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US5510633A Expired / Lapsed US ⏱️ 0.0 years remaining

Porous silicon light emitting diode arrays and method of fabrication

Assignee: Xerox Corp
•
Filing: 1994-06-08
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Granted: 1996-04-23
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Expires: 2014-06-08
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Abstract

Abstract A porous silicon Light Emitting Diodes (LEDs) device and method for fabricating LEDs with supporting circuits on a silicon chip or wafer for a Full Width Array in which a switch diode structure is used to form the porous silicon LED element and later drives the LED after the LED is fabricated. The LED is formed by defining an area in the switch diode for placing an LED element. Epi silicon is deposited in the defined area; and the epi silicon is electrochemical etched to produce porous silicon. This procedure creates column-like Si structures of nanometer dimension which can efficiently emit visible to infrared light at room temperature. Next, the porous silicon LED chip can be cut and butted without excessive damage. In this way, the chips bearing both LEDs and drive circuitry are made of silicon and can be cut and accurately butted by known techniques to form a low cost, high resolution Full Width LED array.

Inventors

  • 👤 Thomas E. Orlowski
  • 👤 Sophie V. Vandebroek

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 14:51
CPC Classifications
H; H10; H10H; H10H29/00; H10H29/10; Y; Y10; Y10S; Y10S438/00; Y10S438/96

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 49 words
A semiconductor Light Emitting Diode (LED) device comprising: a silicon wafer having a substrate; a switch diode formed on said silicon wafer; and a porous silicon LED formed in said substrate, wherein said porous silicon LED being electrically connected to said diode switch and electrically isolated from said substrate.
Claim 2
Dependent Claim 49 words
A semiconductor Light Emitting Diode (LED) device comprising: a silicon wafer having a substrate; a switch diode formed on said silicon wafer; and a porous silicon LED formed in said substrate, wherein said porous silicon LED being electrically connected to said diode switch and electrically isolated from said substrate.
Claim 3
Dependent Claim 17 words
The device of claim 1, further comprising supporting circuitry formed on a surface of said silicon wafer.
Claim 4
Dependent Claim 23 words
The device of claim 1, wherein said switch diode comprises: a p-n junction; and a power transistor in series with said p-n junction.
Claim 5
Dependent Claim 14 words
The device of claim 1, wherein said silicon wafer includes a plurality of chips.
Claim 6
Dependent Claim 20 words
The device of claim 4, wherein each of said plurality of chips include a plurality of said LEDs formed thereon.
Claim 7
Dependent Claim 15 words
The device of claim 5, wherein each of said plurality of LEDs are individually addressable.
Claim 8
Dependent Claim 22 words
The device of claim 1, wherein said LED comprises epitaxial silicon having column-like structures ranging from 50 to 100 nanometers in diameter.
Claim 9
Dependent Claim 22 words
The device of claim 6, wherein at least one of said plurality of chips form a full width array for printing images.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-04-23 1999-10-23 2000-04-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-04-23 2003-10-23 2004-04-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-04-23 2007-10-23 2008-04-23 $7700.00 Window Closed / Lapsed

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