Assembly group, in particular for data technology

Abstract

Abstract For general-purpose computers with high throughputs, the manufacture of assemblies is becoming increasingly difficult because of their large number of layers and the high performance required in a small space. To achieve an optimum space/performance ratio in such assemblies, the invention provides for a multilayer printed circuit board (1) manufactured by the standard lamination technique and having several potential and signal layers to be connected on both sides via pressure contacts (2) to further printed circuit boards (3) built up using microminiature circuit technology. Mounted on the rear sides of said printed circuit boards (3) are the unencapsulated integrated modules (4) (chips) which are needed for a specific electrical circuit and whose surfaces are in direct contact with cooling plates (5). <IMAGE>

Inventors

• 👤 Hermann Dipl.-Ing. Wessely
• 👤 Otmar Dipl.-Ing. Fritz

Bibliographic Details