US5289038A
Expired / Lapsed
US
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Bump electrode structure and semiconductor chip having the same
Assignee: Fuji Electric Co Ltd
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Filing: 1992-10-28
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Granted: 1994-02-22
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Expires: 2012-10-28
Abstract
Abstract A concave portion having a V-shaped cross section is dug in a semiconductor region of a chip, and a surface of the semiconductor region inclusive of the concave portion is covered with an insulation film. A wiring film connected to an integrated circuit device is disposed on the insulation film. A protection film covering the surface of the chip is provided with a window to expose the concave portion and a portion of the wiring film. The window is covered with a thin metal subbing film connected to the wiring film. A metal protrusion for a bump electrode is provided by an electroplating process so as to protrude from the concave portion.
Inventors
- 👤 Akira Amano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 09:00
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10D; H10D62/00; H10D62/10; H10D62/117; H10W72/012; H10W70/00; H10W70/60; H10W72/20; H10W72/241; H10W72/242; H10W72/251; H10W72/252; H10W72/29; H10W72/90; H10W72/941; H10W72/9415
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
137 words
A bump electrode structure for an integrated circuit device, comprising: a semiconductor region having a surface and provided with a concave portion having a V-shaped cross section, said semiconductor region including an integrated circuit device having a surface; an insulation film covering the surface of said semiconductor region inclusive of said concave portion; a metal wiring film disposed on said insulation film and connected to said integrated circuit device; a protection film covering said surface of said integrated circuit device and provided with a window in which only a predetermined region of said wiring film and said concave portion are exposed; a thin metal subbing film covering said window of said protection film and connected to said wiring film; and a metal protrusion having a root width of 30 μm or less provided on said subbing film.
Claim 2
Dependent Claim
137 words
A bump electrode structure for an integrated circuit device, comprising: a semiconductor region having a surface and provided with a concave portion having a V-shaped cross section, said semiconductor region including an integrated circuit device having a surface; an insulation film covering the surface of said semiconductor region inclusive of said concave portion; a metal wiring film disposed on said insulation film and connected to said integrated circuit device; a protection film covering said surface of said integrated circuit device and provided with a window in which only a predetermined region of said wiring film and said concave portion are exposed; a thin metal subbing film covering said window of said protection film and connected to said wiring film; and a metal protrusion having a root width of 30 μm or less provided on said subbing film.
Claim 3
Dependent Claim
27 words
The bump electrode structure as claimed in claim 1, wherein said concave portion has a depth which is the same as or larger than its opening width.
Claim 4
Dependent Claim
25 words
The bump electrode structure as claimed in claim 1, wherein said subbing film is composed of an upper subbing film and a lower subbing film.
Claim 5
Dependent Claim
40 words
The bump electrode structure as claimed in claim 1, wherein said protection film has another window and wherein said bump electrode comprises a connection pad extending from said wiring film and exposed within said another window in said protection film.
Claim 6
Dependent Claim
23 words
The bump electrode structure as claimed in claim 1, wherein said wiring film is provided with a window corresponding to said concave portion.
Claim 7
Dependent Claim
149 words
A semiconductor integrated circuit device chip with a bump electrode, comprising: a semiconductor chip having an integrated circuit device, said device having a surface; a semiconductor region included in said semiconductor chip and having a surface, said semiconductor region being provided with a concave portion having a V-shaped cross section; an insulation film covering the surface of said semiconductor region inclusive of said concave portion; a metal wiring film disposed on said insulation film and connected to said integrated circuit device; a protection film covering said surface of said integrated circuit device and provided with a window in which only a predetermined region of said wiring film and said concave portion are exposed; a thin metal subbing film covering said window of said protection film and connected to said wiring film; and a metal protrusion having a root width of 30 μm or less provided on said subbing film.
Claim 8
Dependent Claim
149 words
A semiconductor integrated circuit device chip with a bump electrode, comprising: a semiconductor chip having an integrated circuit device, said device having a surface; a semiconductor region included in said semiconductor chip and having a surface, said semiconductor region being provided with a concave portion having a V-shaped cross section; an insulation film covering the surface of said semiconductor region inclusive of said concave portion; a metal wiring film disposed on said insulation film and connected to said integrated circuit device; a protection film covering said surface of said integrated circuit device and provided with a window in which only a predetermined region of said wiring film and said concave portion are exposed; a thin metal subbing film covering said window of said protection film and connected to said wiring film; and a metal protrusion having a root width of 30 μm or less provided on said subbing film.
Claim 9
Dependent Claim
26 words
The semiconductor chip as claimed in claim 6, wherein said concave portion has a depth which is the same as or larger than its opening width.
Claim 10
Dependent Claim
24 words
The semiconductor chip as claimed in claim 6, wherein said subbing film is composed of an upper subbing film and a lower subbing film.
Claim 11
Dependent Claim
39 words
The semiconductor chip as claimed in claim 6, wherein said protection film has another window and wherein said bump electrode comprises a connection pad extending from said wiring film and exposed within said another window in said protection film.
Claim 12
Dependent Claim
22 words
The semiconductor chip as claimed in claim 6, wherein said wiring film is provided with a window corresponding to said concave portion.
References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1997-02-21 | 1997-08-23 | 1998-02-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-21 | 2001-08-23 | 2002-02-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-21 | 2005-08-23 | 2006-02-22 | $7700.00 | Window Closed / Lapsed |