Patent US5556808A successfully refreshed from Google Patents.
US5556808A
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Method for aligning a semiconductor device
Assignee: Motorola Solutions Inc
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Filing: 1994-06-30
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Granted: 1996-09-17
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Expires: 2014-06-30
Abstract
Abstract A system and method for aligning a semiconductor device (10) to a fixture (11) is provided. A first physical alignment feature (12) on the semiconductor device (10) and a second physical alignment (24) on the fixture (11) mate to align and hold the semiconductor device (10) in place. In one embodiment the physical alignment features (12) and (24) are produced using standard photolithography techniques, resulting in precise alignment features. In another embodiment the physical alignment features (12) and (24) are designed and placed to control the direction the thermal expansion of the semiconductor device (10) relative to the fixture (11).
Inventors
- 👤 William M. Williams
- 👤 Barbara Vasquez
- 👤 Marlene J. Begay
- 👤 Patrick Thompson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:07
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/07337; H10W72/07351; H10W72/07353; H10W72/30; H10W72/331; H10W72/334; H10W72/90; H10W72/931; Y; Y10; Y10S; Y10S438/00; Y10S438/975
Claims Analysis
Total Claims: 48
Claim 1
Independent Claim
75 words
A method for aligning a semiconductor device comprising the steps of: providing a semiconductor device; providing a first physical alignment feature at a center of thermal expansion of the semiconductor device; providing a second physical alignment feature at a location away from the center of thermal expansion of the semiconductor device; providing a substrate having a third physical alignment feature; and mating the first and second physical alignment features with the third physical alignment feature.
Claim 2
Independent Claim
75 words
A method for aligning a semiconductor device comprising the steps of: providing a semiconductor device; providing a first physical alignment feature at a center of thermal expansion of the semiconductor device; providing a second physical alignment feature at a location away from the center of thermal expansion of the semiconductor device; providing a substrate having a third physical alignment feature; and mating the first and second physical alignment features with the third physical alignment feature.
Claim 3
Dependent Claim
30 words
The method as in claim 1 wherein the first physical alignment feature comprises at least one alignment cavity and the third physical alignment feature comprises at least one alignment protrusion.
Claim 4
Dependent Claim
31 words
The method as in claim 1 wherein the first physical alignment feature comprises at least one alignment cavity and the third physical alignment feature comprises at least one tapered alignment protrusion.
Claim 5
Dependent Claim
31 words
The method as in claim 1 wherein the first physical alignment feature comprises at least one alignment cavity and the third physical alignment feature comprises at least one semi-spherical alignment protrusion.
Claim 6
Dependent Claim
50 words
The method as in claim 1 wherein the first physical alignment feature comprises at least one alignment cavity having at least two sides meeting to form an angle and the third physical alignment feature comprises at least one alignment protrusion having at least two sides meeting to form an angle.
Claim 7
Dependent Claim
30 words
The method as in claim 1 wherein the first physical alignment feature comprises at least one alignment protrusion and the third physical alignment feature comprises at least one alignment cavity.
Claim 8
Dependent Claim
31 words
The method as in claim 1 wherein the first physical alignment feature comprises at least one tapered alignment protrusion and the third physical alignment feature comprises at least one alignment cavity.
Claim 9
Dependent Claim
31 words
The method as in claim 1 wherein the first physical alignment feature comprises at least one semi-spherical alignment protrusion and the third physical alignment feature comprises at least one alignment cavity.
Claim 10
Dependent Claim
50 words
The method as in claim 1 wherein the first physical alignment feature comprises at least one alignment protrusion having at least two sides meeting to form an angle and the third physical alignment feature comprises at least one alignment cavity having at least two sides meeting to form an angle.
Claim 11
Independent Claim
66 words
A method for aligning a semiconductor device comprising the steps of: providing a semiconductor device having a first physical alignment feature comprising a first protrusion and at least one additional protrusion; providing a substrate having a second physical alignment feature comprising a first cavity and at least one slot having a longitudinal axis; and mating the first physical alignment feature with the second physical alignment feature.
Claim 12
Independent Claim
66 words
A method for aligning a semiconductor device comprising the steps of: providing a semiconductor device having a first physical alignment feature comprising a first protrusion and at least one additional protrusion; providing a substrate having a second physical alignment feature comprising a first cavity and at least one slot having a longitudinal axis; and mating the first physical alignment feature with the second physical alignment feature.
Claim 13
Dependent Claim
68 words
The method as in claim 10 wherein the first protrusion is placed at a first position on the semiconductor device, the first cavity is placed in a position corresponding to the first position, and the at least one slot is placed corresponding to the at least one additional protrusions with the longitudinal axis lying on an axis extending from the first cavity to the at least one slot.
Claim 14
Dependent Claim
20 words
The method as in claim 11 wherein the first position is a center of thermal expansion of the semiconductor device.
Claim 15
Independent Claim
66 words
A method for aligning a semiconductor device comprising the steps of: providing a semiconductor device having a first physical alignment feature comprising a first cavity and at least one slot having a longitudinal axis; providing a substrate having a second physical alignment feature comprising a first protrusion and at least one additional protrusion; and mating the first physical alignment feature with the second physical alignment feature.
Claim 16
Independent Claim
66 words
A method for aligning a semiconductor device comprising the steps of: providing a semiconductor device having a first physical alignment feature comprising a first cavity and at least one slot having a longitudinal axis; providing a substrate having a second physical alignment feature comprising a first protrusion and at least one additional protrusion; and mating the first physical alignment feature with the second physical alignment feature.
Claim 17
Dependent Claim
63 words
The method as in claim 13 wherein the first protrusion is placed at a first position, the first cavity is placed at a position corresponding to the first position and the at least one slot is placed corresponding to the at least one additional protrusion with the longitudinal axis lying on an axis from the first cavity to the at least one slot.
Claim 18
Dependent Claim
22 words
The method as in claim 14 wherein the first cavity is placed at a center of thermal expansion of the semiconductor device.
Claim 19
Dependent Claim
21 words
The method as in claim 1 wherein the first physical alignment feature comprises a protrusion made by etching the semiconductor device.
Claim 20
Dependent Claim
21 words
The method as in claim 1 wherein the first physical alignment feature comprises a protrusion made by plating the semiconductor device.
Claim 21
Dependent Claim
21 words
The method as in claim 1 wherein the first physical alignment feature comprises a cavity made by etching the semiconductor device.
Claim 22
Dependent Claim
22 words
The method as in claim 1 wherein the third physical alignment feature comprises a protrusion made by plating then etching the substrate.
Claim 23
Dependent Claim
20 words
The method as in claim 1 wherein the third physical alignment feature comprises a cavity made by etching the substrate.
Claim 24
Dependent Claim
22 words
The method as in claim 1 wherein the third physical alignment feature comprises a cavity made by plating then etching the substrate.
Claim 25
Dependent Claim
14 words
The method as in claim 1 wherein the semiconductor device is a semiconductor die.
Claim 26
Dependent Claim
14 words
The method as in claim 1 wherein the semiconductor device is a semiconductor wafer.
Claim 27
Independent Claim
103 words
A method for aligning a semiconductor wafer comprising the steps of: providing a semiconductor wafer having at least one semiconductor die and having a first physical alignment feature located at a center of thermal expansion of each of the at least one semiconductor die and having a second physical alignment feature located away from the center of thermal expansion of each of the at least one semiconductor die; providing a flexible mounting substrate having a third physical alignment feature for each of the at least one semiconductor die; and mating the first and second physical alignment features with the third physical alignment feature.
Claim 28
Independent Claim
103 words
A method for aligning a semiconductor wafer comprising the steps of: providing a semiconductor wafer having at least one semiconductor die and having a first physical alignment feature located at a center of thermal expansion of each of the at least one semiconductor die and having a second physical alignment feature located away from the center of thermal expansion of each of the at least one semiconductor die; providing a flexible mounting substrate having a third physical alignment feature for each of the at least one semiconductor die; and mating the first and second physical alignment features with the third physical alignment feature.
Claim 29
Dependent Claim
30 words
The method as in claim 24 wherein the first physical alignment feature comprises at least one alignment cavity and the third physical alignment feature comprises at least one alignment protrusion.
Claim 30
Dependent Claim
31 words
The method as in claim 24 wherein the first physical alignment feature comprises at least one alignment cavity and the third physical alignment feature comprises at least one tapered alignment protrusion.
Claim 31
Dependent Claim
30 words
The method as in claim 24 wherein the first physical alignment feature comprises at least one alignment protrusion and the third physical alignment feature comprises at least one alignment cavity.
Claim 32
Dependent Claim
31 words
The method as in claim 24 wherein the first physical alignment feature comprises at least one tapered alignment protrusion and the third physical alignment feature comprises at least one alignment cavity.
Claim 33
Independent Claim
109 words
A method for aligning a semiconductor wafer comprising the steps of: providing a semiconductor wafer having at least one semiconductor die and having a first physical alignment feature for each of the at least one semiconductor die, wherein each of the first physical alignment features comprises a first protrusion and at least one additional protrusion; providing a flexible mounting substrate having a second physical alignment feature for each of the at least one semiconductor die, wherein each of the second physical alignment features comprises a first cavity and at least one slot having a longitudinal axis; and mating the first physical alignment feature with the second physical alignment feature.
Claim 34
Independent Claim
109 words
A method for aligning a semiconductor wafer comprising the steps of: providing a semiconductor wafer having at least one semiconductor die and having a first physical alignment feature for each of the at least one semiconductor die, wherein each of the first physical alignment features comprises a first protrusion and at least one additional protrusion; providing a flexible mounting substrate having a second physical alignment feature for each of the at least one semiconductor die, wherein each of the second physical alignment features comprises a first cavity and at least one slot having a longitudinal axis; and mating the first physical alignment feature with the second physical alignment feature.
Claim 35
Dependent Claim
68 words
The method as in claim 29 wherein the first protrusion is placed at a first position on the semiconductor die, the first cavity is placed in a position corresponding to the first position and the at least one slot is placed corresponding to the at least one additional protrusions with the longitudinal axis lying on an axis extending from the first cavity to the at least one slot.
Claim 36
Dependent Claim
21 words
The method as in claim 24 wherein the first physical alignment feature comprises a protrusion made by etching the semiconductor die.
Claim 37
Dependent Claim
21 words
The method as in claim 24 wherein the first physical alignment feature comprises a cavity made by etching the semiconductor die.
Claim 38
Independent Claim
78 words
A method for aligning a semiconductor device comprising the steps of: providing a semiconductor device having a first alignment feature; providing a substrate having a second alignment feature at a center of thermal expansion of the substrate and having a third alignment feature at a location away from the center of thermal expansion of the substrate; and coupling the substrate and the semiconductor device such that the first alignment feature mates with the second and third alignment features.
Claim 39
Independent Claim
78 words
A method for aligning a semiconductor device comprising the steps of: providing a semiconductor device having a first alignment feature; providing a substrate having a second alignment feature at a center of thermal expansion of the substrate and having a third alignment feature at a location away from the center of thermal expansion of the substrate; and coupling the substrate and the semiconductor device such that the first alignment feature mates with the second and third alignment features.
Claim 40
Dependent Claim
14 words
The method as in claim 33 wherein the semiconductor device is a semiconductor die.
Claim 41
Dependent Claim
14 words
The method as in claim 33 wherein the semiconductor device is a semiconductor wafer.
Claim 42
Dependent Claim
15 words
The method as in claim 33, wherein the second alignment feature comprises a tapered protrusion.
Claim 43
Dependent Claim
23 words
The method as in claim 33 wherein the first alignment feature comprises a cavity and the second alignment feature comprises a semispherical protrusion.
Claim 44
Dependent Claim
42 words
The method as in claim 33 wherein the first alignment feature comprises a cavity having at least two sides meeting to form an angle and the second alignment feature comprises a protrusion having at least two sides meeting to form an angle.
Claim 45
Independent Claim
67 words
A method for aligning a semiconductor device for testing comprising the steps of: providing a semiconductor device having a first alignment cavity and at least one slot having a longitudinal axis; providing a test fixture having a first alignment protrusion and at least one additional alignment protrusion; and coupling the test fixture to the semiconductor device such that the first alignment cavity receives the first alignment protrusion.
Claim 46
Independent Claim
67 words
A method for aligning a semiconductor device for testing comprising the steps of: providing a semiconductor device having a first alignment cavity and at least one slot having a longitudinal axis; providing a test fixture having a first alignment protrusion and at least one additional alignment protrusion; and coupling the test fixture to the semiconductor device such that the first alignment cavity receives the first alignment protrusion.
Claim 47
Dependent Claim
55 words
The method as in claim 39 wherein the first alignment cavity is located at a thermal expansion center and the at least one slot is placed corresponding to the at least one additional alignment protrusion with the longitudinal axis lying on an axis extending from the thermal expansion center to the at least one slot.
Claim 48
Dependent Claim
30 words
The method as in claim 39 wherein the test fixture further comprises externally accessible test leads such that the semiconductor device can be tested when placed in the test fixture.
References Cited (Backward Citations)
JPS6224259A
Cited
US5150193A
Cited
US5260599A
Cited
JPH04133349A
Cited
JPH04186759A
Cited
JPH05304070A
Cited
US5283205A
Cited
US5408131A
Cited
US5381047A
Cited
US5475775A
Cited
US5360761A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-17 | 2000-03-18 | 2000-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-17 | 2004-03-18 | 2004-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-17 | 2008-03-18 | 2008-09-17 | $7700.00 | Window Closed / Lapsed |