US5537342A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulation of electronic components
Assignee: LSI Corp
•
Filing: 1994-10-28
•
Granted: 1996-07-16
•
Expires: 2014-10-28
Abstract
Abstract For physical protection and to reduce stress, an electronic device (10) is mounted within a cavity in a housing (14) which constitutes an encapsulating member. The housing is preferably formed as two premoulded piece parts (14a, 14b). A leadframe (12) extends into the housing (14) in the manner of a sandwich construction. The device (10) may be mounted on a heat sink (16).
Inventors
- 👤 Trevor C. Gainey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:38
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/121; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W42/20; H10W74/00; H10W74/10; H10W74/111; H10W74/124; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
102 words
A packaged electronic device comprising: an upper housing element and a lower housing element, together the upper and lower housing elements forming a housing having a cavity; an electronic device mounted within the cavity in the housing; a leadframe structure having leads extending from an exterior of the housing to within the housing, the electronic device coupled to inner ends of the leads within the cavity; and a heat sink integral with one of the upper or lower housing elements, wherein the heat sink extends radially inwardly of the one of the upper or lower housing elements having the integral heat sink.
Claim 2
Dependent Claim
102 words
A packaged electronic device comprising: an upper housing element and a lower housing element, together the upper and lower housing elements forming a housing having a cavity; an electronic device mounted within the cavity in the housing; a leadframe structure having leads extending from an exterior of the housing to within the housing, the electronic device coupled to inner ends of the leads within the cavity; and a heat sink integral with one of the upper or lower housing elements, wherein the heat sink extends radially inwardly of the one of the upper or lower housing elements having the integral heat sink.
Claim 3
Dependent Claim
21 words
The packaged electronic device as recited in claim 1, wherein the heat sink is exposed to an exterior of the housing.
Claim 4
Dependent Claim
20 words
The packaged electronic device as recited in claim 1, wherein the heat sink is integral with the lower housing element.
Claim 5
Dependent Claim
19 words
The packaged electronic device as recited in claim 1, wherein the electronic device is coupled to the heat sink.
Claim 6
Dependent Claim
32 words
The packaged electronic device as recited in claim 1, wherein an internal surface of the housing is coated with a material which provides electromagnetic and radio frequency isolation of the electronic device.
Claim 7
Dependent Claim
25 words
The packaged electronic device as recited in claim 1, wherein the upper and lower housing elements are formed from a material incorporating a conductive matrix.
Claim 8
Dependent Claim
111 words
A packaged electronic device comprising: an upper housing element and a lower housing element, together the upper and lower housing elements forming a housing having a cavity; an electronic device mounted within the cavity in the housing; a leadframe structure having leads extending from an exterior of the housing to within the housing, the electronic device coupled to inner ends of the leads within the cavity; and a heat sink integral with the lower housing element, the heat sink having a first surface coupled to the electronic device and a second surface exposed to an exterior of the housing, and the heat sink extending radially inwardly of the lower housing element.
Claim 9
Dependent Claim
111 words
A packaged electronic device comprising: an upper housing element and a lower housing element, together the upper and lower housing elements forming a housing having a cavity; an electronic device mounted within the cavity in the housing; a leadframe structure having leads extending from an exterior of the housing to within the housing, the electronic device coupled to inner ends of the leads within the cavity; and a heat sink integral with the lower housing element, the heat sink having a first surface coupled to the electronic device and a second surface exposed to an exterior of the housing, and the heat sink extending radially inwardly of the lower housing element.
Claim 10
Dependent Claim
32 words
The packaged electronic device as recited in claim 7, wherein an internal surface of the housing is coated with a material which provides electromagnetic and radio frequency isolation of the electronic device.
Claim 11
Dependent Claim
25 words
The packaged electronic device as recited in claim 7, wherein the upper and lower housing elements are formed from a material incorporating a conductive matrix.
Claim 12
Dependent Claim
134 words
A packaged electronic device comprising: an upper housing element and a lower housing element, together the upper and lower housing elements forming a housing having a cavity; an electronic device mounted within the cavity in the housing; a leadframe structure having leads extending from an exterior of the housing to within the housing, the electronic device coupled to inner ends of the leads within the cavity; and a heat sink integral with the lower housing element, the heat sink having a first surface coupled to the electronic device and a second surface exposed to an exterior of the housing; wherein the heat sink extends radially inwardly of the lower housing element and an internal surface of the housing is coated with a material which provides electromagnetic and radio frequency isolation of the electronic device.
Claim 13
Dependent Claim
134 words
A packaged electronic device comprising: an upper housing element and a lower housing element, together the upper and lower housing elements forming a housing having a cavity; an electronic device mounted within the cavity in the housing; a leadframe structure having leads extending from an exterior of the housing to within the housing, the electronic device coupled to inner ends of the leads within the cavity; and a heat sink integral with the lower housing element, the heat sink having a first surface coupled to the electronic device and a second surface exposed to an exterior of the housing; wherein the heat sink extends radially inwardly of the lower housing element and an internal surface of the housing is coated with a material which provides electromagnetic and radio frequency isolation of the electronic device.
References Cited (Backward Citations)
EP0009610A1
Cited
GB2057757A
Cited
US4303934A
Cited
US4369330A
Cited
US4545926A
Cited
JPS58148440A
Cited
US4474685A
Cited
JPS6084849A
Cited
US4751611A
Cited
US4829403A
Cited
US4855868A
Cited
JPS6420643A
Cited
JPS6439100A
Cited
US5034800A
Cited
US5158707A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-16 | 2000-01-15 | 2000-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-16 | 2004-01-15 | 2004-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-16 | 2008-01-15 | 2008-07-16 | $7700.00 | Window Closed / Lapsed |