Semiconductor device

Claim 1

IN COMBINATION IN A SEMICONDUCTOR TRANSMISSION DEVICE, A WAFER MEMBER OF SEMICONDUCTIVE MATERIAL, A BASE MEMBER OF AN ELECTRICAL AND THERMAL CONDUCTIVE MATERIAL, AN INTERMEDIATE CONNECTION BETWEEN SAID WAFER AND BASE MEMBERS COMPRISING A PLURALITY OF WIRE CONDUCTORS AND MEANS FOR MAINTAINING SAID WIRE CONDUCTORS IN COMPRESSED RELATIONSHIP TO EACH OTHER, MEANS FOR ATTACHING ONE END OF EACH OF THE COMPRESSED WIRE CONDUCTORS TO SAID BASE MEMBER IN THERMAL AND ELECTRICAL CONDUCTION RELATION THEREWITH AND EACH OF THE OTHER ENDS OF THE COMPRESSED CONDUCTORS TO A SELECTED AREA ON THE SURFACE OF SAID SEMICONDUCTIVE MATERIAL, SAID CONDUCTORS BEING SEPARATE FROM EACH OTHER BETWEEN THE ATTACHED ENDS THEREOF AND FREE TO MOVE INDIVIDUALLY WITH THE THERMAL EXPANSION AND CONTRACTION OF THE COMPONENT PARTS OF SAID DEVICE DURING TRANSMISSION USE THEREBY WITH THE ABSENCE OF INTRODUCING MECHANICAL STRESSES TO PREVENT APPRECIABLE CHANGE OF THE ELECTRICAL PERFORMANCE AND PHYSICAL CHARACTERISTICS OF THE DEVICE.