Patent US5716673A successfully refreshed from Google Patents.
US5716673A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Spin-on-glass process with controlled environment
Assignee: Macronix International Co Ltd
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Filing: 1994-11-07
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Granted: 1998-02-10
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Expires: 2014-11-07
Abstract
Abstract PCT No. PCT/US94/12785 Sec. 371 Date Dec. 1, 1995 Sec. 102(e) Date Dec. 1, 1995 PCT Filed Nov. 7, 1994 PCT Pub. No. WO96/14164 PCT Pub. Date May 17, 1996A process for spreading and flowing in a flowable dielectric during manufacture of an integrated circuit resulting in greater planarity and better gap filling ability. The process involves spinning the integrated circuit while controlling evaporation of the solvent from the flowable dielectric to increase the amount of flow in time and decrease spin velocity during flow in to improve planarity in gap filling ability. The process includes supporting the integrated circuit in a chamber; dispensing the flowable dielectric in a solvent on the integrated circuit in the chamber; covering the integrated circuit to provide a controllable environment within the chamber after the step of dispensing; spinning the integrated circuit while controlling the controllable environment to spread and flow in the flowable dielectric; uncovering the integrated circuit within the chamber; spinning the integrated circuit to spin off flowable dielectric; and curing the flowable the flowable dielectric.
Inventors
- 👤 Daniel L. W. Yen
- 👤 Been Yih Jin
- 👤 Ming Hong Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:27
CPC Classifications
B; B05; B05C; B05C11/00; B05C11/02; B05C11/08; H; H10; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6326; H10P14/6342; B05D; B05D1/00; B05D1/002; B05D1/005; H10P14/65; H10P14/6516; H10P14/66; H10P14/668; H10P14/6681; H10P14/6684; H10P14/6686; H10P14/6328; H10P14/6334; H10P14/662
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
110 words
An improved process for spreading a flowable material comprising a solvent on a surface of a substrate, the surface including depressions, comprising: spinning the substrate on an axis orthogonal to the surface, while controlling evaporation of the solvent from the flowable material to increase the amount of flow in time and decrease spin velocity during flow in to improve planarity and gap filling ability of the flowable material; causing evaporation of solvent from the flowable material to reduce the amount of solvent in the flowable material; modifying the flowable material, to decrease viscosity of a top surface layer; and spinning the substrate again on the axis orthogonal to the surface.
Claim 2
Dependent Claim
110 words
An improved process for spreading a flowable material comprising a solvent on a surface of a substrate, the surface including depressions, comprising: spinning the substrate on an axis orthogonal to the surface, while controlling evaporation of the solvent from the flowable material to increase the amount of flow in time and decrease spin velocity during flow in to improve planarity and gap filling ability of the flowable material; causing evaporation of solvent from the flowable material to reduce the amount of solvent in the flowable material; modifying the flowable material, to decrease viscosity of a top surface layer; and spinning the substrate again on the axis orthogonal to the surface.
Claim 3
Dependent Claim
121 words
A process for applying flowable dielectric during manufacture of an integrated circuit, comprising: supporting the integrated circuit in a chamber which encloses a chamber environment dispensing the flowable dielectric in a solvent on the integrated circuit in the chamber; covering the integrated circuit to provide a controllable environment within and seperated from the chamber environment after the step of dispensing; spinning the integrated circuit within the controllable environment to spread and flow in the flowable dielectric; modifying a top layer of the flowable dielectric decrease viscosity of the top layer; uncovering the integrated circuit to expose the integated circuit to the chamber environment within the chamber; spinning the integrated circuit to spin off excess flowable dielectric; and curing the flowable dielectric.
Claim 4
Dependent Claim
121 words
A process for applying flowable dielectric during manufacture of an integrated circuit, comprising: supporting the integrated circuit in a chamber which encloses a chamber environment dispensing the flowable dielectric in a solvent on the integrated circuit in the chamber; covering the integrated circuit to provide a controllable environment within and seperated from the chamber environment after the step of dispensing; spinning the integrated circuit within the controllable environment to spread and flow in the flowable dielectric; modifying a top layer of the flowable dielectric decrease viscosity of the top layer; uncovering the integrated circuit to expose the integated circuit to the chamber environment within the chamber; spinning the integrated circuit to spin off excess flowable dielectric; and curing the flowable dielectric.
Claim 5
Dependent Claim
28 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment, slowing down evaporation of the solvent in the controllable environment.
Claim 6
Dependent Claim
36 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment, isolating the controllable environment from the chamber environment to prevent the solvent from escaping from the controllable environment.
Claim 7
Dependent Claim
28 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment, controlling vapor pressure in the controllable environment for selected materials.
Claim 8
Dependent Claim
24 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment, controlling temperature of the integrated circuit.
Claim 9
Dependent Claim
30 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment includes spinning the integrated circuit at less than 500 revolutions per minute.
Claim 10
Dependent Claim
30 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment includes spinning the integrated circuit at less than 250 revolutions per minute.
Claim 11
Dependent Claim
28 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment includes spinning the integrated circuit for longer than 2 seconds.
Claim 12
Dependent Claim
28 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment includes spinning the integrated circuit for longer than 20 seconds.
Claim 13
Dependent Claim
35 words
The process of claim 2, including during the step of spinning the integrated circuit within the controllable environment includes spinning the integrated circuit at less than 500 revolutions per minute for longer than 2 seconds.
Claim 14
Dependent Claim
31 words
The process of claim 2, wherein the step of spinning the integrated circuit to spin off excess flowable dielectric comprises spinning the integrated circuit at more than 3000 revolutions per minute.
Claim 15
Dependent Claim
57 words
The process of claim 2, including after the step of spinning the integrated circuit within the controllable environment: causing at least a portion of the solvent to evaporate from the flowable dielectric on the integrated circuit, and spinning the integrated circuit again within the controllable environment to flow in the modified top layer of the flowable dielectric.
Claim 16
Dependent Claim
128 words
A process for applying spin-on-glass during manufacture of an integrated circuit, comprising: supporting the integrated circuit in a chamber which encloses a chamber environment; dispensing a solvent containing spin-on-glass on the integrated circuit in the chamber environment; covering the integrated circuit to provide a controllable environment within and separated from the chamber environment after the step of dispensing; modifying a top layer of the spin-on-glass to decrease viscosity of the top layer; spinning the integrated circuit at less than 500 revolutions per minute for longer than 2 seconds within the controllable environment to spread and flow in the spin-on-glass; uncovering the integrated circuit within the chamber to expose the integrated circuit to the chamber environment; spinning the integrated circuit to spin off excess spin-on-glass; and curing the spin-on-glass.
Claim 17
Dependent Claim
128 words
A process for applying spin-on-glass during manufacture of an integrated circuit, comprising: supporting the integrated circuit in a chamber which encloses a chamber environment; dispensing a solvent containing spin-on-glass on the integrated circuit in the chamber environment; covering the integrated circuit to provide a controllable environment within and separated from the chamber environment after the step of dispensing; modifying a top layer of the spin-on-glass to decrease viscosity of the top layer; spinning the integrated circuit at less than 500 revolutions per minute for longer than 2 seconds within the controllable environment to spread and flow in the spin-on-glass; uncovering the integrated circuit within the chamber to expose the integrated circuit to the chamber environment; spinning the integrated circuit to spin off excess spin-on-glass; and curing the spin-on-glass.
Claim 18
Dependent Claim
12 words
The process of claim 14, wherein the spin-on-glass comprises a siloxane polymer.
Claim 19
Dependent Claim
29 words
The process of claim 14, including during the step of spinning the integrated circuit within the controllable environment includes slowing down evaporation of the solvent in the controllable environment.
Claim 20
Dependent Claim
36 words
The process of claim 14, including during the step of spinning the integrated circuit within the controllable environment isolating the controllable environment from the chamber environment to prevent the solvent from escaping from the controllable environment.
Claim 21
Dependent Claim
28 words
The process of claim 14, including during the step of spinning the integrated circuit within the controllable environment, controlling vapor pressure in the controllable environment for selected materials.
Claim 22
Dependent Claim
24 words
The process of claim 14, including during the step of spinning the integrated circuit within the controllable environment, controlling temperature of the integrated circuit.
Claim 23
Dependent Claim
31 words
The process of claim 14, wherein the step of spinning the integrated circuit to spin off excess flowable dielectric comprises spinning the integrated circuit at more than 3000 revolution per minute.
Claim 24
Dependent Claim
145 words
A process for applying spin-on-glass during manufacture of an integrated circuit, comprising: supporting the integrated circuit in a chamber which encloses a chamber environment; dispensing a solvent containing the spin-on-glass on the integrated circuit in the chamber environment; covering the integrated circuit to provide a controllable environment within and separated from the chamber environment after the step of dispensing, so the evaporation of the solvent is controlled; spinning the integrated circuit within the controllable environment to spread and flow in the spin-on-glass; causing evaporation of a portion of the solvent and establishing a flowable top layer of the deposited spin-on-glass; spinning the integrated circuit again within the controllable environment to flow in the flowable top layer of the spin-on-glass; uncovering the integrated circuit to expose the integated circuit the chamber environment; spinning the integrated circuit to spin off the excess spin-on-glass; and curing the spin-on-glass.
Claim 25
Dependent Claim
145 words
A process for applying spin-on-glass during manufacture of an integrated circuit, comprising: supporting the integrated circuit in a chamber which encloses a chamber environment; dispensing a solvent containing the spin-on-glass on the integrated circuit in the chamber environment; covering the integrated circuit to provide a controllable environment within and separated from the chamber environment after the step of dispensing, so the evaporation of the solvent is controlled; spinning the integrated circuit within the controllable environment to spread and flow in the spin-on-glass; causing evaporation of a portion of the solvent and establishing a flowable top layer of the deposited spin-on-glass; spinning the integrated circuit again within the controllable environment to flow in the flowable top layer of the spin-on-glass; uncovering the integrated circuit to expose the integated circuit the chamber environment; spinning the integrated circuit to spin off the excess spin-on-glass; and curing the spin-on-glass.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-02-09 | 2001-08-11 | 2002-02-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-02-09 | 2005-08-11 | 2006-02-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-02-09 | 2009-08-11 | 2010-02-10 | $7700.00 | Window Closed / Lapsed |