Patent JPS6146601A successfully refreshed from Google Patents.
Patent US5495395A successfully refreshed from Google Patents.
US5495395A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Face-mounting type module substrate attached to base substrate face to face
Assignee: Panasonic Holdings Corp
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Filing: 1992-09-24
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Granted: 1996-02-27
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Expires: 2012-09-24
Abstract
Abstract A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.
Inventors
- 👤 Takehiko Yoneda
- 👤 Masahiro Yoshimoto
- 👤 Yoshihiko Takayama
- 👤 Tetsjhi Tsujhi
- 👤 Hiromitsu Taki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 15:57
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K3/3421; H05K3/3426; H05K1/0213; H05K1/0237; H05K1/0243; H05K1/0271; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/09; H05K2201/09009; H05K2201/09045; H05K3/3442; H05K3/36; H05K3/368; H05K3/40; H05K3/4038; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
172 words
A face-mounting type module substrate, comprising: a module substrate mounting first electronic parts on a front surface thereof; a through hole penetrating the module substrate from the front surface to its reverse surface; a conductive film placed in the through hole for electrically conducting the first electronic parts of the module substrate to the reverse surface of the module substrate; attaching means made of a thin film having conductivity for attaching the conductive film to a base substrate movably contacting the reverse surface of the module substrate to electrically connect the first electronic parts of the module substrate with second electronic parts of the base substrate, the module substrate being directly mounted on the base substrate face to face; and a bushing held in the through hole for holding the conductive film to maintain the attachment of the conductive film to the base substrate regardless of whether the base substrate is moved, the bushing being made of resin with plasticity, and the conductive film being coated on a surface of the bushing.
Claim 2
Dependent Claim
172 words
A face-mounting type module substrate, comprising: a module substrate mounting first electronic parts on a front surface thereof; a through hole penetrating the module substrate from the front surface to its reverse surface; a conductive film placed in the through hole for electrically conducting the first electronic parts of the module substrate to the reverse surface of the module substrate; attaching means made of a thin film having conductivity for attaching the conductive film to a base substrate movably contacting the reverse surface of the module substrate to electrically connect the first electronic parts of the module substrate with second electronic parts of the base substrate, the module substrate being directly mounted on the base substrate face to face; and a bushing held in the through hole for holding the conductive film to maintain the attachment of the conductive film to the base substrate regardless of whether the base substrate is moved, the bushing being made of resin with plasticity, and the conductive film being coated on a surface of the bushing.
Claim 3
Dependent Claim
15 words
A face-mounting type module substrate according to claim 1 in which the bushing is cylinder-shaped.
Claim 4
Dependent Claim
36 words
A face-mounting type module substrate according to claim 1 in which the conductive film coated on the surface of the bushing is made of a conductive material selected from the group of copper, gold and silver.
Claim 5
Dependent Claim
43 words
A face-mounting type module substrate according to claim 1 in which the module substrate is made of dielectric ceramic material selected from the group consisting of Al 2 O 3 , Ba 2 Ti 9 O 20 , aluminum enamel, and quartz polyimide.
Claim 6
Dependent Claim
30 words
A face-mounting type module substrate according to claim 1 in which the resin of the bushing is selected from the group consisting of fluorocarbon resin, polyimide, and liquid crystal polymer.
Claim 7
Dependent Claim
18 words
A face-mounting type module substrate according to claim 1 in which the attaching means is a conductive solder.
Claim 8
Dependent Claim
68 words
A face-mounting type module substrate according to claim 1 in which the conductive film is composed of a mediate film coated on the surface of the bushing and a conductive film coated on the mediate film, a material of the mediate film being selected from the group of chromium and nickel, and a material of the conductive film being selected from the group of copper, gold and silver.
Claim 9
Dependent Claim
67 words
A face-mounting type module substrate according to claim 1 wherein the bushing has a property of plastic deformation so that a stress occurring through the attaching means between the module substrate and the base substrate resulting from the cooling down of the module substrate and the base substrate subsequent to both substrates having been heated to attach to each other is absorbed and released by the bushing.
Claim 10
Dependent Claim
181 words
A face-mounting type module substrate, comprising: a module substrate having mounted on a front surface thereof first electronic parts; a through hole penetrating the module substrate from the front surface to its reverse surface; a conductive film placed in the through hole for electrically conducting the first electronic parts of the module substrate to the reverse surface of the module substrate; attaching means made of a thin film having conductivity for attaching the conductive film to a base substrate movably contacting with the reverse surface of the module substrate to electrically connect the first electronic parts of the module substrate with second electronic parts of the base substrate, the module substrate being directly mounted on the base substrate face to face, and the module substrate being attached to the base substrate through the attaching means by hardening the heated thin film; and a bushing held in the through hole for holding the conductive film, the bushing being made of resin with plasticity so as to be plastically deformable for absorbing a stress occurring between the module substrate and the base substrate.
Claim 11
Dependent Claim
181 words
A face-mounting type module substrate, comprising: a module substrate having mounted on a front surface thereof first electronic parts; a through hole penetrating the module substrate from the front surface to its reverse surface; a conductive film placed in the through hole for electrically conducting the first electronic parts of the module substrate to the reverse surface of the module substrate; attaching means made of a thin film having conductivity for attaching the conductive film to a base substrate movably contacting with the reverse surface of the module substrate to electrically connect the first electronic parts of the module substrate with second electronic parts of the base substrate, the module substrate being directly mounted on the base substrate face to face, and the module substrate being attached to the base substrate through the attaching means by hardening the heated thin film; and a bushing held in the through hole for holding the conductive film, the bushing being made of resin with plasticity so as to be plastically deformable for absorbing a stress occurring between the module substrate and the base substrate.
Claim 12
Dependent Claim
51 words
A face-mounting type module substrate according to claim 9 in which the stress occurring between the module substrate and the base substrate is caused by the module substrate and the base substrate being cooled down subsequent to both substrates having been heated to attach to each other through the attaching means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-26 | 1999-08-28 | 2000-02-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-26 | 2003-08-28 | 2004-02-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-26 | 2007-08-28 | 2008-02-27 | $7700.00 | Window Closed / Lapsed |