JPH066031A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Method for manufacturing printed wiring board
Assignee: Nippon CMK Corp
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Filing: 1992-06-19
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Granted: —
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Expires: 2012-06-19
Abstract
Abstract PURPOSE:To suppress the advancement of silver migration by lengthening the surface distance of a solder resist between adjacent silver jumpers. CONSTITUTION:Through holes 2 are formed on specific positions of an insulating sheet 1. Circuits 3 and lands 4 are formed on the insulating sheet 1. The circuits 3 are coated with a solder resist 5. The through holes 2 are filled up with a silver paste 6 to form silver through holes 7 whose outer surfaces are coated with a silver overcoat 8. Finally, multiple insulators 9 are formed on the silver resist 5.
Inventors
- 👤 Shin Kawakami
- 👤 伸 川上
- 👤 Junichi Ichikawa
- 👤 純一 市川
- 👤 Ko Araki
- 👤 香 新木
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 07:26
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K3/00; H05K3/22; H05K3/28; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069
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