Abstract An interconnect structure and method is described herein. First, interconnect lines 14a-d are formed on a semiconductor body 10. Then, a dielectric layer 20 is coated over the semiconductor body and the interconnect lines 14a-d to a thickness sufficient to more than fill the gaps between adjacent interconnect lines. The dielectric layer 20 is baked and then cured at a elevated temperature greater than the baking temperature. By using baking, then curing, the dielectric layer 20 inside the gaps has a lower density than that above interconnect lines and that in open fields. The removal of dielectric layer from the top of the interconnect lines by etchback is optional. Finally, a layer of silicon dioxide 12 is deposited over the interconnect lines 14a-d and the dielectric layer 20. In one embodiment, contact vias 11 are then etched through the silicon dioxide 12 and dielectric layer 20 to the interconnect lines 14a-c. Preferably, the dielectric material is spun on. One advantage of the invention is providing a metallization scheme that reduces line-to-line capacitance. A further advantage of the invention is providing a metallization scheme that reduces crosstalk and power dissipation. A further advantage of the invention is providing a dielectric layer between interconnect lines having a lower density and a lower dielectric constant than dense silicon dioxide.
A method of making an interconnect layer in a semiconductor device with a reduction in line-to-line capacitance, comprising: a. forming interconnect lines on a semiconductor body with a first and a second of said lines being spaced at less than one and one-half line width and with a third line being spaced from said second line by at least three line widths; b. coating a dielectric layer over the semiconductor body and the plurality of interconnect lines; c. baking said dielectric layer; and d. curing said dielectric layer at an elevated temperature to form a dielectric between said first and second lines which is less dense than said dielectric between said second and third line and in which said dielectric between said first and said second lines has a dielectric constant of less than 3.7.
Claim 2
Independent Claim
135 words
A method of making an interconnect layer in a semiconductor device with a reduction in line-to-line capacitance, comprising: a. forming interconnect lines on a semiconductor body with a first and a second of said lines being spaced at less than one and one-half line width and with a third line being spaced from said second line by at least three line widths; b. coating a dielectric layer over the semiconductor body and the plurality of interconnect lines; c. baking said dielectric layer; and d. curing said dielectric layer at an elevated temperature to form a dielectric between said first and second lines which is less dense than said dielectric between said second and third line and in which said dielectric between said first and said second lines has a dielectric constant of less than 3.7.
Claim 3
Dependent Claim
27 words
The method of claim 1, wherein said method further includes etching said cured dielectric to decrease the density of the dielectric between said first and second lines.
Claim 4
Dependent Claim
17 words
The method of claim 1, wherein said forming a dielectric layer includes spinning on said dielectric layer.
Claim 5
Dependent Claim
28 words
The method of claim 1, wherein said method further includes removing said dielectric layer over said plurality of interconnect lines and in open areas in said semiconductor body.
Claim 6
Dependent Claim
25 words
The method of claim 1, wherein said method further includes forming a silicon dioxide layer over said plurality of interconnect lines and said dielectric layer.
Claim 7
Dependent Claim
27 words
The method of claim 5, wherein said method further includes forming contact vias through said silicon dioxide layer and dielectric layer to the plurality of interconnect lines.
Claim 8
Dependent Claim
21 words
The method of claim 1, wherein said baking is at a temperature in the range of 150° C. to 300° C.
Claim 9
Dependent Claim
16 words
The method of claim 1, wherein said curing is at a temperature greater than 300° C.
Claim 10
Dependent Claim
19 words
The method of claim 1, wherein said method includes forming a moisture resistant cap material above said dielectric layer.