EP0332747A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Tape automated bonding package
Assignee: International Business Machines Corp
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Filing: 1988-11-09
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Granted: —
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Expires: 2008-11-09
Abstract
Abstract The disclosure describes a new and improved Tape Automated Bonding package which admits of certain advantages that are not available with the packages as used in the past, and it overcomes some limitations with the previous packages which permits a significant step forward in realizing these advantages. Briefly, the disclosure describes a division of the dielectric support (41) used to package integrated circuit chips (41a) in order to separate the power conductors (40) and the signal conductors (55) into different parts of the support. The conductors formed on at least one of these parts, preferably the part used to connect input/output signals to and from a chip, are arranged in radially extending rows to achieve more than twice the number of such connections.
Inventors
- 👤 Keith Alan Snyder
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 23:45
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W70/62; H10W70/63; H10W70/635; H10W70/65; H10W70/67; H10W70/688; H10W90/00; H10W90/401
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
139 words
A Tape Automated Bonding package to obtain connections for packaging an integrated circuit chip, comprising: a dielectric support means (41) for attaching a chip (16, 41a) having active components premounted on a substrate with electrical connections terminating in pads (20b) arranged in a predetermined pattern, said dielectric support means are divided in two parts (40, 55) formed with separate electrical conductors for bonding with said pads, said conductors formed on one part (55) of said support means (41) are arranged in a predetermined pattern that extends radially from a point of bonding to said integrated circuit chip to conduct I/O signals to and from said chip, and said conductors formed on said second part (40) of said support means (41) are arranged with terminals positioned for bonding with predetermined pads on said chip to conduct power to said chip.
Claim 2
Dependent Claim
139 words
A Tape Automated Bonding package to obtain connections for packaging an integrated circuit chip, comprising: a dielectric support means (41) for attaching a chip (16, 41a) having active components premounted on a substrate with electrical connections terminating in pads (20b) arranged in a predetermined pattern, said dielectric support means are divided in two parts (40, 55) formed with separate electrical conductors for bonding with said pads, said conductors formed on one part (55) of said support means (41) are arranged in a predetermined pattern that extends radially from a point of bonding to said integrated circuit chip to conduct I/O signals to and from said chip, and said conductors formed on said second part (40) of said support means (41) are arranged with terminals positioned for bonding with predetermined pads on said chip to conduct power to said chip.
Claim 3
Dependent Claim
133 words
A Tape Automated Bonding package to obtain connections for packaging an integrated circuit chip (16, 41a), comprising: first dielectric means (10) for supporting lands (21, 22, 23, 24) of electrically conductive material in a predetermined pattern with terminals (20) for bonding to said integrated circuit chip (16, 41a), and defining openings (17, 18) therein; second dielectric means (30) for supporting a pattern of electrically conductive leads (38) with ends (39) for bonding to pads (20b) on said integrated circuit chip, and defining openings (35, 36) over which said ends extend; and power distribution panel means (40), separate from said first (10) and second (30) dielectric means, for supplying power to said integrated circuit chip (16, 41a) through said lands (21, 22, 23, 24) of electrically conductive material supported by said first dielectric means.
Claim 4
Dependent Claim
133 words
A Tape Automated Bonding package to obtain connections for packaging an integrated circuit chip (16, 41a), comprising: first dielectric means (10) for supporting lands (21, 22, 23, 24) of electrically conductive material in a predetermined pattern with terminals (20) for bonding to said integrated circuit chip (16, 41a), and defining openings (17, 18) therein; second dielectric means (30) for supporting a pattern of electrically conductive leads (38) with ends (39) for bonding to pads (20b) on said integrated circuit chip, and defining openings (35, 36) over which said ends extend; and power distribution panel means (40), separate from said first (10) and second (30) dielectric means, for supplying power to said integrated circuit chip (16, 41a) through said lands (21, 22, 23, 24) of electrically conductive material supported by said first dielectric means.
Claim 5
Dependent Claim
60 words
A Tape Automated Bonding package according to claim 2 wherein said openings (17, 18) defined by said first dielectric means (10) are located relative to said openings (35, 36) defined by said second dielectric means (30) so that access to said lead ends (39) extending there over is available for bonding to corresponding pads (20b) on said integrated circuit chip.
Claim 6
Dependent Claim
69 words
A Tape Automated Bonding package according to one of the preceding claims 2 or 3 including a multilayer printed circuit panel (55) for providing support for said second dielectric means (30) so that a package (41) will comprise, in order, said multilayer printed circuit panel (55), said second dielectric means (30), said first dielectric means (10), said integrated circuit chip (16, 41a), and said power distribution panel means (40).
Claim 7
Dependent Claim
89 words
A Tape Automated Bonding package according to one of the preceding claims 2 to 4 including two multilayer printed circuit panels (40, 55), one (55) of said multilayer printed circuit panels being located for providing support for said second dielectric means (30); and the other of said two multilayer printed circuit panels being formed by said power distribution panel means (40), so that said integrated circuit chip (16, 41a) is located between said two multilayer printed circuit panels to provide separation between power distribution means and input/output signal means.
Claim 8
Dependent Claim
74 words
A Tape Automated Bonding package according to one of the preceding claims 2 to 5 wherein said power distribution panel means (40) is formed of multilayers with lands of electrically conductive material (42, 44, 46, 48) separated by electrically non-conductive material (43, 45, 47), and means (25, 26, 27, 28) for connecting predetermined lands on said power distribution panel means to predetermined (21, 22, 23, 24) lands supported by said first dielectric means (10).
Claim 9
Dependent Claim
46 words
A Tape Automated Bonding package according to one of the preceding claims 2 to 6 including means (51-54, 57) to form electrical connections between predetermined lands (42, 44, 46, 48) on said power distribution means (40) and predetermined lands supported by said first dielectric means (10).
Claim 10
Dependent Claim
66 words
A Tape Automated Bonding package according to claim 7 wherein said means to form electrical connections includes readily detachable connection means, preferably pin (51) and spring receptacle means (52) or spring contact means (53) attached to a land supported by said first dielectric means (10) located to form an electrical contact with terminal means (54) attached to a land on said power distribution panel means (40).
Claim 11
Dependent Claim
89 words
A Tape Automated Bonding package according to one of the preceding claims 2 to 8 wherein said lands (21-24) of electrically conductive material supported by said first dielectric means (10) includes parts (25-28) extending over the edge (11, 12) of said dielectric material and bent in the direction of said power distribution panel (40) for bonding to predetermined lands on said power distribution panel so that said lands supported by said first dielectric means perform as power connections between said power distribution panel means and said integrated circuit chip.
References Cited (Backward Citations)
No citation records indexed.
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