Patent US5629564A successfully refreshed from Google Patents.
US5629564A
Expired / Lapsed
US
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Electroplated solder terminal
Assignee: GlobalFoundries Inc
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Filing: 1995-02-23
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Granted: 1997-05-13
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Expires: 2015-02-23
Abstract
Abstract A structure for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.
Inventors
- 👤 Henry A. Nye, III
- 👤 Jeffrey F. Roeder
- 👤 Ho-Ming Tong
- 👤 Paul A. Totta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 03:31
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W72/01; H10W72/019; H10W72/012; H10W72/01951; H10W72/01953; H10W72/20; H10W72/251; H10W72/252; H10W72/29; H10W72/931; H10W72/934; H10W72/941; H10W72/9415
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
110 words
A solder terminal on a substrate containing at least one electrically conducting member and having a plurality of electrical contact regions separated by an insulator, comprising: a metallic adhesion layer, etchable using a process selective to said electrically conducting member, overlying said insulator and in contact with one of said plurality of electrical contact regions; a CrCu alloy layer overlying and in contact with said adhesion layer; said process for etching the metallic adhesion layer further being selective to said CrCu adhesion layer; a solder bonding metallic layer overlying and in contact with said CrCu layer; and, a layer of solder overlying and in contact with said solder bonding layer.
Claim 2
Dependent Claim
110 words
A solder terminal on a substrate containing at least one electrically conducting member and having a plurality of electrical contact regions separated by an insulator, comprising: a metallic adhesion layer, etchable using a process selective to said electrically conducting member, overlying said insulator and in contact with one of said plurality of electrical contact regions; a CrCu alloy layer overlying and in contact with said adhesion layer; said process for etching the metallic adhesion layer further being selective to said CrCu adhesion layer; a solder bonding metallic layer overlying and in contact with said CrCu layer; and, a layer of solder overlying and in contact with said solder bonding layer.
Claim 3
Dependent Claim
23 words
An improved solder terminal of claim 1, wherein said metallic adhesion layer is selected from a group consisting essentially of TiN and TiW.
Claim 4
Dependent Claim
36 words
An improved solder terminal of claim 1, wherein said metallic adhesion layer is made of two layers, a bottom Ti layer and a top layer selected from the group consisting essentially of TiN, TiW, and W.
Claim 5
Dependent Claim
21 words
A solder terminal of claim 1, wherein said metallic adhesion layer has a thickness in the range of 250Å to 2000Å.
Claim 6
Dependent Claim
15 words
A solder terminal of claim 1, wherein said metallic adhesion layer is preferably about 1000Å.
Claim 7
Dependent Claim
25 words
A solder terminal of claim 1, wherein said insulator is selected from a group consisting essentially of polyimides, silicon dioxide, silicon nitride and silicon oxynitride.
Claim 8
Dependent Claim
21 words
A solder terminal of claim 1, wherein said solder is selected from a group consisting essentially of Pb-Sn, Pb-In and Pb-Bi.
Claim 9
Dependent Claim
17 words
A solder terminal of claim 1, wherein said CrCu layer has a thickness greater than 250 Angstroms.
Claim 10
Dependent Claim
19 words
A solder terminal of claim 8, wherein said CrCu layer contains copper ranging from 20 to 80 atomic percent.
Claim 11
Dependent Claim
23 words
A solder terminal of claim 1, wherein said solder bonding layer is selected from a group consisting essentially of Cu, Co and Ni.
Claim 12
Dependent Claim
23 words
A solder terminal of claim 1, wherein said solder bonding layer has a thickness selected from the range of 1000Å to 2 microns.
Claim 13
Dependent Claim
106 words
A solder terminal on a substrate containing at least one electrically conducting member and having a plurality of electrical contact regions separated by an insulator, comprising: a metallic adhesion layer, selected from a group consisting essentially of TiN and TiW, overlying said insulator and in contact with one of said plurality of electrical contact regions; a CrCu alloy layer overlying and in contact with said adhesion layer; said metallic adhesion layer further being etchable selective to said CrCu layer; a solder bonding metallic layer overlying and in contact with said CrCu layer; and, a layer of solder overlying and in contact with said solder bonding layer.
Claim 14
Dependent Claim
106 words
A solder terminal on a substrate containing at least one electrically conducting member and having a plurality of electrical contact regions separated by an insulator, comprising: a metallic adhesion layer, selected from a group consisting essentially of TiN and TiW, overlying said insulator and in contact with one of said plurality of electrical contact regions; a CrCu alloy layer overlying and in contact with said adhesion layer; said metallic adhesion layer further being etchable selective to said CrCu layer; a solder bonding metallic layer overlying and in contact with said CrCu layer; and, a layer of solder overlying and in contact with said solder bonding layer.
Claim 15
Dependent Claim
59 words
A solder terminal of claim 12, wherein said metallic adhesion layer is made of two layers, a bottom Ti layer overlying and in contact with said insulator and one of said plurality of electrical contact regions and a top layer overlying and in contact with said Ti layer, selected from the group consisting essentially of TiN, TiW, and W.
Claim 16
Dependent Claim
21 words
A solder terminal of claim 12, wherein said metallic adhesion layer has a thickness in the range of 250Å to 2000Å.
Claim 17
Dependent Claim
15 words
A solder terminal of claim 12, wherein said metallic adhesion layer is preferably about 1000Å.
Claim 18
Dependent Claim
23 words
A solder terminal of claim 12, wherein said insulator is selected from a group comprising polyimides, silicon dioxide, silicon nitride and silicon oxynitride.
Claim 19
Dependent Claim
21 words
A solder terminal of claim 12, wherein said solder is selected from a group consisting essentially of Pb-Sn, Pb-In and Pb-Bi.
Claim 20
Dependent Claim
17 words
A solder terminal of claim 12, wherein said CrCu layer has a thickness greater than 250 Angstroms.
Claim 21
Dependent Claim
19 words
A solder terminal of claim 18, wherein said CrCu layer contains copper ranging from 20 to 80 atomic percent.
Claim 22
Dependent Claim
23 words
A solder terminal of claim 12, wherein said solder bonding layer is selected from a group consisting essentially of Cu, Co and Ni.
Claim 23
Dependent Claim
23 words
A solder terminal of claim 12, wherein said solder bonding layer has a thickness selected from the range of 1000Å to 2 microns.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-12 | 2000-11-11 | 2001-05-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-12 | 2004-11-11 | 2005-05-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-12 | 2008-11-11 | 2009-05-13 | $7700.00 | Window Closed / Lapsed |