Patent US5509203A successfully refreshed from Google Patents.
US5509203A
Expired / Lapsed
US
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Method for manufacturing a sheet formed connector for inspection of an integrated circuit
Assignee: NEC Corp
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Filing: 1994-07-21
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Granted: 1996-04-23
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Expires: 2014-07-21
Abstract
Abstract It is the object of the invention to provide a method for manufacturing a sheet formed connector for inspecting an integrated circuit at the state of flip-chip bonding and at low pressure condition. The method for manufacturing comprises the steps of making holes on plastic insulating sheet, which is stuck to the metallic sheet, at a certain interval in both longitudinal and lateral directions, making predetermined patterned portions on the metallic sheet by etching, and melting a solder piece in each hole.
Inventors
- 👤 Chikara Yamashita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 07:16
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07314; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3465; H05K3/3478; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09572; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10424; H05K2203/00; H05K2203/04; H05K2203/0415; H05K2203/043; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T29/49204; Y10T29/49208; Y10T29/4921; Y10T29/49211; Y10T29/49213; Y10T29/49222
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
154 words
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of: sticking a heat-resistant plastic sheet and a metallic sheet together, making circular holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet, forming patterned portions by eliminating metal on said metallic sheet except areas bounded by two concentric circles and containing peripheries of bottom surfaces of holes, forming plated layers on inner surfaces of said holes and said patterned portions respectively, fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively, and melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders, whereby a sheet formed connector is produced.
Claim 2
Independent Claim
154 words
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of: sticking a heat-resistant plastic sheet and a metallic sheet together, making circular holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet, forming patterned portions by eliminating metal on said metallic sheet except areas bounded by two concentric circles and containing peripheries of bottom surfaces of holes, forming plated layers on inner surfaces of said holes and said patterned portions respectively, fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively, and melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders, whereby a sheet formed connector is produced.
Claim 3
Independent Claim
170 words
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of: sticking a heat-resistant plastic sheet and a metallic sheet together, making holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet, forming patterned portions by eliminating metal on said metallic sheet except areas bounded by two concentric circles and containing peripheries of bottom surfaces of holes, forming plated layers on inner surfaces of said holes and said patterned portions respectively, sticking an adhesive tape on said plated layer formed on said patterned portion, fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively, removing said adhesive tape, and melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders, whereby a sheet formed connector is produced.
Claim 4
Independent Claim
170 words
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of: sticking a heat-resistant plastic sheet and a metallic sheet together, making holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet, forming patterned portions by eliminating metal on said metallic sheet except areas bounded by two concentric circles and containing peripheries of bottom surfaces of holes, forming plated layers on inner surfaces of said holes and said patterned portions respectively, sticking an adhesive tape on said plated layer formed on said patterned portion, fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively, removing said adhesive tape, and melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders, whereby a sheet formed connector is produced.
Claim 5
Independent Claim
148 words
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of: sticking a heat-resistant plastic sheet and a metallic sheet together, making holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet, forming patterned portions by eliminating metal on said metallic sheet except areas surrounding peripheries of bottom surfaces of said holes, forming plated layers on inner surfaces of said holes and said patterned portions respectively, fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively, and melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders, whereby a sheet formed connector is produced.
Claim 6
Independent Claim
148 words
A method for manufacturing a sheet formed connector for inspection of an integrated circuit, comprising the steps of: sticking a heat-resistant plastic sheet and a metallic sheet together, making holes on said heat-resistant sheet, which reach an inner surface of said metallic sheet, such that centers of said holes are positioned on lattice points assumed on a surface of said heat-resistant sheet, forming patterned portions by eliminating metal on said metallic sheet except areas surrounding peripheries of bottom surfaces of said holes, forming plated layers on inner surfaces of said holes and said patterned portions respectively, fitting rod formed solders of equal diameters and equal thicknesses relative to each other into said centers of said holes respectively, and melting said rod formed solders located in said circular holes, thereby to fill up said holes, and solidifying said melted rod formed solders, whereby a sheet formed connector is produced.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-04-23 | 1999-10-23 | 2000-04-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-04-23 | 2003-10-23 | 2004-04-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-04-23 | 2007-10-23 | 2008-04-23 | $7700.00 | Window Closed / Lapsed |