Method for producing conductive or insulating feedthroughs in a substrate

Claim 1

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shockwaves are dissipated in said sheet, thereby avoiding fractures in said substrate, wherein said selecting step comprises selecting a sheet having a thickness of at least 0.1 mm.

Claim 2

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shockwaves are dissipated in said sheet, thereby avoiding fractures in said substrate, wherein said selecting step comprises selecting a sheet having a thickness of at least 0.1 mm.

Claim 3

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shockwaves are dissipated in said sheet, thereby avoiding fractures in said substrate, wherein said selecting step comprises selecting a sheet having a thickness of approximately 0.1 mm to 0.5 mm.

Claim 4

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shockwaves are dissipated in said sheet, thereby avoiding fractures in said substrate, wherein said selecting step comprises selecting a sheet having a thickness of approximately 0.1 mm to 0.5 mm.

Claim 5

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shockwaves are dissipated in said sheet, thereby avoiding fractures in said substrate, wherein said intimately bonding step comprises laminating said sheet to said substrate and wherein said selecting step comprises selecting a sheet having a thickness of at least 0.1 mm.

Claim 6

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shockwaves are dissipated in said sheet, thereby avoiding fractures in said substrate, wherein said intimately bonding step comprises laminating said sheet to said substrate and wherein said selecting step comprises selecting a sheet having a thickness of at least 0.1 mm.

Claim 7

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: depositing a sheet of material which is absorptive at said given wavelength and has a thickness, to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet of material behind said area, thereby creating said feedthrough in the substrate, wherein said intimately bonding step includes intimately bonding said sheet of material to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet of material and said thickness of the sheet of material is sufficiently great that said shockwaves are dissipated in said sheet of material, thereby avoiding fractures in said substrate, wherein said depositing step comprises depositing a sheet of material having a thickness of at least 0.1 mm.

Claim 8

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: depositing a sheet of material which is absorptive at said given wavelength and has a thickness, to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet of material behind said area, thereby creating said feedthrough in the substrate, wherein said intimately bonding step includes intimately bonding said sheet of material to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet of material and said thickness of the sheet of material is sufficiently great that said shockwaves are dissipated in said sheet of material, thereby avoiding fractures in said substrate, wherein said depositing step comprises depositing a sheet of material having a thickness of at least 0.1 mm.

Claim 9

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said selecting step involves selecting an electrical insulator sheet, said feedthrough thereby becoming an insulated feedthrough, and wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said substrate.

Claim 10

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; and illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said selecting step involves selecting an electrical insulator sheet, said feedthrough thereby becoming an insulated feedthrough, and wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said substrate.

Claim 11

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, and wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said substrate; and removing said sheet from said substrate.

Claim 12

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, and wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said substrate; and removing said sheet from said substrate.

Claim 13

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said selecting step involves selecting an electrical conductive sheet, said feedthrough thereby becoming a conductive feedthrough, and wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said substrate; and removing said sheet from said substrate.

Claim 14

A method for producing a feedthrough in a substrate having a front and back surface, wherein said substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a sheet which is absorptive at said given wavelength and has a thickness; intimately bonding said sheet to said back surface of the substrate; illuminating an area on said front surface of the substrate with laser radiation at said given wavelength at a power level sufficient to ablate a portion of said substrate, thereby creating an opening in said substrate and to ablate a volume of said sheet behind said area, thereby creating said feedthrough in the substrate, wherein said selecting step involves selecting an electrical conductive sheet, said feedthrough thereby becoming a conductive feedthrough, and wherein said intimately bonding step includes intimately bonding said sheet to said back surface of the substrate in a manner free of porosity and voids such that shock waves created in the substrate due to said illuminating step pass to said sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said substrate; and removing said sheet from said substrate.

Claim 16

A method for producing a two conductor feedthrough in a first substrate having a front and back surface, wherein said first substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a metal sheet which has a front and a back surface and is absorptive at said given wavelength and has a thickness; intimately bonding said front surface of the metal sheet to said back surface of the first substrate; selecting a second substrate which has a front and a back surface and is absorptive at said given wavelength; intimately bonding said back surface of the metal sheet to said front surface of the second substrate; illuminating an area on said front surface of the first substrate with laser radiation at said given wavelength and at a power level sufficient to ablate a portion of said first substrate at said area, thereby creating an opening in said first substrate, to ablate a portion of said metal sheet behind said area, thereby creating an opening in said metal sheet, and a volume of said second substrate behind said area, wherein said step of intimately bonding said front surface of the metal sheet includes intimately bonding said front surface of the metal sheet to said back surface of the first substrate in a manner free of porosity and voids such that shock waves created in the first substrate due to said illuminating step pass to said metal sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said first substrate, and said step of intimately bonding said back surface of the metal sheet includes intimately bonding said back surface of the metal sheet to said front surface of the second substrate in a manner free of porosity and voids such that shock waves created in the second substrate due to said illuminating step pass to said metal sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said second substrate; removing said second substrate from said metal sheet and said metal sheet from said first substrate, thereby yielding an outer conductor feedthrough; and inserting a wire through said outer conductor feedthrough, thereby producing said two conductor feedthrough in the first substrate.

Claim 17

A method for producing a two conductor feedthrough in a first substrate having a front and back surface, wherein said first substrate absorbs radiation at a given wavelength, comprising the steps of: selecting a metal sheet which has a front and a back surface and is absorptive at said given wavelength and has a thickness; intimately bonding said front surface of the metal sheet to said back surface of the first substrate; selecting a second substrate which has a front and a back surface and is absorptive at said given wavelength; intimately bonding said back surface of the metal sheet to said front surface of the second substrate; illuminating an area on said front surface of the first substrate with laser radiation at said given wavelength and at a power level sufficient to ablate a portion of said first substrate at said area, thereby creating an opening in said first substrate, to ablate a portion of said metal sheet behind said area, thereby creating an opening in said metal sheet, and a volume of said second substrate behind said area, wherein said step of intimately bonding said front surface of the metal sheet includes intimately bonding said front surface of the metal sheet to said back surface of the first substrate in a manner free of porosity and voids such that shock waves created in the first substrate due to said illuminating step pass to said metal sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said first substrate, and said step of intimately bonding said back surface of the metal sheet includes intimately bonding said back surface of the metal sheet to said front surface of the second substrate in a manner free of porosity and voids such that shock waves created in the second substrate due to said illuminating step pass to said metal sheet and said thickness of the sheet is sufficiently great that said shock waves are dissipated in said sheet, thereby avoiding fractures in said second substrate; removing said second substrate from said metal sheet and said metal sheet from said first substrate, thereby yielding an outer conductor feedthrough; and inserting a wire through said outer conductor feedthrough, thereby producing said two conductor feedthrough in the first substrate.