Patent US5605863A successfully refreshed from Google Patents.
US5605863A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device packaging using heat spreaders and assisted deposition of wire bonds
Assignee: Texas Instruments Inc
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Filing: 1995-06-07
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Granted: 1997-02-25
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Expires: 2015-06-07
Abstract
Abstract A process for manufacturing device or die is presented which uses laser deposited leads, with a filler to bridge the gap between the die and the lead frame. The filler may be oxide, poly amide, a combination of oxide layers and poly amide layers, plastic or a plastic which has plastic coated beads of metal. The die and lead frame are placed on a heat spreader. Leads are formed over the filler material from bond pads on the lead frame to bond pads on the die. Various protective materials are placed over the die to protect it from the package. Over the protective material is another heat spreader or other device that is required to make the die function better. Typical devices are batteries, capacitors, or other die. Finally, the structure is encapsulated in a package of non-conductive material.
Inventors
- 👤 Kendall S. Wills
- 👤 Paul A. Rodriguez
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:43
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/099; H10W70/40; H10W70/464; H10W70/466; H10W70/475; H10W90/00; H10W90/811; H10W70/60; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/851; H10W72/874; H10W90/10; H10W90/20; H10W90/22; H10W90/701; H10W90/731; H10W90/736; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
96 words
A method of packaging a device, comprising the steps of: placing a die on a first heat spreader; positioning a lead frame on said first heat spreader and around said die; dispensing a filler material from said die to said lead frame; focusing a high intensity energy source on a region of said filler material where deposition is to take place; and depositing a bond lead from a bond pad on said die, across the die and said region of filler material where deposition is to take place, to a bond location on said lead frame.
Claim 2
Independent Claim
96 words
A method of packaging a device, comprising the steps of: placing a die on a first heat spreader; positioning a lead frame on said first heat spreader and around said die; dispensing a filler material from said die to said lead frame; focusing a high intensity energy source on a region of said filler material where deposition is to take place; and depositing a bond lead from a bond pad on said die, across the die and said region of filler material where deposition is to take place, to a bond location on said lead frame.
Claim 3
Dependent Claim
20 words
The method according to claim 1, further including the step of depositing a protective covering above and adjacent said die.
Claim 4
Dependent Claim
21 words
The method according to claim 2, further including the step of placing a second heat spreader above and adjacent said die.
Claim 5
Dependent Claim
23 words
The method according to claim 1, further including the step of inserting a lubricating material between said first heat spreader and said die.
Claim 6
Dependent Claim
12 words
The method according to claim 1, wherein said filler material is oxide.
Claim 7
Dependent Claim
13 words
The method according to claim 2, wherein said filler material is a plastic.
Claim 8
Dependent Claim
21 words
The method of claim 1, wherein said filler material includes spheres of conductive material covered with a hard electrically insulating coating.
Claim 9
Dependent Claim
11 words
The method of claim 7, wherein said conductive material is gold.
Claim 10
Dependent Claim
25 words
The method according to claim 3, wherein said filler material is a combination of at least one oxide layer and at least one plastic layer.
Claim 11
Dependent Claim
38 words
The method according to claim 1, wherein said step of focusing a high intensity energy source includes scanning said filler material where deposition is to take place to pyrolize said filler material into a fibrous, plastic/carbon conductive film.
Claim 12
Dependent Claim
20 words
The method according to claim 10, wherein said fibrous, plastic/carbon conductive film is supported by underlying partially reacted filler material.
Claim 13
Dependent Claim
13 words
The method according to claim 10, wherein said filler material is a plastic.
Claim 14
Dependent Claim
33 words
The method according to claim 12, further including the step of scanning said filler material with a lower intensity light to continue the polymerization process to harden the remainder of the filler material.
Claim 15
Dependent Claim
28 words
The method of claim 1, further including the step of encapsulating said die, said heat spreader and at least a portion of said lead frame in a package.
Claim 16
Independent Claim
92 words
A method of packaging a device, comprising the steps of: placing a die on a first heat spreader; positioning a lead frame on said first heat spreader and around said die; dispensing a filler material from said die to said lead frame; focusing a high intensity energy source on regions of said filler material where deposition is to take place; and depositing bond leads from bond pads on said die, across the die and said portion of filler material where deposition is to take place, to bond locations on said lead frame.
Claim 17
Independent Claim
92 words
A method of packaging a device, comprising the steps of: placing a die on a first heat spreader; positioning a lead frame on said first heat spreader and around said die; dispensing a filler material from said die to said lead frame; focusing a high intensity energy source on regions of said filler material where deposition is to take place; and depositing bond leads from bond pads on said die, across the die and said portion of filler material where deposition is to take place, to bond locations on said lead frame.
Claim 18
Dependent Claim
20 words
The method according to claim 15, further including the step of depositing a protective covering above and adjacent said die.
Claim 19
Dependent Claim
21 words
The method according to claim 16, further including the step of placing a second heat spreader above and adjacent said die.
Claim 20
Dependent Claim
13 words
The method according to claim 15, wherein said filler material is a plastic.
Claim 21
Dependent Claim
38 words
The method according to claim 15, wherein said step of focusing a high intensity energy source includes scanning said filler material where deposition is to take place to pyrolize said filler material into a fibrous, plastic/carbon conductive film.
Claim 22
Dependent Claim
33 words
The method according to claim 19, further including the step of scanning said filler material with a lower intensity light to continue the polymerization process to harden the remainder of the filler material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-02-25 | 2000-08-26 | 2001-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-02-25 | 2004-08-26 | 2005-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-02-25 | 2008-08-26 | 2009-02-25 | $7700.00 | Window Closed / Lapsed |