JPS6420643A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
High heat sink semiconductor device
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1987-07-15
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Granted: —
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Expires: 2007-07-15
Abstract
Abstract PURPOSE:To enhance heat sink effect by simple steps with a simple structure by widely exposing externally at least a part of the rear face of a metal plate to which a semiconductor pellet is secured. CONSTITUTION:An IC pellet 5 is secured to the upper face 11 of a metal plate 2, and the lower face 9 is externally exposed. The entirety is sealed with resin 1 except the rear face 9 of the plate and a lead frame 3. The heat carried to the lower face 9 of the plate 2 is externally dissipated, and since the lateral sectional area of the plate 2 is wide, its heat sink effect is large.
Inventors
- 👤 Takatoshi Takigawa
- 👤 Tadashi Igarashi
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-04 07:54
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
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