US5450046A — Composite microwave circuit module assembly and i…

Claim 1

Independent Claim 214 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by radio frequency wiring layers, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure; a wiring layer provided on said radio frequency wiring layers, said wiring layer accommodating patterns including a power source pattern for a microwave circuit and a wiring pattern for control signals, said wiring layer being independent from said radio frequency wiring layers; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency signal circuit being shielded by said via-holes; and an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member.

Claim 2

Dependent Claim 214 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by radio frequency wiring layers, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure; a wiring layer provided on said radio frequency wiring layers, said wiring layer accommodating patterns including a power source pattern for a microwave circuit and a wiring pattern for control signals, said wiring layer being independent from said radio frequency wiring layers; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency signal circuit being shielded by said via-holes; and an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member.

Claim 3

Dependent Claim 57 words

A composite microwave circuit module assembly according to claim 1, wherein said element mounting cavity has an element-mounting conductor land on said intermediate layer, said element-mounting conductor land being connected to said lower ground surface by a plurality of thermal via-holes filled with metal, to reduce thermal resistance and to enhance heat conduction to said lower layer.

Claim 4

Dependent Claim 49 words

A composite microwave circuit module assembly according to claim 1, further comprising a thin dielectric film formed in said intermediate layer, said thin dielectric film having on its two opposite sides conductive patterns to form a capacitive coupling thereby forming a transmission line capable of blocking a direct-current component.

Claim 5

Dependent Claim 30 words

A composite microwave circuit module assembly according to claim 1, further comprising a metal base plate which is welded to said dielectric substrate to enhance heat spread and mechanical strength.

Claim 6

Dependent Claim 46 words

A composite microwave circuit module assembly according to claim 1, further comprising a connection terminal coupled to said radio frequency signal circuit and disposed in a surface portion of said dielectric substrate without projecting from a surface thereof and allowing external electrical connection thereat from outside.

Claim 7

Dependent Claim 247 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; and an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member, said active circuit element including a voltage controlled oscillator, an amplifier, a pre-scaler, a mixer, a variable attenuator, a power amplifier and a detector formed by a microwave monolithic integrated circuit, an integrated circuit, at least one of a transistor and a diode, and said passive circuit element including a directional coupler, a band-pass filter and a low-pass filter formed by at least one of a strip line, a microstrip line and a coplanar line.

Claim 8

Dependent Claim 247 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; and an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member, said active circuit element including a voltage controlled oscillator, an amplifier, a pre-scaler, a mixer, a variable attenuator, a power amplifier and a detector formed by a microwave monolithic integrated circuit, an integrated circuit, at least one of a transistor and a diode, and said passive circuit element including a directional coupler, a band-pass filter and a low-pass filter formed by at least one of a strip line, a microstrip line and a coplanar line.

Claim 9

Dependent Claim 312 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as form an integral structure; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member, said element mounting cavity having an element mounting conductor land on said intermediate layer, said element mounting conductor land being connected to said lower ground surface by a plurality of thermal via-holes filled with metal, to reduce thermal resistance and to enhance heat conduction to said lower layer; and a plurality of conductive lands formed of conductive layers between said element mounting conductor land and said lower ground surface, said conductive lands being alternatively arranged as capacitor lands and grounds lands, said capacitor lands being connected together and said ground lands and said lower ground surface being connected together, respectively, via a plurality of thermal via-holes filled with metal to form a laminate capacitor which serves as a by-pass capacitor for an element mounted on said element mounting conductor land and which serves to disperse heat laterally and to reduce thermal resistance.

Claim 10

Dependent Claim 312 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as form an integral structure; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member, said element mounting cavity having an element mounting conductor land on said intermediate layer, said element mounting conductor land being connected to said lower ground surface by a plurality of thermal via-holes filled with metal, to reduce thermal resistance and to enhance heat conduction to said lower layer; and a plurality of conductive lands formed of conductive layers between said element mounting conductor land and said lower ground surface, said conductive lands being alternatively arranged as capacitor lands and grounds lands, said capacitor lands being connected together and said ground lands and said lower ground surface being connected together, respectively, via a plurality of thermal via-holes filled with metal to form a laminate capacitor which serves as a by-pass capacitor for an element mounted on said element mounting conductor land and which serves to disperse heat laterally and to reduce thermal resistance.

Claim 11

Dependent Claim 36 words

A composite microwave circuit module assembly according to claim 7, wherein each of said thermal via-holes is located right beneath a local heat generation spot of said active circuit element mounted on said element-mounting conductor land.

Claim 12

Dependent Claim 237 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member; and a wiring layer on said upper layer with a dielectric layer being interposed therebetween and a conductor land located at a portion where said wiring layer is connected to said radio frequency signal circuit in said intermediate layer, said conductor land and said upper ground surface right beneath said conductor land forming a capacitor to block a radio frequency signal leakage from said intermediate layer.

Claim 13

Dependent Claim 237 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member; and a wiring layer on said upper layer with a dielectric layer being interposed therebetween and a conductor land located at a portion where said wiring layer is connected to said radio frequency signal circuit in said intermediate layer, said conductor land and said upper ground surface right beneath said conductor land forming a capacitor to block a radio frequency signal leakage from said intermediate layer.

Claim 14

Dependent Claim 195 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure, each of said lower, intermediate and upper layers being provided with distributed small cavities with dielectric in each of said layers being removed; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; and an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member.

Claim 15

Dependent Claim 195 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure, each of said lower, intermediate and upper layers being provided with distributed small cavities with dielectric in each of said layers being removed; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; and an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member.

Claim 16

Dependent Claim 240 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member; a connection terminal coupled to said radio frequency signal circuit and disposed in a surface portion of said dielectric substrate without projecting from a surface thereof and allowing external electrical connection thereat from outside; and a microwave circuit connection structure for connecting said connection terminal to a terminal of other external circuitry, said microwave connection structure having therein a contact member which is resiliently urged toward said connection terminal.

Claim 17

Dependent Claim 240 words

A composite microwave circuit module assembly comprising: a dielectric substrate formed by lamination of a plurality of layers comprising a lower layer, an intermediate layer and an upper layer, said lower layer and said upper layer including a lower ground surface and an upper ground surface, respectively, and said intermediate layer including a radio frequency signal circuit for radio frequency signal transmission, formed by at least one conductive layer, said radio frequency signal circuit including an active circuit element and a passive circuit element electrically connected to each other so as to form an integral structure; a number of via-holes arranged along said radio frequency signal circuit and filled with metal to short-circuit said upper ground surface and said lower ground surface, said radio frequency circuit being shielded by said via-holes; an element mounting cavity disposed on said intermediate layer with a portion of dielectric above said intermediate layer being removed, and within which said active circuit element is mounted, said element mounting cavity being covered by a conductor plate member; a connection terminal coupled to said radio frequency signal circuit and disposed in a surface portion of said dielectric substrate without projecting from a surface thereof and allowing external electrical connection thereat from outside; and a microwave circuit connection structure for connecting said connection terminal to a terminal of other external circuitry, said microwave connection structure having therein a contact member which is resiliently urged toward said connection terminal.

Claim 18

Dependent Claim 26 words

A composite microwave circuit module assembly according to claim 10, wherein said small cavities are shifted in position for each of said layers to avoid overlap.

Claim 19

Dependent Claim 29 words

A composite microwave circuit module assembly according to claim 11, wherein said contact member comprises a piston-like conductor pin urged to said connection terminal by a leaf spring conductor.

Claim 20

Dependent Claim 25 words

A composite microwave circuit module assembly according to claim 13, wherein said leaf spring conductor and said contact member are accommodated in a shield case.

Claim 21

Dependent Claim 29 words

A composite microwave circuit module assembly according to claim 11, wherein said contact member comprises outer and inner conductor sleeves which are telescoped with a spring member enclosed therein.

Claim 22

Dependent Claim 26 words

A composite microwave circuit module assembly according to claim 15, wherein each of said outer conductor sleeves has a plurality of slit portions at its periphery.

Claim 23

Dependent Claim 41 words

A composite microwave circuit module assembly according to claim 11, wherein said contact member is constituted by a plate spring which integrally forms both the contact member and a conductor spring member urging said the contact member toward said connection terminal.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1998-09-11	1999-03-13	1999-09-12	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2002-09-11	2003-03-13	2003-09-12	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2006-09-11	2007-03-13	2007-09-12	$7700.00	Window Closed / Lapsed

Composite microwave circuit module assembly and its connection structure

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