US5045820A
Expired / Lapsed
US
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Three-dimensional microwave circuit carrier and integral waveguide coupler
Assignee: Motorola Solutions Inc
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Filing: 1990-12-10
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Granted: 1991-09-03
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Expires: 2010-12-10
Abstract
Abstract A non-hermetic, three-dimensional, microwave semiconductor device carrier with integral waveguide couplers is disclosed. A molded plastic substrate having a suitable dielectric constant and varying thicknesses comprises plated conductors and locations for receiving GaAs MMIC's. MMIC's are mounted to a metal backplate and die bonded to the plated conductors. The waveguide couplers are integrally molded as part of the carrier substrate, and comprise plated through cylindrical members. Signals from a waveguide cavity are coupled to the MMIC's by inserting the waveguide couplers into a waveguide port. The carrier and integral waveguide coupler together with a plated molded cover forms a non-hermetic package providing pseudo-shielding cavities about the resident multiple semiconductor GaAs die. Transmission line impedance control is enhanced varying the substrate thickness on a per conductor basis. Frequency of operation exceeds 12 gigahertz.
Inventors
- 👤 John L. Leicht
- 👤 Hugh R. Malone
- 👤 Douglas J. Mathews
- 👤 James E. Mitzlaff
- 👤 Scott D. Munier
- 👤 Michele G. Oehlerking
- 👤 Vernon R. Scott
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 09:55
CPC Classifications
H; H01; H01P; H01P5/00; H01P5/08; H01P5/10; H01P5/107; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/024; H05K1/11; H05K1/119; H05K1/0284; H05K1/18; H05K1/182; H05K2201/00; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K2201/09; H05K2201/09009; H05K2201/09045; H05K2201/09118; H05K2201/09818; H05K2201/0999; H05K2201/10; H05K2201/10227; H05K2201/10371; H05K3/00; H05K3/40; H05K3/42; H10; H10W; H10W44/00; H10W44/20; H10W44/203; H10W44/216; H10W44/219; H10W44/251; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
82 words
A microwave circuit carrier, comprising: (a) substrate means located in a first plane for receiving at least one electronic device which processes microwave signals; and (b) waveguide coupler means integrally molded with the substrate means for coupling microwave signals between the at least one electronic device and a waveguide, the waveguide having a wall located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane.
Claim 2
Dependent Claim
82 words
A microwave circuit carrier, comprising: (a) substrate means located in a first plane for receiving at least one electronic device which processes microwave signals; and (b) waveguide coupler means integrally molded with the substrate means for coupling microwave signals between the at least one electronic device and a waveguide, the waveguide having a wall located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane.
Claim 3
Dependent Claim
39 words
The microwave circuit carrier of claim 1 wherein the waveguide coupler means comprises: (a) a projecting means for projecting into the waveguide; and (b) a conductor, disposed on a surface of the substrate means, coupled to the projecting means.
Claim 4
Dependent Claim
32 words
The microwave circuit carrier of claim 2 wherein the projecting means comprises a plated through hole whereby microwave energy can be coupled between the at least one electronic device and the waveguide.
Claim 5
Dependent Claim
15 words
The microwave circuit carrier of claim 1 wherein the substrate means comprises dielectric composite material.
Claim 6
Dependent Claim
23 words
The microwave circuit carrier of claim 4 wherein the dielectric composite material comprises at least one of the following materials: ceramics and polymers.
Claim 7
Dependent Claim
31 words
The microwave circuit carrier of claim 1 wherein the waveguide coupler means comprises impedance matching means for varying the impedance characteristic between the at least one electronic device and the waveguide.
Claim 8
Dependent Claim
17 words
The microwave circuit carrier of claim 6 wherein the waveguide coupler means comprises a dielectric composite material.
Claim 9
Dependent Claim
23 words
The microwave circuit carrier of claim 7 wherein the dielectric composite material comprises at least one of the following materials: ceramics and polymers.
Claim 10
Dependent Claim
20 words
The microwave circuit carrier of claim 7 wherein the varied impedance characteristic is the thickness of the dielectric composite material.
Claim 11
Dependent Claim
39 words
The microwave circuit carrier of claim 2 wherein the substrate comprises another surface with a conductor disposed thereon arranged such that the two surface conductors are on substantially opposite surfaces of the substrate means thereby forming a transmission line.
Claim 12
Dependent Claim
124 words
A microwave circuit carrier, comprising: (a) a backplate located in a first plane, the first plane further comprising a wall of a waveguide; (b) a first substrate coupled to the backplate, the first substrate being located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane, comprising (i) means for receiving at least one electronic device which processes microwave signals; and (ii) waveguide coupler means integrally molded with the means for receiving for coupling microwave signals between the at least one electronic device and the waveguide; and (c) a second substrate coupled to the first substrate such that a cavity is provided about the means for receiving.
Claim 13
Dependent Claim
124 words
A microwave circuit carrier, comprising: (a) a backplate located in a first plane, the first plane further comprising a wall of a waveguide; (b) a first substrate coupled to the backplate, the first substrate being located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane, comprising (i) means for receiving at least one electronic device which processes microwave signals; and (ii) waveguide coupler means integrally molded with the means for receiving for coupling microwave signals between the at least one electronic device and the waveguide; and (c) a second substrate coupled to the first substrate such that a cavity is provided about the means for receiving.
Claim 14
Dependent Claim
39 words
The microwave circuit carrier of claim 11 wherein the waveguide coupler means comprises: (a) a projecting means for projecting into the waveguide; and (b) a conductor, disposed on a surface of the first substrate, coupled to the projecting means.
Claim 15
Dependent Claim
32 words
The microwave circuit carrier of claim 12 wherein the projecting means comprises a plated through hole whereby microwave energy can be coupled between the at least one electronic device and the waveguide.
Claim 16
Dependent Claim
17 words
The microwave circuit carrier of claim 11 wherein the first and second substrate comprise dielectric composite material.
Claim 17
Dependent Claim
23 words
The microwave circuit carrier of claim 14 wherein the dielectric composite material comprises at least one of the following materials: ceramics and polymers.
Claim 18
Dependent Claim
31 words
The microwave circuit carrier of claim 11 wherein the waveguide coupler means comprises impedance matching means for varying the impedance characteristic between the at least one electronic device and the waveguide.
Claim 19
Dependent Claim
17 words
The microwave circuit carrier of claim 16 wherein the waveguide coupler means comprises a dielectric composite material.
Claim 20
Dependent Claim
23 words
The microwave circuit carrier of claim 17 wherein the dielectric composite material comprises at least one of the following materials: ceramics and polymers.
Claim 21
Dependent Claim
20 words
The microwave circuit carrier of claim 17 wherein the varied impedance characteristic is the thickness of the dielectric composite material.
Claim 22
Dependent Claim
40 words
The microwave circuit carrier of claim 12 wherein the first substrate comprises another surface with a conductor disposed thereon arranged such that the two surface conductors are on substantially opposite surfaces of the first substrate thereby forming a transmission line.
Claim 23
Dependent Claim
47 words
The microwave circuit carrier of claim 11 wherein: (a) the first substrate comprises a surface with a conductor disposed thereon; and (b) the second substrate comprises a surface with a conductor disposed thereon whereby a substantial electromagnetic energy shielding cavity is provided about the means for receiving.
Claim 24
Dependent Claim
13 words
The microwave circuit module of claim 11 wherein the backplate is electrically conductive.
Claim 25
Dependent Claim
137 words
A microwave circuit module, comprising: (a) a backplate located in a first plane, the first plane further comprising a wall of a waveguide; (b) a first substrate coupled to the backplate, the first substrate being located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane, comprising (i) means for receiving at least one electronic device which processes microwave signals; and (ii) waveguide coupler means integrally molded with the means for receiving for coupling the microwave signals between the at least one electronic device and the waveguide; (c) at least one electronic device coupled to the means for receiving; and (d) a second substrate coupled to the first substrate such that a cavity is provided about the means for receiving.
Claim 26
Dependent Claim
137 words
A microwave circuit module, comprising: (a) a backplate located in a first plane, the first plane further comprising a wall of a waveguide; (b) a first substrate coupled to the backplate, the first substrate being located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane, comprising (i) means for receiving at least one electronic device which processes microwave signals; and (ii) waveguide coupler means integrally molded with the means for receiving for coupling the microwave signals between the at least one electronic device and the waveguide; (c) at least one electronic device coupled to the means for receiving; and (d) a second substrate coupled to the first substrate such that a cavity is provided about the means for receiving.
Claim 27
Dependent Claim
39 words
The microwave circuit module of claim 23 wherein the waveguide coupler means comprises: (a) a projecting means for projecting into the waveguide; and (b) a conductor, disposed on a surface of the first substrate, coupled to the projecting means.
Claim 28
Dependent Claim
32 words
The microwave circuit module of claim 24 wherein the projecting means comprises a plated through hole whereby microwave energy can be coupled between the at least one electronic device and the waveguide.
Claim 29
Dependent Claim
17 words
The microwave circuit module of claim 23 wherein the first and second substrate comprise dielectric composite material.
Claim 30
Dependent Claim
23 words
The microwave circuit module of claim 26 wherein the dielectric composite material comprises at least one of the following materials: ceramics and polymers.
Claim 31
Dependent Claim
31 words
The microwave circuit module of claim 23 wherein the waveguide coupler means comprises impedance matching means for varying the impedance characteristic between the at least one electronic device and the waveguide.
Claim 32
Dependent Claim
17 words
The microwave circuit module of claim 28 wherein the waveguide coupler means comprises a dielectric composite material.
Claim 33
Dependent Claim
23 words
The microwave circuit module of claim 29 wherein the dielectric composite material comprises at least one of the following materials: ceramics and polymers.
Claim 34
Dependent Claim
20 words
The microwave circuit module of claim 29 wherein the varied impedance characteristic is the thickness of the dielectric composite material.
Claim 35
Dependent Claim
40 words
The microwave circuit module of claim 24 wherein the first substrate comprises another surface with a conductor disposed thereon arranged such that the two surface conductors are on substantially opposite surfaces of the first substrate thereby forming a transmission line.
Claim 36
Dependent Claim
47 words
The microwave circuit module of claim 23 wherein: (a) the first substrate comprises a surface with a conductor disposed thereon; and (b) the second substrate comprises a surface with a conductor disposed thereon whereby a substantial electromagnetic energy shielding cavity is provided about the means for receiving.
Claim 37
Dependent Claim
13 words
The microwave circuit module of claim 23 wherein the backplate is electrically conductive.
Claim 38
Dependent Claim
24 words
The microwave circuit module of claim 34 wherein the first substrate is coupled to the backplate by an attachment member which is electrically conductive.
Claim 39
Dependent Claim
13 words
The microwave circuit module of claim 23 wherein the backplate is thermally conductive.
Claim 40
Dependent Claim
24 words
The microwave circuit module of claim 36 wherein the first substrate is coupled to the backplate by an attachment member which is thermally conductive.
Claim 41
Dependent Claim
18 words
The microwave circuit module of claim 23 wherein the at least one electronic device is a semiconductor die.
Claim 42
Dependent Claim
16 words
The microwave circuit module of claim 38 wherein the semiconductor die is comprised of gallium arsenide.
Claim 43
Dependent Claim
20 words
The microwave circuit module of claim 38 wherein the semiconductor die operates at a frequency of at least 12 gigahertz.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-02 | 1995-03-04 | 1995-09-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-02 | 1999-03-04 | 1999-09-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-02 | 2003-03-04 | 2003-09-03 | $7700.00 | Window Closed / Lapsed |