US5543365A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer scribe technique using laser by forming polysilicon
Assignee: Texas Instruments Inc
•
Filing: 1994-12-02
•
Granted: 1996-08-06
•
Expires: 2014-12-02
Abstract
Abstract A channel is formed in a wafer to fore descrite die. A portion of the wafer is heated in the channel. A portion of the heated portion is cooled to eliminate the uniform structure. The cooled portion is scribed to separate the die.
Inventors
- 👤 Kendall S. Wills
- 👤 Paul A. Rodriguez
- 👤 Melvin Brewer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 02:33
CPC Classifications
H; H10; H10P; H10P54/00; B; B23; B23K; B23K26/00; B23K26/14; B23K26/146; B23K26/36; B23K26/362; B23K26/364; B23K26/40; B23K2101/00; B23K2101/36; B23K2101/40; B23K2103/00; B23K2103/50; Y; Y10; Y10S; Y10S148/00; Y10S148/028
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
73 words
A method for preventing cracks as a result of a scribing operation, comprising the steps of: forming a channel in a wafer to provide descrite die; heating a first portion of said wafer under the channel cooling a second portion of said first portion to form a polysilicon structure that eliminates the uniform structures of said wafer of silicon within the second portion; scribing said second portion in order to separate said die.
Claim 2
Independent Claim
73 words
A method for preventing cracks as a result of a scribing operation, comprising the steps of: forming a channel in a wafer to provide descrite die; heating a first portion of said wafer under the channel cooling a second portion of said first portion to form a polysilicon structure that eliminates the uniform structures of said wafer of silicon within the second portion; scribing said second portion in order to separate said die.
Claim 3
Dependent Claim
20 words
A method for preventing cracks as in claim 1, wherein said cooling step includes the step of cooling with water.
Claim 4
Dependent Claim
21 words
A method for preventing cracks as in claim 1, wherein said heating step includes the step of heating with a laser.
Claim 5
Dependent Claim
22 words
A method for preventing cracks as in claim 1, wherein said forming step includes the step of forming said channel by etching.
Claim 6
Independent Claim
85 words
A method for preventing cracks as a result of a scribing operation, comprising the steps of: forming a channel in a wafer to provide descrite die; heating a first portion of said wafer under the channel; heating a second portion of said wafer under the channel; cooling a third portion and fourth portion of said wafer of said first and second portion respectively to form a polysilicon structure within the first and second portion structure that eliminates the uniform structure of the wafer of silicon.
Claim 7
Independent Claim
85 words
A method for preventing cracks as a result of a scribing operation, comprising the steps of: forming a channel in a wafer to provide descrite die; heating a first portion of said wafer under the channel; heating a second portion of said wafer under the channel; cooling a third portion and fourth portion of said wafer of said first and second portion respectively to form a polysilicon structure within the first and second portion structure that eliminates the uniform structure of the wafer of silicon.
Claim 8
Dependent Claim
27 words
A method for preventing cracks as in claim 5, wherein said cooling step includes the step of cooling said third portion and said fourth portion with water.
Claim 9
Dependent Claim
21 words
A method for preventing cracks as in claim 5, wherein said heating step includes the step of heating with a laser.
Claim 10
Dependent Claim
22 words
A method for preventing cracks as in claim 5, where said forming step includes the step of forming said channel by etching.
Claim 11
Independent Claim
94 words
A method for preventing cracks as a result of a descrite operation, comprising the steps of: forming a channel in a wafer to provide descrite die; heating a first portion of said wafer under the channel on a first side of said wafer; heating a second portion of said wafer on a second side of said wafer; and cooling a third portion of said second portion to form a polysilicon structure eliminates the uniform structure of said wafer of silicon within the third portion scribing said third portion in order to separate said die.
Claim 12
Independent Claim
94 words
A method for preventing cracks as a result of a descrite operation, comprising the steps of: forming a channel in a wafer to provide descrite die; heating a first portion of said wafer under the channel on a first side of said wafer; heating a second portion of said wafer on a second side of said wafer; and cooling a third portion of said second portion to form a polysilicon structure eliminates the uniform structure of said wafer of silicon within the third portion scribing said third portion in order to separate said die.
Claim 13
Dependent Claim
20 words
A method for preventing cracks as in claim 9, wherein said cooling step includes the step of cooling with water.
Claim 14
Dependent Claim
21 words
A method for preventing cracks as in claim 9, wherein said heating step includes the step of heating with a laser.
Claim 15
Dependent Claim
22 words
A method for preventing cracks as in claim 9, wherein said forming step includes the step of forming said channel by etching.
References Cited (Backward Citations)
US3991296A
Cited
US4141456A
Cited
US4224101A
Cited
US4610079A
Cited
US4543464A
Cited
US4965173A
Cited
US4878099A
Cited
US4534804A
Cited
US5104023A
Cited
US5151584A
Cited
US5308222A
Cited
US5256578A
Cited
US5338967A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-06 | 2000-02-05 | 2000-08-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-06 | 2004-02-05 | 2004-08-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-06 | 2008-02-05 | 2008-08-06 | $7700.00 | Window Closed / Lapsed |