Patent US5616206A successfully refreshed from Google Patents.
US5616206A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for arranging conductive particles on electrodes of substrate
Assignee: Ricoh Co Ltd
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Filing: 1994-06-16
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Granted: 1997-04-01
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Expires: 2014-06-16
Abstract
Abstract A method for arranging conductive particles on electrodes of a substrate, which electrically connect with electrodes of an electric part via the conductive particles. An adhesive layer is formed on the electrodes. Conductive particles are arranged on the adhesive layer in a predetermined pattern. Then, the conductive particles on said electrodes of a substrate are affixed thereon.
Inventors
- 👤 Tsutomu Sakatsu
- 👤 Yoshihiro Yoshida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 23:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10; H10W; H10W70/00; H10W70/099; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10234; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/03; H05K2203/0338; H05K2203/05; H05K2203/0502; H05K2203/0522; H05K3/10; H05K3/102; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
93 words
A method for arranging conductive particles on electrodes of a substrate, which electrically connect with electrodes of an electrical part via said conductive particles, comprising the steps of: disposing a mask having openings formed in a predetermined pattern onto a transcription board; filling said openings of said mask with conductive particles; separating said mask from said transcription board; transferring said conductive particles from said transcription board to electrodes of a substrate, said electrodes having an adhesive formed thereon; and fixing said conductive particles on said electrodes of a substrate by said adhesive layer.
Claim 2
Independent Claim
93 words
A method for arranging conductive particles on electrodes of a substrate, which electrically connect with electrodes of an electrical part via said conductive particles, comprising the steps of: disposing a mask having openings formed in a predetermined pattern onto a transcription board; filling said openings of said mask with conductive particles; separating said mask from said transcription board; transferring said conductive particles from said transcription board to electrodes of a substrate, said electrodes having an adhesive formed thereon; and fixing said conductive particles on said electrodes of a substrate by said adhesive layer.
Claim 3
Dependent Claim
55 words
The method of claim 1, wherein said adhesive layer formed on said electrodes is formed by the steps including: forming said adhesive layer on a rough surface of a transfer board; pressing said adhesive layer formed on said transfer board onto electrodes of said electrical part; and separating said transfer board from said electrical part.
Claim 4
Dependent Claim
24 words
The method of claim 1, wherein the size of said openings of said mask is less than twice the size of said conductive particles.
Claim 5
Dependent Claim
30 words
The method of claim 1, wherein said conductive particles are caused to enter said openings of said mask from a side of said mask facing away from said transcription board.
Claim 6
Dependent Claim
37 words
The method of claim 1, wherein said conductive particles are caused to enter said openings of said mask by magnetic force from a magnet located on a side of said mask facing away from said transcription board.
Claim 7
Dependent Claim
29 words
The method of claim 1, wherein said conductive particles are caused to enter said openings of said mask from a side of said mask opposite from said transcription board.
Claim 8
Independent Claim
109 words
A method for arranging electric conductive particles on electrodes of a first electronic part, which electrically connect with electrodes of a second part via the conductive particles, comprising the steps of: disposing a mask having openings formed in a predetermined pattern onto a transcription board; filling said openings of said mask with conductive particles; separating said mask from said transcription board; transforming conductive particles from said transcription board to electrodes of said first electronic part on which an adhesive layer has been formed; and fixing said conductive particles on said electrodes of said first electronic part by pressing said conductive particles against said electrodes and hardening said adhesive layer.
Claim 9
Independent Claim
109 words
A method for arranging electric conductive particles on electrodes of a first electronic part, which electrically connect with electrodes of a second part via the conductive particles, comprising the steps of: disposing a mask having openings formed in a predetermined pattern onto a transcription board; filling said openings of said mask with conductive particles; separating said mask from said transcription board; transforming conductive particles from said transcription board to electrodes of said first electronic part on which an adhesive layer has been formed; and fixing said conductive particles on said electrodes of said first electronic part by pressing said conductive particles against said electrodes and hardening said adhesive layer.
Claim 10
Dependent Claim
55 words
The method of claim 7, wherein said adhesive layer formed on said electrodes is formed by the steps including: forming said adhesive layer on a rough surface of a transfer board; pressing said adhesive layer formed on said transfer board onto electrodes of said electronic part; and separating said transfer board from said electronic part.
Claim 11
Dependent Claim
24 words
The method of claim 7, wherein the size of said openings of said mask is less than twice the size of said conductive particles.
Claim 12
Dependent Claim
29 words
The method of claim 7, wherein said conductive particles are caused to enter said openings of said mask from a side of said mask opposite from said transcription board.
Claim 13
Dependent Claim
39 words
The method of claim 7, wherein said conductive particles are caused to enter said openings of said mask by a magnetic force generated by a magnet located on a side of said mask facing away from said transcription board.
Claim 14
Dependent Claim
32 words
The method of claim 7, wherein said conductive particles are caused to enter said openings of said mask from a side opposite the contact surface between said mask and said transcription board.
Claim 15
Independent Claim
84 words
A method for arranging conductive particles on electrodes of a substrate, which electrically connect with electrodes of an electrical part via said conductive particles, comprising the steps of: arranging conductive particles on a transcription board in a predetermined pattern, said predetermined pattern being defined by a mask having openings formed thereon; transferring said conductive particles from said transcription board to electrodes of a substrate, said electrodes having an adhesive layer formed thereon; and fixing said conductive particles on said electrodes by said adhesive layer.
Claim 16
Independent Claim
84 words
A method for arranging conductive particles on electrodes of a substrate, which electrically connect with electrodes of an electrical part via said conductive particles, comprising the steps of: arranging conductive particles on a transcription board in a predetermined pattern, said predetermined pattern being defined by a mask having openings formed thereon; transferring said conductive particles from said transcription board to electrodes of a substrate, said electrodes having an adhesive layer formed thereon; and fixing said conductive particles on said electrodes by said adhesive layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-31 | 2000-09-30 | 2001-04-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-31 | 2004-09-30 | 2005-04-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-31 | 2008-09-30 | 2009-04-01 | $7700.00 | Window Closed / Lapsed |