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US5126016A Expired / Lapsed US ⏱️ 0.0 years remaining

Circuitization of polymeric circuit boards with galvanic removal of chromium adhesion layers

Assignee: International Business Machines Corp
•
Filing: 1991-02-01
•
Granted: 1992-06-30
•
Expires: 2011-02-01
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Abstract

Abstract Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes the steps of depositing a chromium adhesion layer on the dielectric substrate, depositing a copper seed layer on the chromium adhesion layer, depositing photoresist on the copper seed layer, imaging and developing the photoresist, and forming a pattern of copper circuitization on the selected portions of the send copper layer. The chromium adhesion layer material is removed from the dielectric substrate by contacting the chromium adhesion layer with aqueous sulfuric acid electrolyte, while maintaining the chromium adhesion layer electrolytically in series with a counterelectrode, and maintaining the chromium adhesion layer anodic with respect to the counterelectrode. The chromium adhesion layer material is oxidized to soluble Cr +3 , while substantially avoiding formation of Cr +6 .

Inventors

  • 👤 John J. Glenning
  • 👤 Walter P. Pawlowski
  • 👤 Kenneth G. Sakorafos

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 13:01
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/07; H05K3/10; H05K3/108; H05K3/38; H05K3/388

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 110 words
In a method of fabricating a microelectronic package having copper circuitization on a dielectric substrate, comprising depositing a chromium adhesion layer on the dielectric substrate, depositing a copper seed layer on the chromium adhesion layer, depositing photoresist on the copper seed layer, imaging and developing the photoresist, and forming a pattern of copper circuitization on the selected portions of the seed copper layer, the improvement comprising removing chromium adhesion layer material from the dielectric substrate by contacting the chromium adhesion layer with aqueous sulfuric acid electrolyte while maintaining the chromium adhesion layer electrolytically in series with a counterelectrode, and maintaining the chromium adhesion layer anodic with respect to the counterelectrode.
Claim 2
Dependent Claim 110 words
In a method of fabricating a microelectronic package having copper circuitization on a dielectric substrate, comprising depositing a chromium adhesion layer on the dielectric substrate, depositing a copper seed layer on the chromium adhesion layer, depositing photoresist on the copper seed layer, imaging and developing the photoresist, and forming a pattern of copper circuitization on the selected portions of the seed copper layer, the improvement comprising removing chromium adhesion layer material from the dielectric substrate by contacting the chromium adhesion layer with aqueous sulfuric acid electrolyte while maintaining the chromium adhesion layer electrolytically in series with a counterelectrode, and maintaining the chromium adhesion layer anodic with respect to the counterelectrode.
Claim 3
Dependent Claim 16 words
The method of claim 1 comprising oxidizing chromium adhesion layer material to soluble Cr +3 .
Claim 4
Dependent Claim 23 words
The method of claim 2 comprising oxidizing chromium adhesion layer material to soluble Cr +3 while substantially avoiding formation of Cr +6 .
Claim 5
Dependent Claim 14 words
The method of claim 1 comprising electrodepositing the chromium adhesion layer onto the dielectric.
Claim 6
Dependent Claim 15 words
The method of claim 1 comprising sputter depositing the chromium adhesion layer onto the dielectric.
Claim 7
Dependent Claim 15 words
The method of claim 1 wherein the aqueous sulfuric acid is dilute aqueous sulfuric acid.
Claim 8
Dependent Claim 31 words
The method of claim 6 wherein the dilute aqueous sulfuric acid contains from about 10 volume percent H 2 SO 4 to about 25 volume percent H 2 SO 4 .
Claim 9
Dependent Claim 15 words
The method of claim 6 wherein the electrolyte is substantially free of Cl - ion.
Claim 10
Dependent Claim 15 words
The method of claim 1 wherein the counterelectrode comprises a metal more electronegative than chromium.
Claim 11
Dependent Claim 20 words
The method of claim 8 wherein the counterelectrode comprises a metal chosen from the group consisting of Ti and Ni.

References Cited (Backward Citations)

US2840521A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-06-30 1995-12-30 1996-06-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-06-30 1999-12-30 2000-06-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-06-30 2003-12-30 2004-06-30 $7700.00 Window Closed / Lapsed

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