Electronic component for an integrated circuit

Claim 1

An electronic component for an integrated circuit, which comprises: a) a planar first conductive means for conducting an electric charge; b) an interlevel dielectric deposited on said planar first conductive means, said interlevel dielectric including first and second windows extending down to said planar first conductive means, each of said first and second windows being at least partially defined by at least one respective side wall oriented transverse to the planar orientation of said planar first conductive means, said planar first conductive means extending between said first and second windows for transferring an electrical charge therebetween; c) a second conductive means defining a capacitor bottom plate formed in said first window from a layer of first metal and a layer of conductive etch stop in contact with said layer of first metal, said layer of first metal being in electrical contact with said planar first conductive means and extending over said respective side wall of said first window; d) a third conductive means formed in said second window from a layer of said first metal and a layer of said conductive etch stop in contact with said layer of first metal, said layer of first metal of said third conductive means being in electrical contact with said planar first conductive means and extending over the respective wall of said second window, said second and third conductive means being spaced apart from each other; e) a layer of capacitor dielectric deposited over said layer of conductive etch stop of said second conductive means; f) a fourth conductive means formed in said first window from a layer of second metal deposited over said capacitor dielectric of said second conductive means; and g) a fifth conductive means formed in said second window from a layer of second metal deposited over and in electrical contact with said conductive etch stop of said third conductive means.