US5587336A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bump formation on yielded semiconductor dies
Assignee: NXP BV
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Filing: 1994-12-09
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Granted: 1996-12-24
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Expires: 2014-12-09
Abstract
Abstract The ball bump structure of the subject invention provides a hermetically sealed bond pad at the surface of a semiconductor chip. An adhesion pad is formed at the surface of the bond pad. The adhesion pad includes a barrier layer, preferably a titanium/tungsten alloy, and a bonding layer, for example, a sputtered gold layer. A gold ball bump is formed on the adhesion pad. Methods for forming the improved structure herein are also disclosed.
Inventors
- 👤 Tsing-Chow Wang
- 👤 Serena M. Luo
- 👤 Marlita F. Macaraeg
- 👤 Francisca Tung
- 👤 Thomas J. Massingill
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 15:28
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10W72/012; H10W72/01221; H10W72/01225; H10W72/01251; H10W72/20; H10W72/251; H10W72/252; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952; H10W72/981; H10W72/983
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
130 words
A method of forming an adhesion pad and ball bump structure on a surface of a semiconductor wafer, said method comprising: (a) depositing a barrier material onto the surface of the wafer; (b) depositing a bonding material onto the surface of the barrier material; (c) coating the wafer with a photoresist material; (d) processing the photoresist material to define an adhesion pad, including a barrier material and a bonding material, above a bond pad, and removing the photoresist material which does not define the adhesion pad; (e) etching the material not protected by the photoresist; (f) removing the photoresist material present after step (e) to expose the adhesion pad; (g) testing the wafer to determine good dies; and (h) forming a ball bump on the adhesion pad of good dies.
Claim 2
Independent Claim
130 words
A method of forming an adhesion pad and ball bump structure on a surface of a semiconductor wafer, said method comprising: (a) depositing a barrier material onto the surface of the wafer; (b) depositing a bonding material onto the surface of the barrier material; (c) coating the wafer with a photoresist material; (d) processing the photoresist material to define an adhesion pad, including a barrier material and a bonding material, above a bond pad, and removing the photoresist material which does not define the adhesion pad; (e) etching the material not protected by the photoresist; (f) removing the photoresist material present after step (e) to expose the adhesion pad; (g) testing the wafer to determine good dies; and (h) forming a ball bump on the adhesion pad of good dies.
Claim 3
Dependent Claim
25 words
A method of claim 1 wherein a layer of titanium/tungsten alloy provides the barrier material; and a layer of sputtered gold provides the bonding material.
Claim 4
Dependent Claim
43 words
A method of claim 2 further comprising depositing a first layer of titanium/tungsten alloy, depositing a second layer of nitrogen-stuffed titanium/tungsten alloy over said first layer, and depositing a third layer of titanium/tungsten alloy over said second layer to form said barrier material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-24 | 2000-06-24 | 2000-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-24 | 2004-06-24 | 2004-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-24 | 2008-06-24 | 2008-12-24 | $7700.00 | Window Closed / Lapsed |