Multi-electronic device package

Claim 1

A multi-electric device package comprising: a first substrate having a first surface and an opposed second surface, said first surface including a first cavity extending from said first surface partially into said first substrate; a second layer of electrically conductive circuitry formed on said second surface of said first substrate wherein said second layer of circuitry is electrically coupled to said first layer of circuitry and wherein said second layer of circuitry is adapted for electrical coupling to a third external circuitized substrate; a first electronic device secured to said first substrate such that said first electronic device is positioned within said first cavity, said first electronic device electrically coupled to said first layer of circuitry; a second substrate having a first surface and an opposed second surface; a third layer of electrically conductive circuitry formed on said second surface of said second substrate; a second electronic device coupled to said second substrate, said second electronic device electrically coupled to said third layer of circuitry; a first encapsulant covering said first electronic device, said first cavity, and at least a portion of said first circuitry; a second encapsulant covering said second electronic device and at least a portion of said third circuitry; and wherein said first encapsulant is bonded to second encapsulant to attach first said substrate to said second substrate together along a common interface such that said second electronic device and said second surface of said second substrate faces said first electronic device and said first surface of said first substrate, and wherein said first layer of circuitry is electrically coupled to said third layer of circuitry.