US4333102A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High performance semiconductor component with heat dissipating discs connected by brushlike bundles of wires
Assignee: BBC Brown Boveri AG Switzerland
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Filing: 1979-12-18
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Granted: 1982-06-01
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Expires: 1999-12-18
Abstract
Abstract On the two main surfaces of a semiconductor disc of a large diameter, high-performance semiconductor component, there are soldered one bundle each of metal wires. The other ends of the metal wires are soldered to heat dissipating discs. The metal wires, with increasing distance from the center, are of increasing lengths in order to absorb the differences in the thermal expansion of the semiconductor disc and the heat dissipating discs. Metal ring portions and a ceramic housing complete the semiconductorcomponent. A secure and desirable contact of the semiconductor discs is achieved without the application of pressure.
Inventors
- 👤 Alfred Jester
- 👤 Elmar Mueller
- 👤 Hubert Holick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 00:41
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H10W72/00; H10W72/071; H10W72/075; H10W76/40; H10W76/42; H10W76/47; H10W72/50; H10W72/521; H10W72/522; H10W72/551; H10W72/552; H10W72/5525; H10W74/00
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
147 words
A high-performance semiconductor component with a semiconductor disc, having at least one pn-junction, with thermically and electrically conductive heat dissipating discs in the main current and thermal paths connected to the corresponding contact surfaces of said semiconductor disc by means of equally thermically and electrically conductive disc-shaped metal contacts, each metal contact consisting of a brushlike bundle of individual wires, each of said wires being coated with a suitable insulating material and bonded individually to said semiconductor disc and said heat dissipating discs, respectively, and an insulating housing surrounding the disc-rim of said semiconductor disc, wherein the improvement comprises: each bundle is pre-twisted in relation to a geometric central axis running vertically to the main two surfaces of said semiconductor disc and at least some of said individual wires are longer than the length corresponding to the distance between the two disc surfaces of the metal contact.
Claim 2
Dependent Claim
147 words
A high-performance semiconductor component with a semiconductor disc, having at least one pn-junction, with thermically and electrically conductive heat dissipating discs in the main current and thermal paths connected to the corresponding contact surfaces of said semiconductor disc by means of equally thermically and electrically conductive disc-shaped metal contacts, each metal contact consisting of a brushlike bundle of individual wires, each of said wires being coated with a suitable insulating material and bonded individually to said semiconductor disc and said heat dissipating discs, respectively, and an insulating housing surrounding the disc-rim of said semiconductor disc, wherein the improvement comprises: each bundle is pre-twisted in relation to a geometric central axis running vertically to the main two surfaces of said semiconductor disc and at least some of said individual wires are longer than the length corresponding to the distance between the two disc surfaces of the metal contact.
Claim 3
Dependent Claim
21 words
A high-performance semiconductor component as claimed in claim 1, wherein the individual wires are coated with a slip layer of carbon.
Claim 4
Dependent Claim
46 words
A high-performance semiconductor component as claimed in claim 1, wherein one bundle of said individual wires connected to one of the main surfaces of the semiconductor disc is pre-twisted in an opposite direction to the bundle connected to the other main surface of the semiconductor disc.
Claim 5
Dependent Claim
34 words
A high-performance semiconductor component as claimed in claim 1, wherein the bundle is twisted with about two twists to a length of about 1 meter, in relation to an uncut cable of parallel wires.
Claim 6
Dependent Claim
20 words
A high-performance semiconductor component as claimed in claim 1, wherein each bundle consists of stranded wires that are individually pre-twisted.
Claim 7
Dependent Claim
26 words
A high-performance semiconductor component as claimed in claim 1, wherein interstices between the individual wires are filled with a highly elastic filler material of expanded foam.
Claim 8
Dependent Claim
17 words
A high-performance semiconductor component as claimed in claim 6, wherein the filler material consists of silicon caoutchouc.
References Cited (Backward Citations)
US2906930A
Cited
US3273029A
Cited
US3295089A
Cited
US3387191A
Cited
US3675089A
Cited
US3969754A
Cited
US4067104A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-05-31 | 1985-11-30 | 1986-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-05-31 | 1989-11-30 | 1990-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-05-31 | 1993-11-30 | 1994-06-01 | $7700.00 | Window Closed / Lapsed |