US5565709A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Nitto Denko Corp
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Filing: 1995-11-02
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Granted: 1996-10-15
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Expires: 2015-11-02
Abstract
Abstract A semiconductor device comprising a semiconductor element encapsulated with a cured resin having at least two secondary differential peaks of linear thermal expansion by a thermomechanical analytical measurement, the interval between the peaks being at least 20 DEG C. The semiconductor device encapsulated with the cured resin does not cause a warp and is excellent in the TCT test characteristics and the cracking resistance.
Inventors
- 👤 Takashi Fukushima
- 👤 Satoshi Ito
- 👤 Makoto Kuwamura
- 👤 Shinya Akizuki
- 👤 Kazuhiro Ikemura
- 👤 Shinichiro Sudo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:04
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
43 words
A semiconductor device comprising a semiconductor element encapsulated with a cured resin, wherein the cured resin has at least two secondary differential peaks of linear thermal expansion by a thermomechanical analytic measurement and the interval between the peaks is at least 20° C.
Claim 2
Dependent Claim
43 words
A semiconductor device comprising a semiconductor element encapsulated with a cured resin, wherein the cured resin has at least two secondary differential peaks of linear thermal expansion by a thermomechanical analytic measurement and the interval between the peaks is at least 20° C.
Claim 3
Dependent Claim
44 words
The semiconductor device as claimed in claim 1, wherein the cured resin is a cured product of a mixture of at least two kinds of resin compositions each having a different glass transition point (Tg) with a temperature difference of at least 20° C.
Claim 4
Dependent Claim
52 words
The semiconductor device as claimed in claim 1, wherein the semiconductor element is loaded on a substrate, the semiconductor element on the substrate is encapsulated with the cured resin, and the encapsulation of the semiconductor device is a one-surface encapsulation on only the side of the substrate which loads the semiconductor element.
Claim 5
Dependent Claim
25 words
The semiconductor device as claimed in claim 1, wherein the cured resin is a cured product of an epoxy resinphenol resin curing system resin composition.
Claim 6
Dependent Claim
97 words
The semiconductor device as claimed in claim 1, wherein the cured resin is a cured resin product of a mixture of following resin composition (a) and resin composition (b), and the organic resin component concentration of the mixture of the resin composition (a) and the resin composition (b) is from 5 to 25% by weight; (a): A resin composition the cured product of which has a glass transition point (Tg) of from 170° to 250° C., (b): A resin composition the cured product of which has a glass transition point (Tg) of from 100° to 140° C.
References Cited (Backward Citations)
US5218030A
Cited
US5107327A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-15 | 2000-04-15 | 2000-10-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-15 | 2004-04-15 | 2004-10-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-15 | 2008-04-15 | 2008-10-15 | $7700.00 | Window Closed / Lapsed |