Patent US5773895A successfully refreshed from Google Patents.
US5773895A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Anchor provisions to prevent mold delamination in an overmolded plastic array package
Assignee: Micron Technology Inc
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Filing: 1996-04-03
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Granted: 1998-06-30
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Expires: 2016-04-03
Abstract
Abstract An overmolded plastic integrated circuit package which contains an integrated circuit that is mounted to a first surface of a printed circuit board. The integrated circuit is electrically coupled to a plurality of external contacts located on an opposite second surface of the printed circuit board. The integrated circuit is encapsulated and protected by a molded plastic compound. The printed circuit board has slots that receive a portion of the molded plastic material. The plastic filled slots anchor the outer encapsulant to the printed circuit board and prevent delamination between the interface of the circuit board and the adjacent encapsulant material.
Inventors
- 👤 Altaf Hassan
- 👤 Bidyut K. Bhattacharyya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:55
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W72/00; H10W72/50; H10W72/551; H10W74/127; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
97 words
An electronic package, comprising: a substrate which has a first surface and an opposite second surface, said substrate having a slot in said first surface and an outer raised layer on said first surface, wherein said outer raised layer has a top surface; a contact that extends from said second surface of said substrate; an integrated circuit mounted to said first surface; and, a plastic mold compound that encapsulates said integrated circuit, wherein a portion of said plastic mold compound extends into said slot and onto said top surface of said outer raised layer of said substrate.
Claim 2
Dependent Claim
97 words
An electronic package, comprising: a substrate which has a first surface and an opposite second surface, said substrate having a slot in said first surface and an outer raised layer on said first surface, wherein said outer raised layer has a top surface; a contact that extends from said second surface of said substrate; an integrated circuit mounted to said first surface; and, a plastic mold compound that encapsulates said integrated circuit, wherein a portion of said plastic mold compound extends into said slot and onto said top surface of said outer raised layer of said substrate.
Claim 3
Dependent Claim
20 words
The package as recited in claim 1, wherein said substrate has a plurality of slots arranged in a rectangular pattern.
Claim 4
Dependent Claim
22 words
The package as recited in claim 1, wherein said slot extends through said substrate from said first surface to said second surface.
Claim 5
Dependent Claim
20 words
The package as recited in claim 1, wherein said substrate has a plurality of slots arranged in a rectangular pattern.
Claim 6
Dependent Claim
14 words
The package as recited in claim 1, wherein said contact is a solder ball.
Claim 7
Dependent Claim
13 words
The package as recited in claim 1, wherein said contact is a pin.
Claim 8
Dependent Claim
15 words
The package as recited in claim 1, wherein said substrate is a printed circuit board.
Claim 9
Dependent Claim
14 words
The package as recited in claim 1, wherein said integrated circuit is a microprocessor.
Claim 10
Dependent Claim
132 words
An electronic package, comprising: a printed circuit board which has a plurality of bonding fingers on a first surface, said bonding fingers being coupled to a plurality of contact pads on an opposite second surface of said printed circuit board, said printed circuit board having a slot in said first surface and an outer raised layer on said first surface, wherein said outer raised layer has a top surface; a plurality of solder balls that are attached to said contact pads; an integrated circuit mounted to said first surface and coupled to said bonding fingers; and, a plastic mold compound that encapsulates said integrated circuit, wherein a portion of said plastic mold compound extends into said slot and onto said top surface of said outer raised layer of said printed circuit board.
Claim 11
Dependent Claim
132 words
An electronic package, comprising: a printed circuit board which has a plurality of bonding fingers on a first surface, said bonding fingers being coupled to a plurality of contact pads on an opposite second surface of said printed circuit board, said printed circuit board having a slot in said first surface and an outer raised layer on said first surface, wherein said outer raised layer has a top surface; a plurality of solder balls that are attached to said contact pads; an integrated circuit mounted to said first surface and coupled to said bonding fingers; and, a plastic mold compound that encapsulates said integrated circuit, wherein a portion of said plastic mold compound extends into said slot and onto said top surface of said outer raised layer of said printed circuit board.
Claim 12
Dependent Claim
22 words
The package as recited in claim 9, wherein said printed circuit board has a plurality of slots arranged in a rectangular pattern.
Claim 13
Dependent Claim
22 words
The package as recited in claim 9, wherein said slot extends through said substrate from said first surface to said second surface.
Claim 14
Dependent Claim
16 words
The package as recited in claim 9, wherein said slot is arranged in a rectangular pattern.
Claim 15
Dependent Claim
14 words
The package as recited in claim 9, wherein said integrated circuit is a microprocessor.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-29 | 2001-12-29 | 2002-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-29 | 2005-12-29 | 2006-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-29 | 2009-12-29 | 2010-06-30 | $7700.00 | Window Closed / Lapsed |