US2932599A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of preparation of thermoplastic resin coated printed circuit
Assignee: Lockheed Martin Corp
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Filing: 1955-05-09
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Granted: 1960-04-12
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Expires: 1975-05-09
Abstract
No abstract record available.
Inventors
- 👤 Victor F Dahlgren
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 09:16
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/281; H05K3/38; H05K3/381; H05K3/382; H05K3/385; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/015; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/11; H05K2203/1152; H05K3/02; H05K3/06; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/3154
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
155 words
THE METHOD OF BONDING A THERMOPLASTIC RESIN TO A THERMOSETTING RESIN COMPRISING, OXIDIZING THE SURFACES OF A THIN SHEET OF COPPER TO PROVIDE SAID SURFACES WITH A HOMOGENEOUS COATING OF BLACK CUPRIC OXIDE, PLACING SAID CUPRIC OXIDE COATED COPPER SHEET IN CONTACT WITH AN UNCURED SHEET OF THERMOSETTING RESIN, APPLYING A SUFFICIENT DEGREE OF HEAT AND PRESSURE TO CURE SAID THERMOSETTING RESIN AND PRESS SAID COPPER AND SAID THERMOSETTING RESIN SHEETS TOGETHER, FORMING THEREBY AN IMPRINT OF SAID CUPRIC OXIDE IN SAID THERMOSETTING RESIN, COOLING SAID CUPRIC OXIDE COATED COPPER CLAD RESIN SHEET, REMOVING CUPRIC OXIDE COATED COPPER FROM SAID RESIN SHEET TO EXPOSE THE PLURALITY OF RANDOMLY DISPOSED FOLICLES IN SAID RESIN PROVIDED BY SAID IMPRINT, PLACING SAID THERMOPLASTIC RESIN IN CONTACT WITH SAID IMPRINTED SURFACE, AND APPLYING A SUFFIEICNT DEGREE OF HEAT AND PRESSURE TO SAID THERMOPLASTIC AND THERMOSETTING RESIN TO FORCE SAID THERMOPLASTIC RESIN INTO SAID FOLLICLES TO PROVIDE SAID BOND THEREBETWEEN.
Claim 2
Independent Claim
155 words
THE METHOD OF BONDING A THERMOPLASTIC RESIN TO A THERMOSETTING RESIN COMPRISING, OXIDIZING THE SURFACES OF A THIN SHEET OF COPPER TO PROVIDE SAID SURFACES WITH A HOMOGENEOUS COATING OF BLACK CUPRIC OXIDE, PLACING SAID CUPRIC OXIDE COATED COPPER SHEET IN CONTACT WITH AN UNCURED SHEET OF THERMOSETTING RESIN, APPLYING A SUFFICIENT DEGREE OF HEAT AND PRESSURE TO CURE SAID THERMOSETTING RESIN AND PRESS SAID COPPER AND SAID THERMOSETTING RESIN SHEETS TOGETHER, FORMING THEREBY AN IMPRINT OF SAID CUPRIC OXIDE IN SAID THERMOSETTING RESIN, COOLING SAID CUPRIC OXIDE COATED COPPER CLAD RESIN SHEET, REMOVING CUPRIC OXIDE COATED COPPER FROM SAID RESIN SHEET TO EXPOSE THE PLURALITY OF RANDOMLY DISPOSED FOLICLES IN SAID RESIN PROVIDED BY SAID IMPRINT, PLACING SAID THERMOPLASTIC RESIN IN CONTACT WITH SAID IMPRINTED SURFACE, AND APPLYING A SUFFIEICNT DEGREE OF HEAT AND PRESSURE TO SAID THERMOPLASTIC AND THERMOSETTING RESIN TO FORCE SAID THERMOPLASTIC RESIN INTO SAID FOLLICLES TO PROVIDE SAID BOND THEREBETWEEN.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1963-04-12 | 1963-10-12 | 1964-04-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1967-04-12 | 1967-10-12 | 1968-04-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1971-04-12 | 1971-10-12 | 1972-04-12 | $7700.00 | Window Closed / Lapsed |