Abstract This invention relates to an antireflective layer (ARL) which has both good absorption capability and low reflectivity at the photoresist/ARL interface. The ARL also significantly reduces CD variation in exposed photoresist film. The ARL of the present invention comprises an organic base resin having fine carbon particles dispersed therein. The combination of the organic base resin and fine carbon particles provide both good absorption and low reflectivity. The present invention is also related to a process of forming a semiconductor by applying an antireflection layer to the surface of a substrate, forming a photoresist layer on the antireflection layer, and selectively exposing the substrate to ultraviolet light, wherein the antireflective layer is an organic resin having carbon particles dispersed therein.
A semiconductor device prepared with an antireflective layer applied on a substrate and a photoresist layer applied on the antireflective layer, said antireflective layer comprising an organic resin having carbon particles dispersed therein, wherein the antireflective layer has an extinction coefficient larger than 0.23 and a refraction index between about 1.6 and 1.8 at a light wavelength of 250 nm, wherein the carbon particles have a particle size less than 100 Å and the amount of carbon particles dispersed in the resin is about 5 to 30 wt % based on the resin.
Claim 2
Dependent Claim
93 words
A semiconductor device prepared with an antireflective layer applied on a substrate and a photoresist layer applied on the antireflective layer, said antireflective layer comprising an organic resin having carbon particles dispersed therein, wherein the antireflective layer has an extinction coefficient larger than 0.23 and a refraction index between about 1.6 and 1.8 at a light wavelength of 250 nm, wherein the carbon particles have a particle size less than 100 Å and the amount of carbon particles dispersed in the resin is about 5 to 30 wt % based on the resin.
Claim 3
Dependent Claim
29 words
The semiconductor device of claim 1 wherein the organic resin is formed from a base resin and an amount of an organic solvent sufficient to dissolve the base resin.
Claim 4
Dependent Claim
21 words
The semiconductor device of claim 2 wherein the base resin is selected from the group consisting of polybutenesulfone, polyimide and polyamide.
Claim 5
Dependent Claim
20 words
The semiconductor device of claim 2 wherein the organic solvent is selected from the group consisting of cyclohexanone and α-butyllactone.
Claim 6
Dependent Claim
19 words
The semiconductor device of claim 1 wherein the carbon particles have a particle size of less than 10 Å.
Claim 7
Dependent Claim
17 words
The semiconductor device of claim 1 wherein the amount of carbon particles is about 10 wt %.