Semiconductor device and manufacturing method of the same

Claim 1

A method of manufacturing a semiconductor device comprising: (1) a first step of providing a lead frame having: a lead frame main body; a plurality of connecting leads each of which is composed of an outer lead extending inward from said lead frame main body and an inner lead extending inward from said outer lead, said outer lead extending inward from said outer lead serving as an electrode for external connection and said inner lead being electrically connected for providing an electrical connection with an electrode of a semiconductor chip; and a plurality of fixing leads for holding said semiconductor chip, each of said fixing leads being composed of a main portion extending inward from said lead frame main body and a distal end bent with elasticity against said main portion at a right angle and confronting another distal end extending from another main portion that confronts said main portion with a clearance that is slightly smaller than a corresponding size of said semiconductor chip, said fixing leads being supported elastically against said lead frame main body; (2) a second step of: (2-1) expanding said mutually confronting distal ends of said fixing leads so that the clearance between said confronting distal ends becomes larger than the corresponding size of the semiconductor chip; (2-2) placing said semiconductor chip between said mutually confronting ends of said fixing ends; and (2-3) returning said confronting distal ends of said fixing ends, whereby said semiconductor chip is clamped by said confronting distal ends with the aid of elasticity that each of said fixing leads has against said lead frame main body; (3) a third step of molding said semiconductor chip, said connecting leads and said fixing leads with resin to form a resin package; and (4) a fourth step of cutting said outer leads of said connecting leads and said fixing leads off said lead frame main body.

Claim 2

A method of manufacturing a semiconductor device comprising: (1) a first step of providing a lead frame having: a lead frame main body; a plurality of connecting leads each of which is composed of an outer lead extending inward from said lead frame main body and an inner lead extending inward from said outer lead, said outer lead extending inward from said outer lead serving as an electrode for external connection and said inner lead being electrically connected for providing an electrical connection with an electrode of a semiconductor chip; and a plurality of fixing leads for holding said semiconductor chip, each of said fixing leads being composed of a main portion extending inward from said lead frame main body and a distal end bent with elasticity against said main portion at a right angle and confronting another distal end extending from another main portion that confronts said main portion with a clearance that is slightly smaller than a corresponding size of said semiconductor chip, said fixing leads being supported elastically against said lead frame main body; (2) a second step of: (2-1) expanding said mutually confronting distal ends of said fixing leads so that the clearance between said confronting distal ends becomes larger than the corresponding size of the semiconductor chip; (2-2) placing said semiconductor chip between said mutually confronting ends of said fixing ends; and (2-3) returning said confronting distal ends of said fixing ends, whereby said semiconductor chip is clamped by said confronting distal ends with the aid of elasticity that each of said fixing leads has against said lead frame main body; (3) a third step of molding said semiconductor chip, said connecting leads and said fixing leads with resin to form a resin package; and (4) a fourth step of cutting said outer leads of said connecting leads and said fixing leads off said lead frame main body.

Claim 8

A method of manufacturing a semiconductor device comprising: (1) a first step of providing a lead frame having: a lead frame main body; a plurality of connecting leads each of which is composed of an outer lead extending inward from said lead frame main body and an inner lead extending inward from said outer lead, said outer lead serving as an electrode for external connection and said inner lead being electrically connected with an electrode of a semiconductor chip; and a plurality of fixing leads for holding said semiconductor chip, each of said fixing leads being composed of a main portion extending inward from said lead frame main body and a distal end bent downward with elasticity against said main portion and confronting another distal end extending from another main portion which confronts said main portion; (2) a second step of placing said semiconductor chip between said mutually confronting distal ends of said fixing leads so that each of said inner leads of said connecting leads is located above the upper face of said semiconductor chip and that each bottom of said distal ends of said fixing leads is substantially level with the lower face of said semiconductor chip, whereby said semiconductor chip is clamped by said confronting distal ends in such a fashion that said confronting distal ends are respectively struck to lower portions of two side surfaces of said semiconductor chip which are positionally opposite to each other; (3) a third step of electrically connecting said inner leads of said connecting leads with electrodes of said semiconductor chip by bonding wires, respectively; (4) a fourth step of molding said semiconductor chip, said connecting leads and said fixing leads with resin to form a resin package; and (5) a fifth step of cutting said outer leads of said connecting leads and said fixing leads off said lead frame main body.

Claim 9

A method of manufacturing a semiconductor device comprising: (1) a first step of providing a lead frame having: a lead frame main body; a plurality of connecting leads each of which is composed of an outer lead extending inward from said lead frame main body and an inner lead extending inward from said outer lead, said outer lead serving as an electrode for external connection and said inner lead being electrically connected with an electrode of a semiconductor chip; and a plurality of fixing leads for holding said semiconductor chip, each of said fixing leads being composed of a main portion extending inward from said lead frame main body and a distal end bent downward with elasticity against said main portion and confronting another distal end extending from another main portion which confronts said main portion; (2) a second step of placing said semiconductor chip between said mutually confronting distal ends of said fixing leads so that each of said inner leads of said connecting leads is located above the upper face of said semiconductor chip and that each bottom of said distal ends of said fixing leads is substantially level with the lower face of said semiconductor chip, whereby said semiconductor chip is clamped by said confronting distal ends in such a fashion that said confronting distal ends are respectively struck to lower portions of two side surfaces of said semiconductor chip which are positionally opposite to each other; (3) a third step of electrically connecting said inner leads of said connecting leads with electrodes of said semiconductor chip by bonding wires, respectively; (4) a fourth step of molding said semiconductor chip, said connecting leads and said fixing leads with resin to form a resin package; and (5) a fifth step of cutting said outer leads of said connecting leads and said fixing leads off said lead frame main body.

Claim 12

A method of manufacturing a semiconductor device comprising: (1) a first step of providing a lead frame having: a lead frame main body; a plurality of connecting leads each of which is composed of an outer lead extending inward from said lead frame main body and an inner lead extending inward from said outer lead, said outer lead serving as an electrode for external connection and said inner lead being electrically connected with an electrode of a semiconductor chip; and a plurality of fixing leads for holding said semiconductor chip, each of which is composed of a main portion extending inward from said lead frame main body and a distal end bent downward with elasticity against said main portion at a right angle and confronting another distal end extending from another main portion which confronts said main portion; (2) a second step of placing said semiconductor chip between said mutually confronting distal ends so that each of said inner leads of said connecting leads is located above the upper face of said semiconductor chip and that each bottom of said distal ends of said fixing leads is substantially level with the lower face of said semiconductor chip, whereby said semiconductor chip is clamped by said confronting distal ends in such a fashion that side surfaces of said confronting distal ends are respectively stuck to two side surfaces of said semiconductor chip which are positionally opposite to each other; (3) a third step of electrically connecting said inner leads of said connecting leads with electrodes of said semiconductor chip by bonding wires, respectively; (4) a fourth step of molding said semiconductor chip, said connecting leads and said fixing leads with resin to form a resin package; and (5) a fifth step of cutting said outer leads of said connecting leads and said fixing leads off said lead frame main body.

Claim 13

A method of manufacturing a semiconductor device comprising: (1) a first step of providing a lead frame having: a lead frame main body; a plurality of connecting leads each of which is composed of an outer lead extending inward from said lead frame main body and an inner lead extending inward from said outer lead, said outer lead serving as an electrode for external connection and said inner lead being electrically connected with an electrode of a semiconductor chip; and a plurality of fixing leads for holding said semiconductor chip, each of which is composed of a main portion extending inward from said lead frame main body and a distal end bent downward with elasticity against said main portion at a right angle and confronting another distal end extending from another main portion which confronts said main portion; (2) a second step of placing said semiconductor chip between said mutually confronting distal ends so that each of said inner leads of said connecting leads is located above the upper face of said semiconductor chip and that each bottom of said distal ends of said fixing leads is substantially level with the lower face of said semiconductor chip, whereby said semiconductor chip is clamped by said confronting distal ends in such a fashion that side surfaces of said confronting distal ends are respectively stuck to two side surfaces of said semiconductor chip which are positionally opposite to each other; (3) a third step of electrically connecting said inner leads of said connecting leads with electrodes of said semiconductor chip by bonding wires, respectively; (4) a fourth step of molding said semiconductor chip, said connecting leads and said fixing leads with resin to form a resin package; and (5) a fifth step of cutting said outer leads of said connecting leads and said fixing leads off said lead frame main body.