Laminated electronic package including a power/ground assembly

Claim 1

A laminated electronic packaging structure comprising a circuit board and a power/ground assembly: (A) said circuit board being formed of alternating layers of electrical insulating material and conducting material forming voltage planes and signal planes, and having a component mounting face defined by the surface of one of the layers of insulating material and having voltage pads and ground pads formed thereon and connecting with said voltage planes and said ground planes respectively; (B) said power/ground assembly being formed of alternating layers of: (i) an organic electrically-insulating material, (ii) at least a first layer of electrically-conducting material forming a first voltage plane, (iii) at least a second layer of electrically-conducting material forming a second voltage plane, and (iv) at least one layer of a structural material being free of electrical connections and including a component having a coefficient of thermal expansion (CTE) of less than about 17 ppm/C°. (C) said power/ground assembly having; (i) a power input face defined by the surface of one of the layers of organic insulating material and having formed thereon power connection sites connected to said power pads on said circuit board and ground connection sites connected to said ground pads on said circuit board; (ii) a first plurality of electrical conductors extending from at least one of the layers of conducting material of said power/ground assembly to said ground connection sites of said power input face of said power/ground assembly; (iii) a second plurality of electrical conductors extending from at least a second layer of said conducting material of said power/ground assembly to said power connection sites of said power input face of said power/ground assembly; (iv) at least one of said layers of electrically-conducting material and at least one of said layers of said structural material having openings therethrough through which at least some of said electrical conductors extend free of contact therewith; (D) the layers defining said power/supply assembly being selected in size and material such that the overall coefficient of thermal expansion of said power/supply assembly is substantially the same as the value of the coefficient of thermal expansion of said circuit board.