US5514832A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microcavity structures, fabrication processes, and applications thereof
Assignee: International Business Machines Corp
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Filing: 1995-03-30
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Granted: 1996-05-07
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Expires: 2015-03-30
Abstract
Abstract A method is presented for controlled formation of microcavities for various semiconductor and micro-machine applications. The method involves the steps of defining a void in a support structure, sealing the void with a resilient gas-permeable material such that a chamber is formed, diffusing gas into the chamber through the gas permeable material to create a pressurized chamber, and then allowing expansion of the pressurized chamber within the resilient material, thereby creating an enlarged cavity. The applications set forth include the production of large capacitors, field isolation structures, tubular sensors for chromatography, pressure sensors, and cooling channels for integrated circuits.
Inventors
- 👤 Michael S. Dusablon, Sr.
- 👤 Eric J. White
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 17:53
CPC Classifications
B; B81; B81C; B81C1/00; B81C1/00015; B81C1/00023; B81C1/00047; H; H10; H10D; H10D1/00; H10D1/60; H10D1/68; H10W; H10W10/00; H10W10/01; H10W10/021; H10W10/20; H10W40/00; H10W40/40; H10W40/43; H10W40/47
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
60 words
A semiconductor structure comprising: a semiconductor substrate having a void therein; and a dielectric material disposed above said semiconductor substrate such that said dielectric material fills said void in said semiconductor substrate, said dielectric material containing a cavity therein disposed above said void in said semiconductor substrate, said cavity having a size larger than said void in said semiconductor substrate.
Claim 2
Dependent Claim
60 words
A semiconductor structure comprising: a semiconductor substrate having a void therein; and a dielectric material disposed above said semiconductor substrate such that said dielectric material fills said void in said semiconductor substrate, said dielectric material containing a cavity therein disposed above said void in said semiconductor substrate, said cavity having a size larger than said void in said semiconductor substrate.
Claim 3
Dependent Claim
13 words
The semiconductor structure of claim 1, wherein said dielectric material comprises a glass.
Claim 4
Dependent Claim
12 words
The semiconductor structure of claim 2, wherein said glass comprises borophosphosilica (BPSG).
Claim 5
Dependent Claim
23 words
The semiconductor structure of claim 1, wherein said void in said semiconductor substrate comprises a recess between two mesas in said semiconductor substrate.
Claim 6
Dependent Claim
22 words
The semiconductor structure of claim 1, wherein said cavity in said dielectric material is sized in a sub-micron to several microns range.
Claim 7
Dependent Claim
53 words
The semiconductor structure of claim 1, further comprising an active device in said semiconductor substrate disposed adjacent to said void in said semiconductor substrate such that said cavity in said dielectric material resides above said active device, and an overpassing metallization level, said cavity spacing said overpassing metallization level from said active device.
Claim 8
Dependent Claim
70 words
The semiconductor structure of claim 1, further comprising a metal plate disposed above said dielectric material such that said cavity resides between said metal plate and said semiconductor substrate, and a first electrical contact to said metal plate and a second electrical contact to said semiconductor substrate in the vicinity of said cavity such that a pressure sensor is defined between said first electrical contact and said second electrical contact.
Claim 9
Dependent Claim
56 words
The semiconductor structure of claim 1, further comprising a heat source supported by said semiconductor substrate, and wherein said cavity in said dielectric material comprises an elongated cavity having an inlet and an outlet for receiving and expelling, respectively, a cooling fluid for removal of heat generated by said heat source supported by said semiconductor substrate.
Claim 10
Dependent Claim
19 words
The semiconductor structure of claim 8, wherein said heat source comprises a metal conductor disposed above said dielectric material.
Claim 11
Dependent Claim
25 words
The semiconductor structure of claim 1, further comprising a conductive coil disposed about said cavity in said dielectric material, said conductive coil comprising an inductor.
Claim 12
Dependent Claim
66 words
The semiconductor structure of claim 10, wherein said conductive coil includes a lower pattern of conductors disposed below said cavity in said dielectric material and an upper pattern of conductors disposed above said cavity in said dielectric material, and wherein said lower pattern of conductors and said upper pattern of conductors are electrically interconnected, thereby establishing said conductive coil about said cavity in said dielectric material.
Claim 13
Dependent Claim
35 words
The semiconductor structure of claim 11, further comprising a magnetic layer within said cavity in said dielectric material, said magnetic layer affecting induction properties of said conductive coil about said cavity in said dielectric material.
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