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US5103293A
Expired / Lapsed
US
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Electronic circuit packages with tear resistant organic cores
Assignee: International Business Machines Corp
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Filing: 1990-12-07
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Granted: 1992-04-07
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Expires: 2010-12-07
Abstract
Abstract Disclosed are an electronic package and electronic package module. The module has a dielectric core with surface circuitization on at least one surface. The dielectric core is a composite having a thermoplastic layer interposed between two separate layers of thermoset adhesive, as epoxy dicyanate adhesive. The thermoplastic layer is preferably a polyimide. The adhesive is preferably an epoxy or dicyanate adhesive, for example a homogeneous film of thermoset resin, or a fiber reinforced thermoset resin, such as a polytetrafluorethylene reinforced epoxy or a glass fiber reinforced adhesive. The use of a thermoplastic polyimide layer interposed between adhesive layers provides a core that is particularly amenable to manufacture as a thin core.
Inventors
- 👤 Edward J. Bonafino
- 👤 Richard W. Carpenter
- 👤 Peter J. Lueck
- 👤 William J. Summa
- 👤 David W. Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:38
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/036; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/015; H05K2201/0154; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
28 words
An electronic package module adapted to carry surface electric circuitization on a polymeric composite dielectric core comprising a thermoplastic layer interposed between two separate layers of thermoset resin.
Claim 2
Dependent Claim
28 words
An electronic package module adapted to carry surface electric circuitization on a polymeric composite dielectric core comprising a thermoplastic layer interposed between two separate layers of thermoset resin.
Claim 3
Dependent Claim
13 words
The electronic package module of claim 1 wherein the thermoplastic layer comprises polyimide.
Claim 4
Dependent Claim
19 words
The electronic package module of claim 2 wherein both of the thermoset resin layers are reinforced thermoset resin layers.
Claim 5
Dependent Claim
42 words
The electronic package module of claim 3 wherein the thickness of the thermoplastic polyimide layer is from about 0.8 to about 2.0 mils, and the thicknesses of each of the reinforced thermoset resin layers is from about 1 to about 4 mils.
Claim 6
Dependent Claim
27 words
The electronic package module of claim 3 wherein the reinforcement is chosen from the group consisting of woven and nonwoven fiber glass, polytetrafluoroethylene fibers, and organic fibers.
Claim 7
Dependent Claim
17 words
The electronic package module of claim 2 wherein both of the thermoset resin layers are homogeneous layers.
Claim 8
Dependent Claim
40 words
The electronic package module of claim 6 wherein the thickness of the thermoplastic polyimide layer is from about 0.8 to 2.0 mils, and the thicknesses of each of the homogeneous thermoset resin layers are from about 0.1 to 0.8 mils.
Claim 9
Dependent Claim
24 words
The electronic package module of claim 2 wherein the thermoset resin is chosen form the group consisting of epoxy resins and cyanate ester resins.
Claim 10
Dependent Claim
48 words
A rigid, multilayer electronic circuit package comprising a plurality of circuitized laminated electronic package modules, and having electric signal planes and electric power planes, at least one of said modules being a polymeric dielectric composite core comprising a thermoplastic layer interposed between two separate layers of thermoset resin.
Claim 11
Dependent Claim
48 words
A rigid, multilayer electronic circuit package comprising a plurality of circuitized laminated electronic package modules, and having electric signal planes and electric power planes, at least one of said modules being a polymeric dielectric composite core comprising a thermoplastic layer interposed between two separate layers of thermoset resin.
Claim 12
Dependent Claim
12 words
The electronic package of claim 9 wherein the thermoplastic layer comprises polyimide.
Claim 13
Dependent Claim
18 words
The electronic package of claim 10 wherein each of the thermoset resin layers are reinforced thermoset resin layers.
Claim 14
Dependent Claim
42 words
The electronic package of claim 11 wherein the thickness of the thermoplastic polyimide layer is from about 0.8 to about 2.0 mils, and the thicknesses of each of the fiber reinforced thermoset resin layers are from about 1 to about 4 mils.
Claim 15
Dependent Claim
26 words
The electronic package of claim 11 wherein the reinforcement is chosen from the group consisting of woven and nonwoven fiber glass, polytetrafluoroethylene fibers, and organic fibers.
Claim 16
Dependent Claim
15 words
The electronic package of claim 10 wherein the thermoset resin layer is a homogeneous layer.
Claim 17
Dependent Claim
37 words
The electronic package of claim 14 wherein the thickness of the thermoplastic polyimide layer is from about 0.8 to 2.0 mils, and the thicknesses of the homogeneous thermoset resin layers are from about 0.1 to 0.8 mils.
Claim 18
Dependent Claim
23 words
The electronic package of claim 10 wherein the thermoset resin is chosen from the group consisting of epoxy resins and cyanate ester resins.
Claim 19
Dependent Claim
29 words
An electronic package module adapted to carry surface electric circuitization on a polymeric composite dielectric core comprising a polyimide layer interposed between two separate layers of thermoset resin adhesive.
Claim 20
Dependent Claim
29 words
An electronic package module adapted to carry surface electric circuitization on a polymeric composite dielectric core comprising a polyimide layer interposed between two separate layers of thermoset resin adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-04-07 | 1995-10-07 | 1996-04-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-04-07 | 1999-10-07 | 2000-04-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-04-07 | 2003-10-07 | 2004-04-07 | $7700.00 | Window Closed / Lapsed |