US5772784A — Ultra-low particle semiconductor cleaner

Claim 1

Independent Claim 176 words

A method for cleaning a semiconductor wafer comprising the steps of: immersing a wafer in a liquid comprising water, said wafer including a front face, a back face, and an edge, said water being substantially free from particles greater than about 0.5 micron in diameter; providing a substantially particle free environment adjacent to said front face and said back face as said liquid is being removed, said substantially particle free environment comprising a gas that is substantially free from particles greater than about 0.5 micron in diameter; and introducing a cleaning enhancement substance during said providing step, said cleaning enhancement substance doping said liquid which is attached to said front face and said back face to cause a concentration gradient of said cleaning enhancement substance in said attached liquid to accelerate fluid flow of said attached liquid off of said wafer, said cleaning enhancement substance comprising a non-saturated compound; wherein said wafer is substantially free from mechanical movement during said providing se and introducing se to decrease a possibility of any substantial damage to said wafer.

Claim 2

Independent Claim 176 words

A method for cleaning a semiconductor wafer comprising the steps of: immersing a wafer in a liquid comprising water, said wafer including a front face, a back face, and an edge, said water being substantially free from particles greater than about 0.5 micron in diameter; providing a substantially particle free environment adjacent to said front face and said back face as said liquid is being removed, said substantially particle free environment comprising a gas that is substantially free from particles greater than about 0.5 micron in diameter; and introducing a cleaning enhancement substance during said providing step, said cleaning enhancement substance doping said liquid which is attached to said front face and said back face to cause a concentration gradient of said cleaning enhancement substance in said attached liquid to accelerate fluid flow of said attached liquid off of said wafer, said cleaning enhancement substance comprising a non-saturated compound; wherein said wafer is substantially free from mechanical movement during said providing se and introducing se to decrease a possibility of any substantial damage to said wafer.

Claim 3

Dependent Claim 28 words

The method of claim 1 further comprising a step of introducing a drying source adjacent to said wafer, said drying source removing said liquid attached to said edge.

Claim 4

Dependent Claim 25 words

The method of claim 1 wherein said providing step leaves a boundary layer of said liquid attached to said front face and said back face.

Claim 5

Dependent Claim 15 words

The method of claim 3 wherein said boundary layer is about 1,000 Å and less.

Claim 6

Dependent Claim 15 words

The method of claim 3 wherein said boundary layer is about 100 Å and less.

Claim 7

Dependent Claim 29 words

The method of claim 1 wherein said cleaning enhancement substance is selected from a group consisting of a surfactant, isopropyl alcohol, di-acetone alcohol, helium, carbon dioxide, ammonia, and 1-methoxy-2-propanol.

Claim 8

Dependent Claim 22 words

The method of claim 1 wherein said liquid during said introducing step removes particles off said front face and said back face.

Claim 9

Dependent Claim 18 words

The method of claim 7 wherein said particles are each substantially greater than about 0.2 microns in diameter.

Claim 10

Dependent Claim 20 words

The method of claim 1 wherein said liquid is substantially free from particles greater than about 0.2 microns in diameter.

Claim 11

Dependent Claim 32 words

The method of claim 1 wherein said cleaning enhancement substance is mixed with a carrier gas, said carrier gas being selected from a group consisting of air, nitrogen, inert gas, and argon.

Claim 12

Dependent Claim 32 words

The method of claim 1 wherein said cleaning enhancement substance is mixed with a carrier gas, said carrier gas comprising said cleaning enhancement substance being mixed with said substantially particle free environment.

Claim 13

Dependent Claim 25 words

The method of claim 1 wherein said wafer is disposed in a carrier, whereupon the carrier is tilted at an angle from a vertical position.

Claim 14

Dependent Claim 18 words

The method of claim 12 wherein said angle is less than about 15 degrees from said vertical position.

Claim 15

Dependent Claim 16 words

The method of claim 1 wherein said wafer is substantially free from oxidation before said immersing.

Claim 16

Dependent Claim 13 words

The method of claim 1 wherein said wafer is a recently etched wafer.

Claim 17

Dependent Claim 25 words

The method of claim 1 wherein said cleaning enhancement substance is a non-saturated polar organic compound ranging in concentration from about 1,000 ppm and less.

Claim 18

Dependent Claim 25 words

The method of claim 1 wherein said cleaning enhancement substance is a non-saturated polar organic compound ranging in concentration from about 500 ppm and less.

Claim 19

Dependent Claim 25 words

The method of claim 1 wherein said liquid is removed at a rate of about 5.0 mm/sec. or less as measured from said front face.

Claim 20

Dependent Claim 26 words

The method of claim 1 wherein said liquid is removed at a rate between about 0.25 mm/sec. and 5.0 mm./sec. as measured from said front face.

Claim 21

Dependent Claim 26 words

The method of claim 1 wherein said liquid is removed at a rate between about 0.5 mm/sec. and 2.5 mm./sec. as measured from said front face.

Claim 22

Independent Claim 168 words

A method for cleaning objects having surfaces, said method comprising the steps of: immersing an object in a liquid comprising water, said object including a face, said water being substantially free from particles greater than about 0.5 micron in diameter; and providing a substantially particle free environment adjacent to said face, said substantially particle free environment comprising a gas that is substantially free from particles greater than about 0.5 micron in diameter; and introducing a carrier gas comprising a cleaning enhancement substance and mixing said carrier gas with said substantially particle free environment, said cleaning enhancement substance doping said liquid which is attached to said face to cause a concentration gradient of said cleaning enhancement substance in said attached liquid to accelerate fluid flow of said attached liquid off of said object, said cleaning enhancement substance comprising a non-saturated compound; wherein said object is substantially free from any mechanical movement during said providing step and introducing step to prevent a possibility of any substantial damage to said object.

Claim 23

Independent Claim 168 words

A method for cleaning objects having surfaces, said method comprising the steps of: immersing an object in a liquid comprising water, said object including a face, said water being substantially free from particles greater than about 0.5 micron in diameter; and providing a substantially particle free environment adjacent to said face, said substantially particle free environment comprising a gas that is substantially free from particles greater than about 0.5 micron in diameter; and introducing a carrier gas comprising a cleaning enhancement substance and mixing said carrier gas with said substantially particle free environment, said cleaning enhancement substance doping said liquid which is attached to said face to cause a concentration gradient of said cleaning enhancement substance in said attached liquid to accelerate fluid flow of said attached liquid off of said object, said cleaning enhancement substance comprising a non-saturated compound; wherein said object is substantially free from any mechanical movement during said providing step and introducing step to prevent a possibility of any substantial damage to said object.

Claim 24

Dependent Claim 36 words

The method of claim 21 wherein said object is selected from a group consisting of a flat panel display, a disk drive, a disk, a semiconductor wafer, a patterned semiconductor wafer, and a masked semiconductor wafer.

Claim 25

Dependent Claim 31 words

The method of claim 21 further comprising a step of introducing a drying source adjacent to said object, said drying source removing said liquid attached to an edge of said object.

Claim 26

Dependent Claim 12 words

The method of claim 23 wherein said drying source comprises nitrogen gas.

Claim 27

Dependent Claim 21 words

The method of claim 21 wherein said providing step leaves a boundary layer of said liquid attached to said front face.

Claim 28

Dependent Claim 15 words

The method of claim 25 wherein said boundary layer is about 1,000 Å and less.

Claim 29

Dependent Claim 15 words

The method of claim 25 wherein said boundary layer is about 100 Å and less.

Claim 30

Dependent Claim 29 words

The method of claim 21 wherein said cleaning enhancement substance is selected from a group consisting of a surfactant, isopropyl alcohol, di-acetone alcohol, helium, carbon dioxide, ammonia, and 1-methoxy-2-propanol.

Claim 31

Dependent Claim 17 words

The method of claim 21 wherein said liquid during said introducing step removes particles off said face.

Claim 32

Dependent Claim 18 words

The method of claim 29 wherein said particles are each substantially greater than about 0.2 microns in diameter.

Claim 33

Dependent Claim 20 words

The method of claim 21 wherein said liquid is substantially free from particles greater than about 0.2 microns in diameter.

Claim 34

Dependent Claim 32 words

The method of claim 21 wherein said cleaning enhancement substance is mixed with a carrier gas, said carrier gas being selected from a group consisting of air, nitrogen, inert gas, and argon.

Claim 35

Dependent Claim 32 words

The method of claim 21 wherein said cleaning enhancement substance is mixed with a carrier gas, said carrier gas comprising said cleaning enhancement substance being mixed with said substantially particle free environment.

Claim 36

Dependent Claim 25 words

The method of claim 21 wherein said object is disposed in a carrier, whereupon said carrier is tilted at an angle from a vertical position.

Claim 37

Dependent Claim 18 words

The method of claim 34 wherein said angle is less than about 15 degrees from said vertical position.

Claim 38

Dependent Claim 17 words

The method of claim 21 wherein said object is substantially free from oxidation before said immersing step.

Claim 39

Dependent Claim 13 words

The method of claim 21 wherein said object is a recently etched object.

Claim 40

Dependent Claim 25 words

The method of claim 21 wherein said cleaning enhancement substance is a non-saturated polar organic compound ranging in concentration from about 1,000 ppm and less.

Claim 41

Dependent Claim 25 words

The method of claim 21 wherein said cleaning enhancement substance is a non-saturated polar organic compound ranging in concentration from about 500 ppm and less.

Claim 42

Dependent Claim 25 words

The method of claim 21 wherein said liquid is removed at a rate of about 2.5 mm/sec. or less as measured from said front face.

Claim 43

Dependent Claim 26 words

The method of claim 21 wherein said liquid is removed at a rate between about 0.25 mm/sec. and 5.0 mm./sec. as measured from said front face.

Claim 44

Dependent Claim 26 words

The method of claim 21 wherein said liquid is removed at a rate between about 0.5 mm/sec. and 2.5 mm./sec. as measured from said front face.

Claim 45

Dependent Claim 22 words

The method of claim 21 wherein said carrier gas is at a temperature ranging from about 75° F. to about 175° F.

Claim 46

Dependent Claim 14 words

The method of claim 21 wherein said carrier gas is at about 70° F.

Claim 47

Dependent Claim 20 words

The method of claim 21 wherein said cleaning enhancement substance is derived from less than a milliliter of organic compound.

Claim 48

Independent Claim 128 words

A method for cleaning objects having surfaces, said method comprising: immersing an object in a liquid comprising water, said object including a face, said water being substantially free from particles greater than about 0.5 microns; and providing a substantially particle free environment adjacent to said face, said substantially particle free environment being substantially free from particles greater than about 0.5 microns; wherein said liquid is removed at a selected rate of about 5.0 mm/sec. or less as measured from said face and is replaced by said substantially particle free environment, said substantially particle free environment accelerating fluid flow of attached liquid off of said face; wherein said object is substantially free from mechanical movement during said providing to prevent a possibility of any substantial damage to said object.

Claim 49

Independent Claim 128 words

A method for cleaning objects having surfaces, said method comprising: immersing an object in a liquid comprising water, said object including a face, said water being substantially free from particles greater than about 0.5 microns; and providing a substantially particle free environment adjacent to said face, said substantially particle free environment being substantially free from particles greater than about 0.5 microns; wherein said liquid is removed at a selected rate of about 5.0 mm/sec. or less as measured from said face and is replaced by said substantially particle free environment, said substantially particle free environment accelerating fluid flow of attached liquid off of said face; wherein said object is substantially free from mechanical movement during said providing to prevent a possibility of any substantial damage to said object.

Claim 50

Dependent Claim 21 words

The method of claim 46 wherein said substantially particle free environment is substantially free from particles greater than about 0.1 microns.

Claim 51

Dependent Claim 18 words

The method of claim 46 wherein said water is substantially free from particles greater than about 0.1 microns.

Claim 52

Dependent Claim 36 words

The method of claim 46 wherein said object is selected from a group consisting of a flat panel display, a disk drive, a disk, a semiconductor wafer, a patterned semiconductor wafer, and a masked semiconductor wafer.

Claim 53

Dependent Claim 15 words

The method of claim 46 wherein said providing liquid is removed at a constant rate.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2001-06-29	2001-12-29	2002-06-30	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2005-06-29	2005-12-29	2006-06-30	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2009-06-29	2009-12-29	2010-06-30	$7700.00	Window Closed / Lapsed

Ultra-low particle semiconductor cleaner

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