US3176382A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making semiconductor devices
Assignee: Motorola Solutions Inc
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Filing: 1963-02-27
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Granted: 1965-04-06
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Expires: 1983-02-27
Abstract
No abstract record available.
Inventors
- 👤 Jr Donald C Dickson
- 👤 Robert M Bird
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-22 18:53
CPC Classifications
H; H10; H10W; H10W72/00; H10P; H10P14/00; H10P14/40; H10P14/46; H10P72/00; H10P72/04; H10P72/0438; H10P95/00; H10W72/20; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/136; H10W76/40; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
186 words
A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE INCLUDING THEREIN A MOUNTING BASE AND A HOLLOW MEMBER MAINTAINED WITH SAID BASE IN THE ASSEMBLED FINISHED DEVICE WHICH COMPRISES, PLACING SAID HOLLOW MEMBER ON SAID MOUNTING BASE FOR THE SEMICONDUCTOR DEVICE, WITH SAID HOLLOWO MEMBER HAVING AN OPENING EXTENDING ENTIRELY THERETHROUGH AND PORTIONS ABOUT SAID OPENING FOR GUIDING A SEMICONDUCTOR DIE UPON PLACING THE SAME IN SAID OPENING RETAINING SAID HOLLOW MEMBER RELATIVE TO SAID MOUNTING BASE SO THAT A SELECTED PORTION OF SAID BASE IS ACCESSIBLE THROUGH SAID OPENING, PLACING A SEMICONDUCTOR DIE WITH SOLDER ON OPPOSITE SIDES THEREOF IN SAID OPENING, WITH SAID HOLLOW MEMBER SERVING AS A GUIDE IN THE PLACEMENT OF SAID DIE IN ALIGNMENT WITH SAID SELECTED PORTION OF SAID MOUNTING BASE FOR CONNECTION OF ONE SIDE OF SAID DIE TO SAID BASE, PLACING AND RETAINING A CONNECTOR IN SAID OPENING WITH A PORTION THEREOF IN ALIGNMENT WITH SAID DIE FOR CONNECTION TO THE OTHER SIDE THEREOF, AND SUBSEQUENTLY SUBJECTING THE RESULTING ASSEMBLY TO A HEATING CYCLE SUCH THAT SAID DIE IS CONNECTED TO SAID BASE AND TO SAID CONNECTOR BY SAID SOLDER.
Claim 2
Independent Claim
186 words
A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE INCLUDING THEREIN A MOUNTING BASE AND A HOLLOW MEMBER MAINTAINED WITH SAID BASE IN THE ASSEMBLED FINISHED DEVICE WHICH COMPRISES, PLACING SAID HOLLOW MEMBER ON SAID MOUNTING BASE FOR THE SEMICONDUCTOR DEVICE, WITH SAID HOLLOWO MEMBER HAVING AN OPENING EXTENDING ENTIRELY THERETHROUGH AND PORTIONS ABOUT SAID OPENING FOR GUIDING A SEMICONDUCTOR DIE UPON PLACING THE SAME IN SAID OPENING RETAINING SAID HOLLOW MEMBER RELATIVE TO SAID MOUNTING BASE SO THAT A SELECTED PORTION OF SAID BASE IS ACCESSIBLE THROUGH SAID OPENING, PLACING A SEMICONDUCTOR DIE WITH SOLDER ON OPPOSITE SIDES THEREOF IN SAID OPENING, WITH SAID HOLLOW MEMBER SERVING AS A GUIDE IN THE PLACEMENT OF SAID DIE IN ALIGNMENT WITH SAID SELECTED PORTION OF SAID MOUNTING BASE FOR CONNECTION OF ONE SIDE OF SAID DIE TO SAID BASE, PLACING AND RETAINING A CONNECTOR IN SAID OPENING WITH A PORTION THEREOF IN ALIGNMENT WITH SAID DIE FOR CONNECTION TO THE OTHER SIDE THEREOF, AND SUBSEQUENTLY SUBJECTING THE RESULTING ASSEMBLY TO A HEATING CYCLE SUCH THAT SAID DIE IS CONNECTED TO SAID BASE AND TO SAID CONNECTOR BY SAID SOLDER.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1968-04-05 | 1968-10-05 | 1969-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1972-04-05 | 1972-10-05 | 1973-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1976-04-05 | 1976-10-05 | 1977-04-06 | $7700.00 | Window Closed / Lapsed |