US5139819A
Expired / Lapsed
US
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Fast curing and storage stable thermoset polymer thick film compositions
Assignee: Acheson Industries Inc
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Filing: 1991-07-29
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Granted: 1992-08-18
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Expires: 2011-07-29
Abstract
Abstract A thermally curable polymer thick film compositions comprising, by weight: (a) about 3-15 parts of at least one poly(hydroxystyrene) resin; (b) a crosslinking resin selected from the group consisting of: (i) about 5-25 parts of at least one blocked isocyanate resin; or (ii) about 2-10 parts of at least one melamine-formaldehyde resin; (c) an effective amount of at least one organic solvent capable of substantially dissolving (a) and (b) ingredients; (d) conductive particulate matter selected from the group consisting of: (i) about 50-80 parts silver flake; (ii) a graphite/carbon black mixture consisting of: (aa) about 15-45 parts graphite; and (bb) about 1-10 parts carbon black; or (iii) a mixture of (i) and (ii).
Inventors
- 👤 Richard L. Frentzel
- 👤 Warren R. Oakdale
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 03:23
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; C; C08; C08G; C08G18/00; C08G18/06; C08G18/28; C08G18/40; C08G18/62; C08G18/6204; C08L; C08L25/00; C08L25/18; C08L61/00; C08L61/20; C08L61/26; C08L61/28; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H01B1/24
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
149 words
A method of curing a polymer thick film on a substrate comprising the steps of: (1) providing a polymer thick film composition comprising, by weight: (a) about 3-15 parts of at least one poly(hydroxystyrene) resin; and (b) a crosslinking resin selected from the group consisting of: (i) about 5-25 parts of at least one blocked isocyanate resin; and (ii) about 2-10 parts of at least one melamine-formaldehyde resin; (c) an effective amount of at least one organic solvent capable of substantially dissolving (a) and (b) ingredients; and (d) a conductive material selected from the group consisting of: (i) about 50-80 parts silver flake; and (ii) an admixture of about 15-45 parts graphite and about 1-10 parts carbon black; or (iii) a mixture of (i) and (ii); (2) applying said composition to a substrate; and (3) curing said composition onto said substrate by exposing the coated substrate to elevated temperatures.
Claim 2
Independent Claim
149 words
A method of curing a polymer thick film on a substrate comprising the steps of: (1) providing a polymer thick film composition comprising, by weight: (a) about 3-15 parts of at least one poly(hydroxystyrene) resin; and (b) a crosslinking resin selected from the group consisting of: (i) about 5-25 parts of at least one blocked isocyanate resin; and (ii) about 2-10 parts of at least one melamine-formaldehyde resin; (c) an effective amount of at least one organic solvent capable of substantially dissolving (a) and (b) ingredients; and (d) a conductive material selected from the group consisting of: (i) about 50-80 parts silver flake; and (ii) an admixture of about 15-45 parts graphite and about 1-10 parts carbon black; or (iii) a mixture of (i) and (ii); (2) applying said composition to a substrate; and (3) curing said composition onto said substrate by exposing the coated substrate to elevated temperatures.
Claim 3
Dependent Claim
14 words
The method of claim 1, wherein said applying step 2 is a screen-printing operation.
Claim 4
Dependent Claim
40 words
The method of claim 1, wherein said curing step is carried out in a convection oven at a temperature from about 120° C. to about 150° C. for a period of time from about 90 minutes to about 20 minutes.
Claim 5
Dependent Claim
27 words
The method of claim 1, wherein said curing step is carried out in an infrared oven at a temperature from about 180°-250° C. for about 2-30 minutes.
Claim 6
Dependent Claim
62 words
The method of claim 1 wherein said solvent is at least one nonhydrocarbon polar solvent capable of dissolving the resin system, the amount of said solvent being sufficient to substantially dissolve the resin system and to adjust the viscosity of said polymer thick film composition in order to make it applicable to a substrate in the form of an electrically conductive circuitry.
Claim 7
Dependent Claim
28 words
The method of claim 5 wherein the amount of said solvent is from about 15 parts to about 60 parts by weight of said polymer thick film composition.
Claim 8
Dependent Claim
37 words
The method of claim 6 wherein said solvent is selected from the group consisting of diethylene glycol monoethyl ether; diethylene glycol dimethyl ether; dibasic ester solvent; diethylene glycol monoethyl ether acetate; and diethylene glycol monobutyl ether acetate.
Claim 9
Dependent Claim
28 words
The method of claim 7 wherein the amount of said solvent is from about 20 parts to about 50 parts by weight of said polymer thick film composition.
Claim 10
Dependent Claim
14 words
The method of claim 8 wherein said solvent is diethylene glycol monoethyl ether acetate.
Claim 11
Dependent Claim
19 words
The method of claim 1 wherein said thermally curable conductive polymer thick film composition further comprises a polymerization catalyst.
Claim 12
Dependent Claim
27 words
The method of claim 10 wherein said polymerization catalyst is selected from the group consisting of zinc octoate, toluene sulfonic acid, and an amineorgano tin catalyst system.
Claim 13
Dependent Claim
26 words
The method of claim 11 wherein said thermally curable conductive polymer thick film composition contains about 0.05 parts to about 2 parts of said polymerization catalyst.
Claim 14
Dependent Claim
19 words
The method of claim 1 wherein said thermally curable conductive polymer thick film composition further comprises a flow additive.
Claim 15
Dependent Claim
37 words
The method of claim 13 wherein said flow additive is selected from the group consisting of a silicon polymer, ethyl acrylate/2-ethylhexyl acrylate copolymer, and an alkylolammonium salt of acidic phosphoric acid esters of ketoxime and mixtures thereof.
Claim 16
Dependent Claim
28 words
The method of claim 14 wherein said thermally curable conductive polymer thick film composition contains about 0.5 parts to about 2 parts by weight of said flow additive.
Claim 17
Dependent Claim
24 words
The method of claim 1 wherein said poly(hydroxystyrene) resin is a linear poly(p-hydroxystyrene) resin having a molecular weight from about 6,000 to about 250,000.
Claim 18
Dependent Claim
19 words
The method of claim 1 wherein said blocked isocyanate resin is a blocked aliphatic isocyanate based on hexamethylene di-isocyanate.
Claim 19
Dependent Claim
11 words
The method of claim 1 wherein said melamine-formaldehyde resin is hexamethoxymethylmelamine.
Claim 20
Dependent Claim
114 words
The method of claim 1 wherein said thermally curable conductive polymer thick film comprises, by weight: (a) about 5-13.5 parts of at least one linear poly(p-hydroxystyrene) resin having a molecular weight from about 6,000 to about 250,000; (b) a crosslinking resin selected from the group consisting of: (i) about 8-22 parts of at least one blocked aliphatic isocyanate resin made from hexamethylene di-isocyanate; (ii) about 3-9 parts of a hexamethoxymethylmelamine resin; (c) about 20-50 parts of said carbitol acetate solvent; and (d) a particulated electrically conductive material selected from the group consisting of: (i) about 60-70 parts silver flake; or (ii) an admixture of about 23-30 parts graphite and about 2.5-6 parts carbon black.
References Cited (Backward Citations)
US4704231A
Cited
US4971726A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1995-08-18 | 1996-02-17 | 1996-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-18 | 2000-02-17 | 2000-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-18 | 2004-02-17 | 2004-08-18 | $7700.00 | Window Closed / Lapsed |