US5550403A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Improved laminate package for an integrated circuit and integrated circuit having such a package
Assignee: LSI Corp
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Filing: 1994-06-02
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Granted: 1996-08-27
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Expires: 2014-06-02
Abstract
Abstract An integrated circuit package, and integrated circuit assembly having such a package, includes a base portion and a cover portion which cooperatively enclose an integrated circuit chip. The base and cover portions are formed of composite material and have matching coefficients of thermal expansion. Because the base and cover portions each match the other's thermal expansions and contractions, no stresses are generated in the package from heating and cooling during and following operation of the integrated circuit chip, and no such thermally produced physical stresses are transferred to the circuit chip to shorten its life. A version of the package includes plural lamina, and may include facial metallic coating layers on the lamina for shielding, electromagnetic shielding, and electrical interconnection of the integrated circuit chip. Another version of the package utilizes the facial metallic coating layers to join portions of the package by soldering.
Inventors
- 👤 Karla Carichner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 14:34
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W70/68; H10W70/685; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/17; H10W76/18; H10W90/00; H10W90/701; H10W70/682
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
171 words
An integrated circuit assembly having an integrated circuit die, and a package enclosing said die and providing for electrical interconnection of said die to external electrical circuitry, said package comprising: a first package portion providing a recess into which said integrated circuit die is received; a second package portion sealingly cooperating with said first package portion to enclose said integrated circuit die within said recess; means for effecting corresponding individual electrical interconnection between plural electrical contact pads of said integrated circuit die and plural electrical connection features defined on said package for connection with said external electrical circuitry; wherein: said package portions are materially uniform and matched in thermal coefficient of expansion to one another; said package portions are each formed of the same composite material including a matrix of a fibrous material in a resinous material; said fibrous material includes glass fibers; said resinous material includes an epoxy resin; and said package portions are sealingly secured together by a scrim formed of said epoxy resin carried in a fibrous material.
Claim 2
Dependent Claim
171 words
An integrated circuit assembly having an integrated circuit die, and a package enclosing said die and providing for electrical interconnection of said die to external electrical circuitry, said package comprising: a first package portion providing a recess into which said integrated circuit die is received; a second package portion sealingly cooperating with said first package portion to enclose said integrated circuit die within said recess; means for effecting corresponding individual electrical interconnection between plural electrical contact pads of said integrated circuit die and plural electrical connection features defined on said package for connection with said external electrical circuitry; wherein: said package portions are materially uniform and matched in thermal coefficient of expansion to one another; said package portions are each formed of the same composite material including a matrix of a fibrous material in a resinous material; said fibrous material includes glass fibers; said resinous material includes an epoxy resin; and said package portions are sealingly secured together by a scrim formed of said epoxy resin carried in a fibrous material.
Claim 3
Dependent Claim
17 words
The integrated circuit assembly of claim 1 wherein said fibrous material of said scrim includes glass fibers.
Claim 4
Dependent Claim
27 words
The integrated circuit assembly of claim 1 wherein said means for effecting electrical interconnection includes a facial metallic coating layer carried on a portion of said package.
Claim 5
Dependent Claim
45 words
The integrated circuit assembly of claim 1 wherein said electrical interconnection with said external electrical circuitry is effected by means of configuring said package to define an external electrical interconnection structure selected from the following group: a pin grid array, or a solder ball array.
Claim 6
Dependent Claim
40 words
The integrated circuit assembly of claim 3 wherein one of said package portions includes plural laminae each formed of said composite material, and said laminae are secured together by interposed scrim of said epoxy resin carried in said fibrous material.
Claim 7
Dependent Claim
19 words
The integrated circuit assembly of claim 5 wherein one of said plural laminae carries said facial metallic coating layer.
Claim 8
Dependent Claim
154 words
A package for an integrated circuit die, said package comprising: a first and a second package portion each configured to sealingly cooperate with the other to sealingly enclose said integrated circuit die and to effect electrical interconnection of said die with external electrical circuitry, each of said first and second package portions being formed of composite material including woven fibrous material in a resinous or polymeric matrix; wherein: said package further includes one of said package portions being formed of plural laminae each of woven fibrous material in a resinous or polymeric matrix, and each of said laminae being joined to an adjacent laminae by a scrim of woven fibrous material in a resinous or polymeric matrix, and said fibrous material and said matrix material of said package portions and laminae being alike to one another so that said package portions including said laminae are matched to one another in thermal coefficient of expansion.
Claim 9
Dependent Claim
154 words
A package for an integrated circuit die, said package comprising: a first and a second package portion each configured to sealingly cooperate with the other to sealingly enclose said integrated circuit die and to effect electrical interconnection of said die with external electrical circuitry, each of said first and second package portions being formed of composite material including woven fibrous material in a resinous or polymeric matrix; wherein: said package further includes one of said package portions being formed of plural laminae each of woven fibrous material in a resinous or polymeric matrix, and each of said laminae being joined to an adjacent laminae by a scrim of woven fibrous material in a resinous or polymeric matrix, and said fibrous material and said matrix material of said package portions and laminae being alike to one another so that said package portions including said laminae are matched to one another in thermal coefficient of expansion.
Claim 10
Dependent Claim
31 words
The integrated circuit package of claim 7 wherein said package portions are further sealingly secured to one another by a scrim of woven fibrous material in a resinous or polymeric matrix.
Claim 11
Dependent Claim
49 words
The integrated circuit package of claim 7 wherein at least one of said plural laminae carries a facial metallic coating layer, said facial metallic coating layer being electrically conductive, and said coating layer further providing one of electrical interconnection, electrostatic shielding, or electromagnetic shielding for said integrated circuit die.
Claim 12
Dependent Claim
37 words
The integrated circuit package of claim 8 wherein said scrim sealingly securing said package portions together is also alike to said package portions, being formed of the same fibrous material and the same resinous or polymeric material.
Claim 13
Dependent Claim
139 words
An integrated circuit assembly comprising: an integrated circuit die; a package structure for said integrated circuit die, which package structure provides environmental and physical protection, and electrical interconnection to external electrical circuitry for said integrated circuit die, said package structure including: a first and a second package portions which are each formed of woven fibrous material in a matrix of resinous or polymeric material, and which sealingly cooperate with one another to enclose said circuit die, internal interconnection means for electrically interconnecting plural contact pads of said integrated circuit die with corresponding electrical conductors of said package structure, external interconnection means for electrically interconnecting said electrical conductors of said package structure with external electrical circuitry; and a scrim formed of said woven fibrous material in said matrix of resinous or polymeric material for sealingly securing said package portions together.
Claim 14
Dependent Claim
139 words
An integrated circuit assembly comprising: an integrated circuit die; a package structure for said integrated circuit die, which package structure provides environmental and physical protection, and electrical interconnection to external electrical circuitry for said integrated circuit die, said package structure including: a first and a second package portions which are each formed of woven fibrous material in a matrix of resinous or polymeric material, and which sealingly cooperate with one another to enclose said circuit die, internal interconnection means for electrically interconnecting plural contact pads of said integrated circuit die with corresponding electrical conductors of said package structure, external interconnection means for electrically interconnecting said electrical conductors of said package structure with external electrical circuitry; and a scrim formed of said woven fibrous material in said matrix of resinous or polymeric material for sealingly securing said package portions together.
Claim 15
Dependent Claim
22 words
The integrated circuit assembly of claim 11 wherein said package portions are each formed of woven glass fiber in an epoxy matrix.
Claim 16
Dependent Claim
39 words
The integrated circuit assembly of claim 12 wherein one of said package portions includes plural laminae each of woven glass fiber in an epoxy matrix, and at least one of said plural laminae carrying a facial metallic coating layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-27 | 2000-02-26 | 2000-08-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-27 | 2004-02-26 | 2004-08-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-27 | 2008-02-26 | 2008-08-27 | $7700.00 | Window Closed / Lapsed |