laser to cut the bulk material into individual discrete substrate units.
Claim 24
Dependent Claim
39 words
A method for producing a microwave circuit package as claimed in claim 1 wherein the step of preparing connective elements further includes the step of creating a plurality of elements having a metallic base structure and a conductive plating.
Claim 25
Dependent Claim
20 words
A method for producing a microwave circuit package as claimed in claim 23 wherein said base structure is a ball.
Claim 26
Dependent Claim
20 words
A method for producing a microwave circuit package as claimed in claim 23 wherein said base structure is a column.
Claim 27
Dependent Claim
37 words
A method for producing a microwave circuit package as claimed in claim 1 wherein said step of electrically attaching said connective elements includes a process selected from the group consisting of brazing, soldering and adhering with adhesive.
Claim 28
Dependent Claim
62 words
A method for producing a microwave circuit package as claimed in claim 1 wherein the step of electrically attaching a microwave circuit includes the further steps of soldering or brazing a plurality of leads to the device and then soldering or brazing the plurality of leads, at an opposite end from the end brazed or soldered to the circuit, to the substrate.
Claim 29
Dependent Claim
55 words
A method for producing a microwave circuit package as claimed in claim 1 wherein the step of electrically attaching the microwave circuit to the substrate includes providing conductive bumps on a surface of the device nearest the substrate, said conductive bumps providing electrical contact between the device and a plurality of traces on the substrate.
Claim 30
Dependent Claim
55 words
A method for producing a microwave circuit package as claimed in claim 1 wherein the step of electrically attaching the microwave circuit to the substrate includes providing conductive bumps on a surface of the substrate nearest the device, said conductive bumps providing electrical contact between the device and a plurality of traces on the substrate.
Claim 31
Dependent Claim
39 words
A method for producing a microwave circuit package as claimed in claim 1 wherein the step of attaching a cover to said substrate is by utilizing a process selected from the group consisting of brazing, welding and adhesive bonding.
Claim 32
Dependent Claim
32 words
A method for producing a microwave circuit package as claimed in claim 1 wherein said method further includes the step of conductively plating said cover on at least an interior surface thereof.
Claim 33
Dependent Claim
33 words
A method for producing a microwave circuit package as claimed in claim 31 wherein said conductive plating is selected from the group consisting of copper, gold, silver, nickel, titanium and combinations of these.
Claim 34
Dependent Claim
25 words
A method for producing a microwave circuit package as claimed in claim 31 wherein plating said cover is effected by low temperature arc vapor deposition.
Claim 35
Dependent Claim
21 words
A method for producing a microwave circuit package as claimed in claim 31 wherein plating said cover is by electroless plating.
Claim 36
Dependent Claim
21 words
A method for producing a microwave circuit package as claimed in claim 31 wherein plating said cover is by magnetron sputtering.
Claim 37
Dependent Claim
23 words
A method for producing a microwave circuit package as claimed in claim 31 wherein plating said cover is by straight physical vapor deposition.
Claim 38
Independent Claim
21 words
A method for producing a microwave circuit package as claimed in claim wherein plating said cover is by enhanced ion plating.
Claim 39
Dependent Claim
22 words
A method for producing a microwave circuit package as claimed in claim 31 wherein plating said cover is by chemical vapor deposition.
References Cited (Backward Citations)
US3663868A
Cited
JPS55166941A
Cited
US4276558A
Cited
FR2507409A1
Cited
JPS5999745A
Cited
US4875087A
Cited
US5014115A
Cited
EP0331289A2
Cited
US5023624A
Cited
DE3934224A1
Cited
US5202648A
Cited
US5422615A
Cited
US5450046A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-09 | 2002-05-11 | 2002-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-09 | 2006-05-11 | 2006-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-09 | 2010-05-11 | 2010-11-10 | $7700.00 | Window Closed / Lapsed |