US5475775A
Expired / Lapsed
US
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Method for producing a hybrid integrated optical circuit and device for emitting light waves
Assignee: Harting Elecktro Optische Bauteile GmbH and Co KG
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Filing: 1993-12-04
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Granted: 1995-12-12
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Expires: 2013-12-04
Abstract
Abstract A method for producing a hybrid integrated optical circuit which utilizes a molding tool having holding devices for an electrooptic semiconductor component, negative molds for a waveguide trench and holding devices for an optical waveguide. The holding devices of the molding tool adjust the electrooptic semiconductor component with respect to the negative mold of the waveguide trench during reshaping with a polymer. The basic unit produced consists of the electrooptic semiconductor component, which is adjusted with respect to the waveguide trench molded in the polymer. Adjoining the waveguide trench are holding devices, which are molded in the polymer and by means of which an optical waveguide can be coupled to the waveguide trench in a self-adjusting fashion. The basic unit and the optical waveguide are permanently connected to one another with the aid of a cover, the waveguide trench being filled with an optically transparent material, as a result of which a waveguide is formed.
Inventors
- 👤 Hans Kragl
- 👤 Wolf-Henning Rech
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 15:52
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/44; G02B6/24; G02B6/42; G02B6/4201; G02B6/4219; G02B6/4228; G02B6/423; G02B6/26; G02B6/30; G02B6/4236; G02B6/4245; G02B6/4255; H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
168 words
A method for producing a hybrid integrated optical circuit having at least one electrooptic semiconductor component, comprising the steps of: attaching the at least one electrooptic semiconductor component to a carrier plate; inserting the at least one electrooptic semiconductor component into a molding tool, the molding tool including a plurality of first holding devices for holding the at least one electrooptic semiconductor component and a first negative mold for forming at least one waveguide trench; encapsulating the molding tool and the at least one electrooptic semiconductor component with a moldable material; and removing the molding tool, thereby producing a basic unit including the encapsulated at least one electrooptic semiconductor component and a molded material, the basic unit further including the at least one waveguide trench formed by the first negative mold, the at least one waveguide trench being aligned with respect to the at least one electrooptic semiconductor component for coupling a light generated by the at least one electrooptic semiconductor component to at least one optical waveguide.
Claim 2
Independent Claim
168 words
A method for producing a hybrid integrated optical circuit having at least one electrooptic semiconductor component, comprising the steps of: attaching the at least one electrooptic semiconductor component to a carrier plate; inserting the at least one electrooptic semiconductor component into a molding tool, the molding tool including a plurality of first holding devices for holding the at least one electrooptic semiconductor component and a first negative mold for forming at least one waveguide trench; encapsulating the molding tool and the at least one electrooptic semiconductor component with a moldable material; and removing the molding tool, thereby producing a basic unit including the encapsulated at least one electrooptic semiconductor component and a molded material, the basic unit further including the at least one waveguide trench formed by the first negative mold, the at least one waveguide trench being aligned with respect to the at least one electrooptic semiconductor component for coupling a light generated by the at least one electrooptic semiconductor component to at least one optical waveguide.
Claim 3
Dependent Claim
33 words
The method set forth in claim 1, wherein the molding tool further includes a second negative mold for forming at least one second holding device for holding the at least one optical waveguide.
Claim 4
Dependent Claim
57 words
The method set forth in claim 2, wherein the at least one second holding device is aligned with respect to one of the at least one electrooptic semiconductor component and the at least one waveguide trench for optimally coupling the light generated by the at least one electrooptic semiconductor component to the at least one optical waveguide.
Claim 5
Dependent Claim
25 words
The method set forth in claim 1, wherein the at least one optical waveguide includes one of an optical fiber and an optical fiber bundle.
Claim 6
Dependent Claim
78 words
The method set forth in claim 1, wherein each of the plurality of the first holding devices include side walls being at least partially inclined inward, and wherein the at least one electrooptic semiconductor component includes side walls being at least partially inclined inward, each of the first holding device side walls thereby delimiting a space for inserting the at least one electrooptic semiconductor component and cooperatively engaging a respective one of the electrooptic semiconductor component side walls.
Claim 7
Dependent Claim
28 words
The method set forth in claim 1, further comprising the step of filling the at least one waveguide trench with an optically transparent material, thereby forming a waveguide.
Claim 8
Dependent Claim
76 words
The method set forth in claim 1, further comprising the step of connecting the basic unit to the at least one optical waveguide via a cover having at least one third holding device which is aligned with respect to one of the at least one electrooptic semiconductor component and the at least one waveguide trench for optimally coupling the light generated by the at least one electrooptic semiconductor component to the at least one optical waveguide.
Claim 9
Dependent Claim
16 words
The method set forth in claim 6, wherein the waveguide trench is filled with a polymer.
Claim 10
Dependent Claim
15 words
The method set forth in claim 7, wherein the cover is composed of a polymer.
Claim 11
Dependent Claim
26 words
The method set forth in claim 7, wherein the cover includes an opening for facilitating an electrical connection with the at least one electrooptic semiconductor component.
Claim 12
Dependent Claim
34 words
The method set forth in claim 7, further comprising the step of forming an opening in the cover via laser ablation for facilitating an electrical connection with the at least one electrooptic semiconductor component.
Claim 13
Dependent Claim
24 words
The method set forth in claim 1, further comprising the step of forming an electrical contact with the at least one electrooptic semiconductor component.
Claim 14
Dependent Claim
15 words
The method set forth in claim 12, wherein the electrical contact includes sputtered-on conductor tracks.
Claim 15
Dependent Claim
16 words
The method set forth in claim 12, wherein the electrical contact includes vapor deposited conductor tracks.
Claim 16
Dependent Claim
23 words
The method set forth in claim 12, wherein the electrical contact includes conducting wires attached to the at least one electrooptic semiconductor component.
Claim 17
Dependent Claim
47 words
The method set forth in claim 1, wherein the at least one electrooptic semiconductor component includes one of a laser diode, a laser diode array, a laser diode amplifier, a laser diode amplifier array, a semiconductor modulator, a semiconductor demodulator array, a detector and a detector array.
Claim 18
Dependent Claim
48 words
The method set forth in claim 1, wherein the at least one waveguide trench is filled with an optically transparent material having a refractive index, further comprising the step of attaching a thermoelectric component to the basic unit for varying the refractive index of the optically transparent material.
Claim 19
Dependent Claim
15 words
The method set forth in claim 17, wherein the thermoelectric component includes a thermal probe.
Claim 20
Dependent Claim
19 words
The method set forth in claim 1, wherein the at least one waveguide trench forms a continuous lateral taper.
Claim 21
Dependent Claim
18 words
The method set forth in claim 1, wherein the at least one waveguide trench forms a segmented taper.
Claim 22
Dependent Claim
20 words
The method set forth in claim 1, further comprising the step of coupling a heat sink to the carrier plate.
Claim 23
Dependent Claim
15 words
The method set forth in claim 21, wherein the heat sink includes a Peltier element.
Claim 24
Dependent Claim
21 words
The method set forth in claim 1, wherein the carrier plate includes a silicon plate having at least one electronic circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-11 | 1999-06-12 | 1999-12-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-11 | 2003-06-12 | 2003-12-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-11 | 2007-06-12 | 2007-12-12 | $7700.00 | Window Closed / Lapsed |