Abstract In one aspect, a method for forming a transistor device on a semiconductor substrate, comprising: a) forming a transistor gate on the. substrate; b) forming a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one of the first polarity regions. In another aspect, a transistor device, comprising: a) a transistor gate on a semiconductor substrate; b) a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; and c) a second polarity internal junction region entirely received within one of the first polarity regions. In yet another aspect, A resistor, comprising: a) a gate on a semiconductor substrate, the gate being electrically powered with a gate voltage; b) a first polarity source active region and a first polarity drain active region operatively adjacent the electrically powered gate; c) a second polarity internal junction region entirely received within one of the first polarity regions; and d) a current between the first polarity source active region and the first polarity drain active region, the current being substantially linearly dependent on a voltage at the drain region.
A method for forming a transistor device on a semiconductor substrate comprising the following steps: forming a transistor gate on the semiconductor substrate, the transistor gate comprising lateral edges; defining a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; forming first polarity LDD regions within the source and drain active regions; forming first polarity source and drain regions within the source and drain active regions; forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one or more of the first polarity regions; and before forming the second polarity internal junction region, forming a masking layer over the source active region, the masking layer preventing said internal junction region from being formed within the source active region.
Claim 2
Independent Claim
133 words
A method for forming a transistor device on a semiconductor substrate comprising the following steps: forming a transistor gate on the semiconductor substrate, the transistor gate comprising lateral edges; defining a first polarity source active region and a first polarity drain active region operatively adjacent the transistor gate; forming first polarity LDD regions within the source and drain active regions; forming first polarity source and drain regions within the source and drain active regions; forming a second polarity internal junction region, the second polarity internal junction region being entirely received within one or more of the first polarity regions; and before forming the second polarity internal junction region, forming a masking layer over the source active region, the masking layer preventing said internal junction region from being formed within the source active region.