US4996005A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Conductive composition and method for manufacturing printed circuit substrate
Assignee: Alps Alpine Co Ltd
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Filing: 1988-06-09
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Granted: 1991-02-26
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Expires: 2008-06-09
Abstract
Abstract A conductive composition comprising conductive particles made of a mechanical composite powder of copper or nickel covered with silver and a binder mainly containing bis-phenol A type epoxy resin (diglycidyl ether of bisphenol A) having 1600 to 5500 of molecular weight method for manufacturing a printed circuit substrate comprising the steps of printing the conductive composition on an insulating substrate and partially curing it in a range of 20 to 70% of completion as determined from DTA reactivity data. Thus, the conductive composition can manufacture an inexpensive circuit in simple steps as a whole with good solderability using low melting point solder and having high bonding strength. The method can manufacture the circuit by using the same conductive composition.
Inventors
- 👤 Mitsuru Saito
- 👤 Satoru Matsumora
- 👤 Yasushi Watanabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:23
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H01; H01B; H01B1/00; H01B1/20; H01B1/22
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
119 words
A conductive composition comprising: conductive particles which comprise copper, wherein said copper particles are coated with particles of silver, said silver particles being present in an amount at least to coat said copper particles sufficiently to minimize oxidation of said copper; a binder which comprises diglycidyl ether of bisphenol A epoxy resin, wherein said binder has a molecular weight of from 1,600 to 5,500, said binder being present in said composition in a ratio to said conductive particles capable of at least dispersing said conductive particles before said binder is cured; and a hardener selected from the group consisting of diaminodiphenolsulfon, diaminodiphenylmethane, and 2-ethyl-4-methylimidazole, wherein said hardener is present in an amount sufficient to cause said binder to cure.
Claim 2
Dependent Claim
119 words
A conductive composition comprising: conductive particles which comprise copper, wherein said copper particles are coated with particles of silver, said silver particles being present in an amount at least to coat said copper particles sufficiently to minimize oxidation of said copper; a binder which comprises diglycidyl ether of bisphenol A epoxy resin, wherein said binder has a molecular weight of from 1,600 to 5,500, said binder being present in said composition in a ratio to said conductive particles capable of at least dispersing said conductive particles before said binder is cured; and a hardener selected from the group consisting of diaminodiphenolsulfon, diaminodiphenylmethane, and 2-ethyl-4-methylimidazole, wherein said hardener is present in an amount sufficient to cause said binder to cure.
Claim 3
Dependent Claim
29 words
A conductive composition according to claim 1, wherein a solids content range of said conductive particles to said conductive particles plus said binder is 40 to 55% by volume.
Claim 4
Dependent Claim
32 words
A conductive composition according to claim 2, wherein said amount of said copper particles to said amount of said silver particles is in a ratio of from 20:80 to 60:40 by volume.
Claim 5
Dependent Claim
22 words
A conductive composition according to claim 3, wherein said ratio of said copper particles to said silver particles is 50:50 by volume.
Claim 6
Dependent Claim
17 words
A conductive composition according to claim 4, wherein said silver particles are press-bonded to said copper particles.
Claim 7
Dependent Claim
32 words
A conductive composition according to claim 1, wherein said amount of said nickel particles to said amount of said silver particles is in a ratio of from 20:80 to 60:40 by volume.
Claim 8
Dependent Claim
22 words
A conductive composition according to claim 6, wherein said ratio of said nickel particles to said silver particles is 50:50 by volume.
Claim 9
Dependent Claim
17 words
A conductive composition according to claim 7, wherein said silver particles are press-bonded to said nickel particles.
Claim 10
Dependent Claim
29 words
A conductive composition according to claim 8, wherein a solids content range of said conductive particles to said conductive particles plus said binder is 40 to 55% by volume.
Claim 11
Dependent Claim
119 words
A conductive composition comprising: conductive particles which comprise nickel, wherein said nickel particles are coated with particles of silver, said silver particles being present in an amount at least to coat said nickel particles sufficiently to minimize oxidation of said nickel; a binder which comprises diglycidyl ether of bisphenol A epoxy resin, wherein said binder has a molecular weight of from 1,600 to 5,500, said binder being present in said composition in a ratio to said conductive particles capable of at least dispersing said conductive particles before said binder is cured; and a hardener selected from the group consisting of diaminodiphenolsulfon, diaminodiphenylmethane, and 2-ethyl-4-methylimidazole, wherein said hardener is present in an amount sufficient to cause said binder to cure.
Claim 12
Dependent Claim
119 words
A conductive composition comprising: conductive particles which comprise nickel, wherein said nickel particles are coated with particles of silver, said silver particles being present in an amount at least to coat said nickel particles sufficiently to minimize oxidation of said nickel; a binder which comprises diglycidyl ether of bisphenol A epoxy resin, wherein said binder has a molecular weight of from 1,600 to 5,500, said binder being present in said composition in a ratio to said conductive particles capable of at least dispersing said conductive particles before said binder is cured; and a hardener selected from the group consisting of diaminodiphenolsulfon, diaminodiphenylmethane, and 2-ethyl-4-methylimidazole, wherein said hardener is present in an amount sufficient to cause said binder to cure.
Claim 13
Dependent Claim
114 words
A conductive composition comprising: conductive particles which comprise copper, wherein said copper particles are coated with particles of silver, said copper particles being mixed in a ratio to said silver particles ranging from 20:80 to 60:40 by volume; a binder which comprises diglycidyl ether of bisphenol A epoxy resin, wherein said binder has a molecular weight of from 1,600 to 5,500, wherein said conductive particles to said conductive particles plus said binder is provided in a range of 40 to 55% by volume in solids content; and a hardener selected from the group consisting of diaminodiphenolsulfon, diaminodiphenylmethane, and 2-ethyl-4-methylimidazole, wherein said hardener is present in an amount sufficient to cause said binder to cure.
Claim 14
Dependent Claim
114 words
A conductive composition comprising: conductive particles which comprise copper, wherein said copper particles are coated with particles of silver, said copper particles being mixed in a ratio to said silver particles ranging from 20:80 to 60:40 by volume; a binder which comprises diglycidyl ether of bisphenol A epoxy resin, wherein said binder has a molecular weight of from 1,600 to 5,500, wherein said conductive particles to said conductive particles plus said binder is provided in a range of 40 to 55% by volume in solids content; and a hardener selected from the group consisting of diaminodiphenolsulfon, diaminodiphenylmethane, and 2-ethyl-4-methylimidazole, wherein said hardener is present in an amount sufficient to cause said binder to cure.
Claim 15
Dependent Claim
22 words
A conductive composition according to claim 11, wherein said ratio of said copper particles to said silver particles is 50:50 by volume.
Claim 16
Dependent Claim
17 words
A conductive composition according to claim 12, wherein said silver particles are press-bonded to said copper particles.
Claim 17
Dependent Claim
114 words
A conductive composition comprising: conductive particles which comprise nickel, wherein said nickel particles are coated with particles of silver, said nickel particles being mixed in a ratio to said silver particles ranging from 20:80 to 60:40 by volume; a binder which comprises diglycidyl ether of bisphenol A epoxy resin, wherein said binder has a molecular weight of from 1,600 to 5,500, wherein said conductive particles to said conductive particles plus said binder is provided in a range of 40 to 55% by volume in solids content; and a hardener selected from the group consisting of diaminodiphenolsulfon, diaminodiphenylmethane, and 2-ethyl-4-methylimidazole, wherein said hardener is present in an amount sufficient to cause said binder to cure.
Claim 18
Dependent Claim
114 words
A conductive composition comprising: conductive particles which comprise nickel, wherein said nickel particles are coated with particles of silver, said nickel particles being mixed in a ratio to said silver particles ranging from 20:80 to 60:40 by volume; a binder which comprises diglycidyl ether of bisphenol A epoxy resin, wherein said binder has a molecular weight of from 1,600 to 5,500, wherein said conductive particles to said conductive particles plus said binder is provided in a range of 40 to 55% by volume in solids content; and a hardener selected from the group consisting of diaminodiphenolsulfon, diaminodiphenylmethane, and 2-ethyl-4-methylimidazole, wherein said hardener is present in an amount sufficient to cause said binder to cure.
Claim 19
Dependent Claim
22 words
A conductive composition according to claim 14, wherein said ratio of said nickel particles to said silver particles is 50:50 by volume.
Claim 20
Dependent Claim
17 words
A conductive composition according to claim 15, wherein said silver particles are press-bonded to said nickel particles.
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