US5831325A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Antifuse structures with improved manufacturability
Assignee: Individual
•
Filing: 1996-10-17
•
Granted: 1998-11-03
•
Expires: 2016-10-17
Abstract
Abstract An antifuse structure of the present invention comprises an antifuse layer and a bottom electrode which are immune to the damages caused by harmful processing environment. The three major components of the antifuse--the bottom electrode, the antifuse layer and the top buffer layer--are formed consecutively without any photolithography or etching step in-between. The top buffer layer is defined before the bottom electrode. This antifuse structure can substantially improve the antifuse manufacturability.
Inventors
- 👤 Guobiao Zhang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 09:28
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/491
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
127 words
An antifuse in an integrated circuit comprising: a conductive bottom electrode; a conductive top buffer layer; an antifuse layer between said conductive bottom electrode and said conductive top buffer layer, said antifuse layer having a high resistance when unprogrammed and having a low resistance after being programmed, said antifuse layer touching a first portion of said conductive bottom electrode and a second portion of said conductive top buffer layer; and a first and second interfaces of said antifuse layer, said first interface being a first common area shared by said conductive bottom electrode and said antifuse layer, said second interface being a second common area shared by said antifuse layer and said conductive top buffer layer, said first and second interfaces are only exposed to material-forming ambient.
Claim 2
Dependent Claim
127 words
An antifuse in an integrated circuit comprising: a conductive bottom electrode; a conductive top buffer layer; an antifuse layer between said conductive bottom electrode and said conductive top buffer layer, said antifuse layer having a high resistance when unprogrammed and having a low resistance after being programmed, said antifuse layer touching a first portion of said conductive bottom electrode and a second portion of said conductive top buffer layer; and a first and second interfaces of said antifuse layer, said first interface being a first common area shared by said conductive bottom electrode and said antifuse layer, said second interface being a second common area shared by said antifuse layer and said conductive top buffer layer, said first and second interfaces are only exposed to material-forming ambient.
Claim 3
Dependent Claim
42 words
The antifuse of claim 1 further comprising: an insulating layer overlaying said conductive top buffer layer and having an opening therethrough, said opening exposing a third portion of said conductive top buffer layer; and a conductive top routing electrode in said opening.
References Cited (Backward Citations)
US4937650A
Cited
US5412244A
Cited
US5266829A
Cited
US4899205A
Cited
US4914055A
Cited
US5070384A
Cited
US5552627A
Cited
US5100827A
Cited
US5196724A
Cited
US5374832A
Cited
US5482884A
Cited
US5373169A
Cited
US5521423A
Cited
US5485031A
Cited
US5572409A
Cited
US5592016A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-02 | 2002-05-04 | 2002-11-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-02 | 2006-05-04 | 2006-11-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-02 | 2010-05-04 | 2010-11-03 | $7700.00 | Window Closed / Lapsed |