US5495397A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Three dimensional package and architecture for high performance computer
Assignee: International Business Machines Corp
•
Filing: 1993-04-27
•
Granted: 1996-02-27
•
Expires: 2013-04-27
Abstract
Abstract A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection members to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection members can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.
Inventors
- 👤 Evan E. Davidson
- 👤 David A. Lewis
- 👤 Jane M. Shaw
- 👤 Alfred Viehbeck
- 👤 Janusz S. Wilczynski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 08:11
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H05K1/00; H05K1/02; H05K1/14; H05K1/145; H10; H10W; H10W90/00; H05K1/03; H05K1/05; H05K1/053; H05K1/056; H05K2201/00; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K2201/09654; H05K2201/09718; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/4602; H05K3/4608; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
130 words
A structure comprising: a plurality of subassemblies; each of said subassemblies comprising: a first substrate having a first side and a second side; at least one electronic device disposed on said first side and said second side; a plurality of first contact locations on said first side; a plurality of second contact locations on said second side; a plurality of second substrates; each of said subassemblies is disposed between a first one of said plurality of second substrates and a second one of said plurality of second substrates; first means for electrically interconnecting said plurality of first contact locations to said first one of said plurality of second substrates; second means for electrically interconnecting said plurality of second contact locations to said second one of said plurality of second substrates.
Claim 2
Dependent Claim
130 words
A structure comprising: a plurality of subassemblies; each of said subassemblies comprising: a first substrate having a first side and a second side; at least one electronic device disposed on said first side and said second side; a plurality of first contact locations on said first side; a plurality of second contact locations on said second side; a plurality of second substrates; each of said subassemblies is disposed between a first one of said plurality of second substrates and a second one of said plurality of second substrates; first means for electrically interconnecting said plurality of first contact locations to said first one of said plurality of second substrates; second means for electrically interconnecting said plurality of second contact locations to said second one of said plurality of second substrates.
Claim 3
Dependent Claim
26 words
A structure according to claim 1, wherein said first means and said second means are selected from the group consisting of solder mounds and wire bonds.
Claim 4
Dependent Claim
28 words
A structure according to claim 1, wherein there are a plurality of electronic devices on said first side and a plurality of electronic devices on said second side.
Claim 5
Dependent Claim
32 words
A structure according to claim 1, wherein said electronic device is a semiconductor device selected from the group consisting of a silicon integrated circuit chip and a gallium arsenide integrated circuit chip.
Claim 6
Dependent Claim
19 words
A structure according to claim 1, wherein said first substrate has electrical conductors for electrically interconnecting said electronic devices.
Claim 7
Dependent Claim
21 words
A structure according to claim 1, wherein said second substrate has electrical conductors for providing power and ground to said subassemblies.
Claim 8
Dependent Claim
39 words
A structure according to claim 1, further including a third substrate, each of said second substrates has an edge having electrical conductors at said edge, said edge is disposed in electrical communication with electrical conductors on said third substrate.
Claim 9
Dependent Claim
17 words
A structure according to claim 7, wherein said electrical conductors at said edge are electrically conducting pins.
Claim 10
Dependent Claim
22 words
A structure according to claim 7, further including a stack of memory devices in electrical communication with one of said second substrates.
Claim 11
Dependent Claim
21 words
A structure according to claim 9, further including at least one memory device disposed in electrical contact with said second substrate.
Claim 12
Dependent Claim
29 words
A structure according to claim 1, further including means for directly electrically interconnecting said at least one electronic device to at least one of said plurality of second substrates.
Claim 13
Dependent Claim
34 words
A structure according to claim 11, wherein said means for directly electrically interconnecting said at least one electronic device to said at least one of said plurality of second substrates is a solder mound.
Claim 14
Dependent Claim
160 words
A structure comprising: a plurality of subassemblies; each of said subassemblies comprises a first substrate having a first side and a second side, a first at least one logic electronic device being disposed on said first side, a second at least one electronic devices being disposed on said second side, said first substrate has electrical conductors for electrical interconnection to said first and said second, said first substrate has a plurality of first contact locations; a plurality of second substrates, each having an end; said subassemblies are disposed between said second substrates; said second substrates have a plurality of second contact locations; said first contact locations are disposed adjacent said second contact locations; a means for providing electrical interconnection between said second substrates and said first substrates; a third substrate; said ends of said second substrates being disposed adjacent said third substrates; means for providing electrical interconnection of electrical conductors at said ends with electrical conductors in said third substrate.
Claim 15
Dependent Claim
160 words
A structure comprising: a plurality of subassemblies; each of said subassemblies comprises a first substrate having a first side and a second side, a first at least one logic electronic device being disposed on said first side, a second at least one electronic devices being disposed on said second side, said first substrate has electrical conductors for electrical interconnection to said first and said second, said first substrate has a plurality of first contact locations; a plurality of second substrates, each having an end; said subassemblies are disposed between said second substrates; said second substrates have a plurality of second contact locations; said first contact locations are disposed adjacent said second contact locations; a means for providing electrical interconnection between said second substrates and said first substrates; a third substrate; said ends of said second substrates being disposed adjacent said third substrates; means for providing electrical interconnection of electrical conductors at said ends with electrical conductors in said third substrate.
References Cited (Backward Citations)
US2929965A
Cited
US3437882A
Cited
US4054939A
Cited
FR2357072A1
Cited
US4646128A
Cited
US4371912A
Cited
US4574331A
Cited
US5082802A
Cited
US4695872A
Cited
US4868712A
Cited
US4774632A
Cited
US4901136A
Cited
US5025306A
Cited
US4956694A
Cited
US4998180A
Cited
US5006925A
Cited
US5099309A
Cited
EP0457313A1
Cited
EP0489643A1
Cited
US5241454A
Cited
EP0559366A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-26 | 1999-08-28 | 2000-02-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-26 | 2003-08-28 | 2004-02-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-26 | 2007-08-28 | 2008-02-27 | $7700.00 | Window Closed / Lapsed |