US4744850A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for bonding an LSI chip on a wiring base
Assignee: Sharp Corp
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Filing: 1985-12-09
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Granted: 1988-05-17
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Expires: 2005-12-09
Abstract
Abstract A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles, scribing the wafer to be divided into each of the LSI chips, positioning each of the terminals of the LSI chip and each of the electrodes of the wiring base face to face, and bonding the LSI chip on the wiring base.
Inventors
- 👤 Yoshitugu Imano
- 👤 Kazuhito Ozawa
- 👤 Yoshitomo Kitanishi
- 👤 Katsuhide Shino
- 👤 Yukihiro Inoue
- 👤 Yoshinori Oogita
- 👤 Kazuhiro Nakao
- 👤 Shigeki Komaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:40
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W72/00; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/07331; H10W72/20; H10W72/30; H10W72/351; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1075; Y10T156/1077; Y10T156/1089
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
203 words
A method for preparing and optically bonding an LSI chip having terminals thereon to corresponding electrodes on the surface of a wiring base comprising the steps of: uniformly coating a translucent electrically insulative adhesive on the surface of a wafer comprising a plurality of LSI chips each having conductive terminals thereon; dispersing electrically conductive particles of substantially uniform diameter in said insulative adhesive such that said particles are not in contact with each other, said insulative adhesive having a thickness substantially equal to said diameter of said particles; heating said insulative adhesive inclusive of said electrically conductive particles; scribing said wafer such that it is divided into singular LSI chips; providing a wiring base having electrodes thereon, and optically positioning said terminals of each of said LSI chips on corresponding electrodes of said wiring base by manually placing said LSI chip on said wiring base in a facing relationship such that each of said terminals of said respective LSI chip is positioned opposite corresponding electrodes of said wiring base, said positioning being achieved optically or visually as a result of said translucent heat sensitive adhesive; and bonding said LSI chip to said wiring base by applying heat to said LSI chip under pressure.
Claim 2
Independent Claim
203 words
A method for preparing and optically bonding an LSI chip having terminals thereon to corresponding electrodes on the surface of a wiring base comprising the steps of: uniformly coating a translucent electrically insulative adhesive on the surface of a wafer comprising a plurality of LSI chips each having conductive terminals thereon; dispersing electrically conductive particles of substantially uniform diameter in said insulative adhesive such that said particles are not in contact with each other, said insulative adhesive having a thickness substantially equal to said diameter of said particles; heating said insulative adhesive inclusive of said electrically conductive particles; scribing said wafer such that it is divided into singular LSI chips; providing a wiring base having electrodes thereon, and optically positioning said terminals of each of said LSI chips on corresponding electrodes of said wiring base by manually placing said LSI chip on said wiring base in a facing relationship such that each of said terminals of said respective LSI chip is positioned opposite corresponding electrodes of said wiring base, said positioning being achieved optically or visually as a result of said translucent heat sensitive adhesive; and bonding said LSI chip to said wiring base by applying heat to said LSI chip under pressure.
Claim 3
Dependent Claim
25 words
The method of claim 1, wherein said insulative adhesive is selected from a heat melt resin, a heat shielding resin, and a delayed tack resin.
Claim 4
Dependent Claim
18 words
The method of claim 1, wherein said electrically conductive particles are selected from Ag, Au, Cu, and/or Ni.
Claim 5
Dependent Claim
17 words
The method of claim 1, wherein insulating particles are disposed between each of said electrically conductive particles.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-05-17 | 1991-11-16 | 1992-05-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-05-17 | 1995-11-16 | 1996-05-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-05-17 | 1999-11-16 | 2000-05-17 | $7700.00 | Window Closed / Lapsed |