Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
136 words
An apparatus for aligning wafers comprising: (a) an alignment station including means for contacting and selectively holding a wafer in a fixed position; (b) a transfer chuck including means for contacting and selectively holding said wafer in a fixed position, said transfer chuck being separate and distinct from said alignment station; (c) means associated with said alignment station for receiving said transfer chuck in a predetermined orientation; (d) a microscope located in a fixed position relative to said alignment station in order that an operator will view and then align a wafer positioned at said alignment station relative to reference lines in said microscope; and (e) a remote operation station including means for contacting and selectively holding said wafer in a fixed position as well as means for receiving said transfer chuck in a predetermined orientation.
Claim 2
Independent Claim
136 words
An apparatus for aligning wafers comprising: (a) an alignment station including means for contacting and selectively holding a wafer in a fixed position; (b) a transfer chuck including means for contacting and selectively holding said wafer in a fixed position, said transfer chuck being separate and distinct from said alignment station; (c) means associated with said alignment station for receiving said transfer chuck in a predetermined orientation; (d) a microscope located in a fixed position relative to said alignment station in order that an operator will view and then align a wafer positioned at said alignment station relative to reference lines in said microscope; and (e) a remote operation station including means for contacting and selectively holding said wafer in a fixed position as well as means for receiving said transfer chuck in a predetermined orientation.
Claim 3
Dependent Claim
32 words
The apparatus of claim 1 in which said means for selectively holding a wafer at said alignment station comprises a compound capable of moving said wafer in the x and y directions.
Claim 4
Dependent Claim
28 words
The apparatus of claim 2 further comprising a wafer holder which fits into said compound and which may be rotated or removed in any direction on said compound.
Claim 5
Dependent Claim
20 words
The apparatus of claim 3 in which said wafer holder has a bevelled edge to facilitate movement by said operator.
Claim 6
Dependent Claim
39 words
The apparatus of claim 1 wherein said means for selectively holding a wafer includes means for selectively subjecting said wafer to a pressure less than atmospheric pressure whereby said wafer is held in a fixed position by atmospheric pressure.
Claim 7
Dependent Claim
48 words
The apparatus of claim 1 wherein said means for selectively holding said wafer included in said transfer chuck comprises means for subjecting said wafer to a pressure less than atmospheric pressure whereby said wafer will be held in a fixed position on said transfer chuck by atmospheric pressure.
Claim 8
Dependent Claim
32 words
The apparatus of claim 1 wherein said means associated with said alignment station for receiving said transfer chuck comprises a set of alignment pins which contact the edges of said transfer chuck.
Claim 9
Dependent Claim
44 words
The apparatus of claim 1 wherein said means for selectively holding said wafer at said remote operation station comprises means for subjecting said wafer to a pressure less than atmospheric pressure whereby said wafer will be held in a fixed position by atmospheric pressure.
Claim 10
Dependent Claim
37 words
The apparatus of claim 1 wherein said means for receiving said transfer chuck at said remote operation station includes alignment pins which contact the edge of said transfer chuck in a predetermined orientation of said transfer chuck.
Claim 11
Dependent Claim
13 words
The apparatus of claim 1 wherein said microscope is a split image microscope.
Claim 12
Independent Claim
200 words
A method of aligning a wafer comprising the steps of: (a) placing a wafer onto means for selectively holding said wafer at an alignment station where it can be viewed by an operator through a microscope having alignment indicia therein; (b) adjusting the position of said means for selectively holding said wafer to cause selected portions of said wafer to coincide with said indicia; (c) fixing the position of said means for selectively holding said wafer at said alignment station; (d) moving a transfer chuck into position over said wafer and in contact with alignment pins in fixed positions relative to said wafer; (e) lowering said transfer chuck onto said wafer while keeping said transfer chuck in contact with said alignment pins; (f) attaching said transfer chuck to said wafer; (g) releasing said wafer from said means for selectively holding said wafer at said alignment station; (h) moving said transfer chuck into position at a remote operation station and in contact with a set of alignment pins; (i) lowering said transfer chuck into position at a remote operation station while keeping said transfer chuck in contact with said alignment pins; (j) attaching said transfer chuck to said remote operation station.
Claim 13
Independent Claim
200 words
A method of aligning a wafer comprising the steps of: (a) placing a wafer onto means for selectively holding said wafer at an alignment station where it can be viewed by an operator through a microscope having alignment indicia therein; (b) adjusting the position of said means for selectively holding said wafer to cause selected portions of said wafer to coincide with said indicia; (c) fixing the position of said means for selectively holding said wafer at said alignment station; (d) moving a transfer chuck into position over said wafer and in contact with alignment pins in fixed positions relative to said wafer; (e) lowering said transfer chuck onto said wafer while keeping said transfer chuck in contact with said alignment pins; (f) attaching said transfer chuck to said wafer; (g) releasing said wafer from said means for selectively holding said wafer at said alignment station; (h) moving said transfer chuck into position at a remote operation station and in contact with a set of alignment pins; (i) lowering said transfer chuck into position at a remote operation station while keeping said transfer chuck in contact with said alignment pins; (j) attaching said transfer chuck to said remote operation station.