Patent US5633535A successfully refreshed from Google Patents.
US5633535A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Spacing control in electronic device assemblies
Assignee: Hewlett Packard Development Co LP
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Filing: 1995-01-27
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Granted: 1997-05-27
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Expires: 2015-01-27
Abstract
Abstract A method of forming standoff spacer pedestals on a device above the substrate by supporting the electronic device with the standoff spacer pedestals during solder reflow and bonding. Generally, the method comprising the steps of adhering at least one layer of film solder resist on the substrate, and eliminating the undesired portions of dry film solder resist to form the pedestals.
Inventors
- 👤 Clinton C. Chao
- 👤 Timothy V. Harper
- 👤 John C. Wynbeek
- 👤 Eric S. Schneider
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:24
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09909; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10734; H05K2203/00; H05K2203/04; H05K2203/0465; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/20; H10W72/241; H10W72/281; H10W72/285; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
119 words
An apparatus comprising: a substrate having a plurality of conductive pads; an electronic device connected to the substrate; the electronic device having a plurality of solder humps on a surface, the electronic device being electrically and mechanically attached to the substrate such that at least one solder bump is in contact with one of the conductive pads of the substrate; and a film spacer pedestal for controlling the spacing between the substrate and the electronic device, the pedestal physically attached to the substrate, the pedestal physically separated from the solder bumps, the pedestal having a substantially flat face, the flat face being in contact with the electronic device and the spacing being defined by the height of the pedestal.
Claim 2
Independent Claim
119 words
An apparatus comprising: a substrate having a plurality of conductive pads; an electronic device connected to the substrate; the electronic device having a plurality of solder humps on a surface, the electronic device being electrically and mechanically attached to the substrate such that at least one solder bump is in contact with one of the conductive pads of the substrate; and a film spacer pedestal for controlling the spacing between the substrate and the electronic device, the pedestal physically attached to the substrate, the pedestal physically separated from the solder bumps, the pedestal having a substantially flat face, the flat face being in contact with the electronic device and the spacing being defined by the height of the pedestal.
Claim 3
Dependent Claim
21 words
An apparatus as in claim 1, wherein the film spacer pedestal consists of at least one layer of film solder resist.
Claim 4
Dependent Claim
14 words
An apparatus as in claim 1, wherein the electronic device is an integrated circuit.
Claim 5
Dependent Claim
15 words
An apparatus as recited in claim 1, wherein the electronic device is a flip chip.
Claim 6
Dependent Claim
17 words
An apparatus as recited in claim 1, wherein the electronic device is a ball grid array package.
Claim 7
Dependent Claim
15 words
An apparatus as recited in claim 1, wherein the substrate is a printed circuit board.
Claim 8
Dependent Claim
14 words
An apparatus as recited in claim 1, wherein the substrate is a ceramic substrate.
Claim 9
Dependent Claim
14 words
An apparatus as recited in claim 1, wherein the substrate is a silicon substrate.
Claim 10
Dependent Claim
75 words
An apparatus as recited in claim 1, further comprising a plurality of film spacer pedestals for controlling the spacing between the substrate and the electronic device, the pedestals physically attached to the substrate, the pedestals physically separated from the solder bumps, the pedestals of substantially the same height and having a substantially flat face, the flat face being in contact with the electronic device and the spacing being defined by the height of the pedestals.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-26 | 2000-11-25 | 2001-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-26 | 2004-11-25 | 2005-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-26 | 2008-11-25 | 2009-05-27 | $7700.00 | Window Closed / Lapsed |