Patent US592215A successfully refreshed from Google Patents.
Patent US5716663A successfully refreshed from Google Patents.
US5716663A
Expired / Lapsed
US
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Multilayer printed circuit
Assignee: Ormet Circuits Inc
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Filing: 1995-06-07
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Granted: 1998-02-10
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Expires: 2015-06-07
Abstract
Abstract Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer as the principal components. The compositions may also comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; a reactive monomer or polymer; and a metal additive. Compositions comprising metal powder are ideally suited for creating the conductive paths and vias on printed circuits.
Inventors
- 👤 Miguel A. Capote
- 👤 Prudeep Gandhi
- 👤 Hope M. Viajar
- 👤 Wesley W. Walters
- 👤 Catherine Gallagher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 05:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; B23K35/22; B23K35/36; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/66; H10W70/666; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0263; H05K2201/0272; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2203/00; H05K2203/04; H05K2203/0425; H05K2203/11; H05K2203/1105; H05K3/30; H05K3/32; H05K3/34; H05K3/3489; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/4611; H05K3/4623; H10W72/00; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
265 words
A method of preparing a multilayer printed circuit board which comprises the steps of: (a) forming a first dielectric layer on a surface of a substrate wherein the first dielectric layer; (b) forming one or more first conductor grooves in said first dielectric layer and applying a first conductive ink composition into said first one or more conductor grooves; (c) heating the first conductive ink composition to a temperature and for a period of time sufficient to cure the first ink conductive composition whereby the cured first conductive ink composition forms first conductive traces; (d) forming an insulating layer on the surface of said first dielectric layer; (e) forming one or more vias in said insulating layer and applying a second conductive ink composition into said vias; (f) heating the second conductive ink composition to a temperature and for a period of time sufficient to cure the second ink conductive composition whereby the cured second conductive ink composition in said vias are in electrical contact with one or more of said first traces; (g) forming a second dielectric layer on the surface of said insulating layer wherein the second dielectric layer includes one or more second conductor grooves; (h) applying a third conductive ink composition into said second conductor grooves; (i) heating the third conductive ink composition to a temperature and for a period of time sufficient to cure the third ink conductive composition whereby the cured third conductive ink composition forms second conductive traces that are in electrical contact with the cured second conductive ink composition in said one or more of said vias.
Claim 2
Independent Claim
265 words
A method of preparing a multilayer printed circuit board which comprises the steps of: (a) forming a first dielectric layer on a surface of a substrate wherein the first dielectric layer; (b) forming one or more first conductor grooves in said first dielectric layer and applying a first conductive ink composition into said first one or more conductor grooves; (c) heating the first conductive ink composition to a temperature and for a period of time sufficient to cure the first ink conductive composition whereby the cured first conductive ink composition forms first conductive traces; (d) forming an insulating layer on the surface of said first dielectric layer; (e) forming one or more vias in said insulating layer and applying a second conductive ink composition into said vias; (f) heating the second conductive ink composition to a temperature and for a period of time sufficient to cure the second ink conductive composition whereby the cured second conductive ink composition in said vias are in electrical contact with one or more of said first traces; (g) forming a second dielectric layer on the surface of said insulating layer wherein the second dielectric layer includes one or more second conductor grooves; (h) applying a third conductive ink composition into said second conductor grooves; (i) heating the third conductive ink composition to a temperature and for a period of time sufficient to cure the third ink conductive composition whereby the cured third conductive ink composition forms second conductive traces that are in electrical contact with the cured second conductive ink composition in said one or more of said vias.
Claim 3
Dependent Claim
117 words
The method of claim 1 further comprising the steps of: forming one or more additional layers of dielectric material having conductive traces, wherein each addition layer is fabricated by: (i) forming an insulating layer on the surface of the last dielectric layer wherein said insulating layer includes one or more vias; (ii) forming a dielectric layer on a surface of the insulating layer wherein the dielectric layer includes one or more conductor grooves; (iii) applying a conductive ink composition into said one or more conductor grooves; (iv) heating the conductive ink composition to a temperature and for a period of time sufficient to cure the conductive ink composition, whereby the cured ink conductive composition forms conductive traces.
Claim 4
Dependent Claim
69 words
The method of claim 1 wherein the first, second, and third conductive ink compositions each comprises: 0-65% by volume of a high melting point metal, 6-65% by volume of a low melting point metal or metal alloy, 0-45% by volume of a resin, 0.01-61% by volume of a chemically protected, cross-link agent, 0-50% by volume of a reactive monomer or polymer, and 0-10% by volume of a metal additive.
Claim 5
Dependent Claim
33 words
The method of claim 3 wherein the step of curing each conductive ink composition comprises: heating at a temperature between about 100° to about 350° C. for a minimum of about 30 seconds.
Claim 6
Dependent Claim
66 words
The method of claim 1 further comprising the steps of: (i) forming one or more holes in the multilayer printed circuit board; (ii) applying a fourth conductive ink composition by vacuum to coat the surface of said one or more holes; and (iii) heating the fourth conductive ink composition to a temperature and for a period of time sufficient to cure the fourth conductive ink composition.
Claim 7
Dependent Claim
20 words
The method of claim 1 wherein the one or more conductor grooves in each dielectric layer are formed by photoimaging.
Claim 8
Dependent Claim
27 words
The method of claim 1 wherein the first and second conductive traces each has a minimum width of 0.001 inches and a minimum thickness of 0.0005 inches.
Claim 9
Dependent Claim
64 words
The method of claim 1 wherein the conductive ink composition comprises: 13-65% by volume of a high melting point metal, 6-29% by volume of a low melting point metal or metal alloy, 0-15% by volume of a resin, 7-60% by volume of a chemically protected, cross-link agent, 0-32% by volume of a reactive monomer or polymer, and 0-10% by volume of a metal additive.
Claim 10
Dependent Claim
59 words
The method of claim 1 wherein the substrate is formed from a material selected from the group consisting of first materials consisting of epoxy, polyimide, BT-expoxy, cyanate ester, phenolic, polyetherimide, polyethersulfone, polyetheretherketone, liquid crystal polymer, polyarylsufone, second materials consisting of any said first materials that is reinforced with, glass, paper or aramid fiber, metal, glass, quartz, graphite, and ceramic.
Claim 11
Dependent Claim
64 words
The method of claim 1 wherein the conductive ink composition comprises: 25-60% by volume of a high melting point metal, 8-29% by volume of a low melting point metal or metal alloy, 0-12% by volume of a resin, 7-45% by volume of a chemically protected, cross-link agent, 0-28% by volume of a reactive monomer or polymer, and 0-5% by volume of a metal additive.
Claim 12
Independent Claim
123 words
A method of preparing a multilayer printed circuit board which comprises the steps of: (a) depositing a first conductive ink composition onto the surface of a substrate which defines a first circuit pattern; (b) curing said first conductive ink composition; (c) depositing a first dielectric material on the surface of said first circuit pattern so as to define one or more vias that are not coated with said first dielectric material; (d) depositing a second conductive ink composition onto the surface of said first dielectric material and into said one or more vias, wherein the second conductive ink composition defines a second circuit pattern that is in communication with said one or more first vias; and (e) curing said second conductive ink composition.
Claim 13
Independent Claim
123 words
A method of preparing a multilayer printed circuit board which comprises the steps of: (a) depositing a first conductive ink composition onto the surface of a substrate which defines a first circuit pattern; (b) curing said first conductive ink composition; (c) depositing a first dielectric material on the surface of said first circuit pattern so as to define one or more vias that are not coated with said first dielectric material; (d) depositing a second conductive ink composition onto the surface of said first dielectric material and into said one or more vias, wherein the second conductive ink composition defines a second circuit pattern that is in communication with said one or more first vias; and (e) curing said second conductive ink composition.
Claim 14
Dependent Claim
106 words
The method of claim 11 further comprising the steps of: forming one or more additional layers of circuit patterns, wherein each addition layer is fabricated by: (i) depositing a dielectric material on the surface of said previous circuit pattern so as to define one or more vias that are not coated with said dielectric material; and (ii) depositing a conductive ink composition onto the surface of said dielectric material and into said one ore more vias, wherein the conductive ink composition defines a circuit pattern that is in communication with said one or more vias in the dielectric material; and (iii) curing the conductive ink composition.
Claim 15
Dependent Claim
68 words
The method of claim 11 wherein the first and second conductive ink compositions each comprises: 0-65% by volume of a high melting point metal, 6-65% by volume of a low melting point metal or metal alloy, 0-45% by volume of a resin, 0.1-61% by volume of a chemically protected, cross-link agent, 0-50% by volume of a reactive monomer or polymer, and 0.5-10% by volume of a metal additive.
Claim 16
Dependent Claim
34 words
The method of claim 11 wherein the step of curing each conductive ink composition comprises: heating at a temperature at between about 100° to about 350° C. for a minimum of about 5 seconds.
Claim 17
Dependent Claim
59 words
The method of claim 11 further comprising the steps of: (i) forming one or more holes in the substrate; (ii) applying conductive ink composition by vacuum to coat the surface of said one or more holes; and (iii) heating the conductive ink composition to a temperature and for a period of time sufficient to cure the conductive ink composition.
Claim 18
Dependent Claim
15 words
The method of claim 11 wherein the step of depositing each dielectric material comprises photoimaging.
Claim 19
Dependent Claim
25 words
The method of claim 11 wherein curing said first and second conductive ink compositions form conductive traces each with a minimum width of 0.001 inches.
Claim 20
Dependent Claim
64 words
The method of claim 11 wherein the conductive ink composition comprises 13-65% by volume of a high melting point metal, 6-29% by volume of a low melting point metal or metal alloy, 0-15% by volume of a resin, 7-60% by volume of a chemically protected, cross-link agent, 0-32% by volume of a reactive monomer or polymer, and 0.5-10% by volume of a metal additive.
Claim 21
Dependent Claim
60 words
The method of claim 11 wherein the substrate is formed from a material selected from the group consisting of first materials consisting of epoxy, polyimide, BT-epoxy, cyanate ester, phenolic, polyetherimide, polyethersulfone, polyetheretherketone, liquid crystal polymer, polyarylsufone, second materials consisting of any of said first materials that is reinforced with, glass, paper or aramid fiber metal, glass, quartz, graphite, and ceramic.
Claim 22
Dependent Claim
64 words
The method of claim 11 wherein the conductive ink composition comprises: 25-60% by volume of a high melting point metal, 8-29% by volume of a low melting point metal or metal alloy, 0-12% by volume of a resin, 7-45% by volume of a chemically protected, cross-link agent, 0-28% by volume of a reactive monomer or polymer, and 0-5% by volume of a metal additive.
Claim 23
Independent Claim
110 words
A method of preparing a multilayer printed circuit board which comprises the steps of: (a) providing a plurality of substrates wherein each substrate defines one or more openings; (b) coating the surfaces of said openings with a first conductive ink composition wherein the one or more openings define one or more vias; (c) forming a patterned layer of a second conductive ink composition on a surface of each substrate; (d) aligning the plurality of substrates; (e) laminating the substrates with sufficient pressure to cause the second conductive ink composition from the patterned layers to fill said one or more vias; and (f) curing the first and second conductive ink compositions.
Claim 24
Independent Claim
110 words
A method of preparing a multilayer printed circuit board which comprises the steps of: (a) providing a plurality of substrates wherein each substrate defines one or more openings; (b) coating the surfaces of said openings with a first conductive ink composition wherein the one or more openings define one or more vias; (c) forming a patterned layer of a second conductive ink composition on a surface of each substrate; (d) aligning the plurality of substrates; (e) laminating the substrates with sufficient pressure to cause the second conductive ink composition from the patterned layers to fill said one or more vias; and (f) curing the first and second conductive ink compositions.
Claim 25
Dependent Claim
25 words
The method of claim 21 wherein said first conductive ink composition is coated on the surface of said openings is cured prior to step d.
Claim 26
Dependent Claim
64 words
The method of claim 21 wherein the conductive ink composition comprises: 0-65% by volume of a high melting point metal, 6-65% by volume of a low melting point metal or metal alloy, 0-45% by volume of a resin, 0.01-61% by volume of a chemically protected, cross-link agent, 0-50% by volume of a reactive monomer or polymer, and 0-10% by volume of a metal additive.
Claim 27
Dependent Claim
13 words
The method of claim 21 wherein each patterned layer is formed by photoimaging.
Claim 28
Dependent Claim
16 words
The method of claim 21 wherein each patterned layer is formed by screen or stencil printing.
Claim 29
Dependent Claim
37 words
The method of claim 21 wherein the step of curing the first and second conductive ink compositions comprises: heating at a temperature at between about 100° to about 350° C. for a minimum of about 5 seconds.
Claim 30
Dependent Claim
26 words
The method of claim 21 wherein the second conductive ink composition on said patterned layer when cured forms traces each with minimum width of 0.001 inches.
Claim 31
Dependent Claim
64 words
The method of claim 21 wherein each conductive ink composition comprises: 13-65% by volume of a high melting point metal, 6-29% by volume of a low melting point metal or metal alloy, 0-15% by volume of a resin. 7-60% by volume of a chemically protected, cross-link agent, 0-32% by volume of a reactive monomer or polymer, and 0.5-10% by volume of a metal additive.
Claim 32
Dependent Claim
21 words
The method of claim 21 wherein step (b) of coating said one or more holes is achieved by a vacuum process.
Claim 33
Dependent Claim
19 words
The method of claim 21 wherein the thickness of each substrate is between about 0.002 to about 2 inches.
Claim 34
Dependent Claim
22 words
The method of claim 21 wherein the patterned layer of the second conductive ink composition is formed by screen or stencil printing.
Claim 35
Dependent Claim
52 words
The method of claim 21 wherein step (b) of coating said one or more holes comprises using screen or stencil printing to deposit said first conductive composition into said one or more holes and then applying vacuum to uniformly distribute said first conductive ink composition over the entire surface of said holes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-02-09 | 2001-08-11 | 2002-02-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-02-09 | 2005-08-11 | 2006-02-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-02-09 | 2009-08-11 | 2010-02-10 | $7700.00 | Window Closed / Lapsed |