Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
127 words
The MOS field effect transistor device comprising: a gate electrode on the surface of a semiconductor substrate; ultra thin silicon oxide spacers on the sidewalls of said gate electrode; buried N- lightly doped source and drain regions within said semiconductor substrate underlying the edges of said gate electrode; N-- very lightly doped source and drain regions within said semiconductor substrate underlying the edges of said gate electrode and directly overlying said N- lightly doped source and drain regions wherein said N-- very lightly doped source and drain region appear nowhere else within said semiconductor substrate; and N+ heavily doped source and drain regions within said semiconductor substrate adjacent to said N- lightly doped source and drain regions and said N-- very lightly doped source and drain regions.
Claim 2
Dependent Claim
127 words
The MOS field effect transistor device comprising: a gate electrode on the surface of a semiconductor substrate; ultra thin silicon oxide spacers on the sidewalls of said gate electrode; buried N- lightly doped source and drain regions within said semiconductor substrate underlying the edges of said gate electrode; N-- very lightly doped source and drain regions within said semiconductor substrate underlying the edges of said gate electrode and directly overlying said N- lightly doped source and drain regions wherein said N-- very lightly doped source and drain region appear nowhere else within said semiconductor substrate; and N+ heavily doped source and drain regions within said semiconductor substrate adjacent to said N- lightly doped source and drain regions and said N-- very lightly doped source and drain regions.
Claim 3
Dependent Claim
19 words
The device of claim 1 wherein the length of said gate electrode is between about 0.1 to 5 micrometers.
Claim 4
Dependent Claim
21 words
The device of claim 1 wherein each of said ultra thin spacers is between about 500 to 1500 Angstroms in width.
Claim 5
Dependent Claim
17 words
The device of claim 1 wherein said N+ heavily doped source and drain regions comprise Arsenic ions.
Claim 6
Dependent Claim
30 words
The device of claim 1 wherein said N- lightly doped source and drain regions comprise phosphorus ions with a peak surface concentration of about 2 E 18 atoms/cm 3 .
Claim 7
Dependent Claim
37 words
The device of claim 1 wherein said N-- very lightly doped source and drain regions comprise BF 2 ions with a peak surface concentration of between about 7 E 17 to 1.5 E 18 atoms/cm 3 .
Claim 8
Dependent Claim
50 words
The device of claim 1 wherein the maximum electric field of said transistor is located at the top surface of said N-- very lightly doped drain region close to the edge of said gate electrode and wherein the current path is separated from said maximum electric field of said transistor.
Claim 9
Dependent Claim
204 words
The MOS field effect transistor device comprising: a gate electrode on the surface of a semiconductor substrate, said gate electrode having a length of between about 0.1 to 5 micrometers; ultra thin silicon oxide spacers on the sidewalls of said gate electrode wherein each of said ultra thin oxide spacers has a width of between about 500 to 1500 Angstroms; buried N- lightly doped source and drain regions within said semiconductor substrate underlying the edges of said gate electrode; N-- very lightly doped source and drain regions within said semiconductor substrate underlying the edges of said gate electrode and directly overlying said N- lightly doped source and drain regions wherein said N-- very lightly doped source and drain regions appear nowhere else within said semiconductor substrate and wherein the maximum electric field of said transistor is located at the top surface of said N-- very lightly doped drain region close to the edge of said gate electrode and wherein the current path is separated from said maximum electric field of said transistor; and N+ heavily doped source and drain regions within said semiconductor substrate adjacent to said N- lightly doped source and drain regions and said N-- very lightly doped source and drain regions.
Claim 10
Dependent Claim
204 words
The MOS field effect transistor device comprising: a gate electrode on the surface of a semiconductor substrate, said gate electrode having a length of between about 0.1 to 5 micrometers; ultra thin silicon oxide spacers on the sidewalls of said gate electrode wherein each of said ultra thin oxide spacers has a width of between about 500 to 1500 Angstroms; buried N- lightly doped source and drain regions within said semiconductor substrate underlying the edges of said gate electrode; N-- very lightly doped source and drain regions within said semiconductor substrate underlying the edges of said gate electrode and directly overlying said N- lightly doped source and drain regions wherein said N-- very lightly doped source and drain regions appear nowhere else within said semiconductor substrate and wherein the maximum electric field of said transistor is located at the top surface of said N-- very lightly doped drain region close to the edge of said gate electrode and wherein the current path is separated from said maximum electric field of said transistor; and N+ heavily doped source and drain regions within said semiconductor substrate adjacent to said N- lightly doped source and drain regions and said N-- very lightly doped source and drain regions.
Claim 11
Dependent Claim
17 words
The device of claim 8 wherein said N+ heavily doped source and drain regions comprise Arsenic ions.
Claim 12
Dependent Claim
30 words
The device of claim 8 wherein said N- lightly doped source and drain regions comprise phosphorus ions with a peak surface concentration of about 2 E 18 atoms/cm 3 .
Claim 13
Dependent Claim
37 words
The device of claim 8 wherein said N-- very lightly doped source and drain regions comprise BF 2 ions with a peak surface concentration of between about 7 E 17 to 1.5 E 18 atoms/cm 3 .